在半導體封裝製程中，以銲線及封膠製程所投入的設備及成本最大；相對的，其製程的安排亦主導著封裝的品質、成本與交貨速度，若排程或派工決策不良，則將導致資源的浪費，與製程瓶頸的產生，因此在有效的資源分配的前提下，管理者必須即時分配資源以應付產品快速轉換的需求，進而達到最適的排程與派工規劃。
為達到以上之目的，本研究大略介紹一些啟發式搜尋法（Heuristic Search），其中並詳細說明禁忌搜尋法（Tabu Search）。禁忌搜尋法是一種常用的啟發式搜尋法，其主要精神在於利用禁忌串列（Tabu List）記錄最近幾個移動（Move），避免搜尋過程中，重複相同的路徑或形成迴圈（Cycle）。其步驟由一個起始解（Initial Solution）開始，在每次的鄰近解搜尋中移動到未被禁忌限制住的最佳鄰近解，直到滿足終止條件而停止移動。
最後本研究設計一實例求解半導體封裝之銲線及封膠的排程，依禁忌搜尋法求其最適解，並驗證其在一定的時間內所生產的產品數量大於傳統先進先出所從事生產的產品數量，依此證明將禁忌搜尋法引用於彈性流程式的生產線有不錯的效果。

Wire Bonder and Molding are the most costive equipments in the investment of IC packaging; and the packaging quality, cost and delivery are concerned most in the assembly processes. An inappropriate process scheduling may result in the wastes of resources and assembly bottleneck. Manager must allocate the resources appropriately to adapt the changeable products and production lines.
We would introduce several heuristic search methods, especially the Tabu search. Tabu search is one of the most popular methods of heuristic search. We also use Tabu list to record several latest moves and avoid to the duplication of the paths or loops. It starts from an initial solution and keep moving the solution to the best neighborhood without stock by Tabu. The iterations would be repeated until the terminating condition is reached.
At last of the report, an example will be designed to approach the best wire bonding and molding scheduling by Tabu search; and verify the output volume is more than those with FIFO in the same period of production time.
Tabu search will be then confirmed to be effective for flexible flow shop.

第一章 緒論
第一節 研究背景與動機
第二節 研究目的範圍
第三節 研究流程
第四節 論文架構

第二章 文獻探討
第一節 半導體製程
第二節 半導體封裝製程
第三節 半導體封裝產業之特性
第四節 半導體封裝廠之接單模式與生產管理
第五節 半導體封裝之排程
第六節 半導體封裝排程之解法
第七節 半導體封裝排程之啟發規劃

第三章 禁忌搜尋法之架構與建構方式
第一節 禁忌搜尋法
第二節 平行禁忌搜尋法
第三節 禁忌搜尋法之效率的改善
第四節 假設與說明
第五節 搜尋過程之修改
第六節 實例運算邏輯規則說明

第四章 禁忌搜尋法之探討與資料分析
第一節 以先進先出法求最適解
第二節 禁忌搜尋系統的搜尋過程及求最適解
第三節 探討與分析

第五章 結論與建議
第一節 研究成果與結論
第二節 後續研究與建議

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