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博碩士論文 etd-0103103-004059 詳細資訊
Title page for etd-0103103-004059
論文名稱
Title
液相燒結微波介電陶瓷及微波元件之研製
The Study and Fabrication of Liquid Phase Sintering Microwave Dielectric Ceramics and Microwave Devices
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
118
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2002-12-26
繳交日期
Date of Submission
2003-01-03
關鍵字
Keywords
共振頻率溫度係數、微帶陶瓷天線、藍芽系統、液相燒結、品質因數、燒結促進劑
liquid phase sintering, quality factor, bluetooth system, microstrip ceramic antenna, sintering aid, temperature coefficient of resonant frequency
統計
Statistics
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The thesis/dissertation has been browsed 5837 times, has been downloaded 21 times.
中文摘要
近年來,快迅發展的無線通訊系統滿足了個人通訊之需求。對於現今無線通訊元件的訴求是:價格低廉、小型化及多功能化。關於元件小型化而言,高介質陶瓷材料的使用,能有效縮小微波元件的尺寸。
本論文包括兩大部份:微波介電材料的研究和微帶陶瓷天線的製作。論文的第一部份,完整地探討BiNbO4系列材料[包括(Bi1-xSmx) NbO4],和Al2O3-TiO2陶瓷材料之微結構與微波介電特性。BiNbO4陶瓷材料,能夠藉由CuO或V2O5燒結促進劑的添加,在低於940℃的溫度下進行有效的燒結。實驗結果顯示,過量的燒結促進劑或過高的燒結溫度,會造成微波介電特性的下降,其中包括品質因數(Q)和共振頻率溫度係數(τf);從而得到燒結促進劑的最佳含量為0.5 wt%。針對BiNbO4陶瓷而言,因為CuO的添加會使BiNbO4陶瓷呈負溫度係數,而V2O5的添加會使BiNbO4陶瓷呈正溫度係數。所以BiNbO4陶瓷可藉由CuO和V2O5的同時添加,且控制CuO/V2O5重量比使其τf值達到0 ppm/℃。另外,我們也研究利用Sm元素來取代Bi元素,而使τf值趨近0 ppm/℃的目的。在(BixSm1-x)NbO4材料的燒結過程中,斜方體的α相會轉變為三斜體的β相,這個β相的出現對於材料晶粒成長、密度、Q×f值及τf值有很大的影響,但對εr值的影響卻不大。綜合而論,在BiNbO4系列的研究中,可獲得高介質、高品質因數和溫度穩定的微波介電陶瓷材料。
關於(1-x)Al2O3-xTiO2材料,藉由MCAS玻璃的添加,可將燒結溫度由1500℃降到1300℃。另外,控制組成中TiO2含量和燒結溫度,可使材料的τf值趨近於0 ppm/℃。在燒結過程中,Al2TiO5晶相的產生將伴隨TiO2含量的減少,導致對材料微波介電特性有深遠的影響。就此研究而言,燒結溫度的下降及τf值的改善是主要進展。研究顯示,當2 wt%的MCAS玻璃加入於x = 0.12的組成中,且燒結溫度在1300℃時,有最小的τf值,其值為-0.6 ppm/℃。
論文第二部份則以BiNbO4微波介電陶瓷為基板,進行微帶天線的研製。雖然元件尺寸被縮小,但過窄的頻寬卻無法適用於WLAN系統。於是我們利用二種方法來擴展頻寬,第一種方法是在幅射金屬層上挖一對U型的槽孔,可將原本 2.3%的頻寬改善至5.3%。第二種方法是利用堆疊結構,可將頻寬改善至4.5%。這兩種方法都是藉由結合鄰近兩個共振模態,來達成頻寬擴展的目的。

Abstract
Recently, the evolutions of wireless communication systems are growing rapidly to satisfy the personal communication requirements. Compact, small size, low cost, and multi-function are the major developing trends among these modern wireless communication devices. The use of ceramic materials with high permittivity can effectively reduce the sizes of microwave devices.
This thesis consists of two parts: the research of microwave dielectric materials and the implementation of microstrip ceramic antennas. In the first part of the dissertation, the systematic investigations of the microstructure and microwave dielectric properties in respect of BiNbO4-based ceramics and MCAS glass-added Al2O3-TiO2 ceramics have presented. By the addition of CuO, V2O5, or CuO-V2O5 mixture, the BiNbO4 ceramics can be densified at lower sintering temperatures less than 940℃. The excellent microwave dielectric properties are obtained as 0.5 wt% CuO or V2O5 are added as sintering aids. The exceeded additive amount or sintering temperatures will result in the appearance of abnormal grain growth and the increase of grain boundary inclusions, which will decrease the microwave dielectric properties including the quality factor (Q) and the temperature coefficient of resonant frequency (τf). The CuO-added BiNbO4 ceramics reveal a negative τf value and V2O5-added BiNbO4 ceramics reveal a positive one. The τf values can be reduced to near 0 ppm/℃ by controlling the weight ratio of CuO/V2O5. Another method to reduce the τf values to near 0 ppm/℃ is the substitution of Sm for Bi. For the (Bi1-xSmx)NbO4 ceramics, the presence of the β-form of (Bi1-xSmx)NbO4 ceramics will affect the grain growth, density, Q×f values and τf values, but that has no apparent effect on εr values. On the whole, a high permittivity, an acceptable quality factor, and the temperature stable BiNbO4-based ceramic can be obtained.
As for (1-x)Al2O3-xTiO2 ceramics, the addition of MCAS glass can lower the sintering temperatures of (1-x)Al2O3-xTiO2 ceramics from 1500℃ to 1300℃. And the τf value can be adjusted to near zero by controlling the TiO2 content and sintering temperature. The appearance of Al2TiO5 phase, resulted from the consumption of TiO2, exhibits intense effect on the microwave dielectric properties of (1-x)Al2O3 -xTiO2 ceramics. The major contributions in this research would be the lower sintering temperatures and the near 0 ppm/℃ of τf value. The 2wt%- MCAS-added (1-x)Al2O3-xTiO2 ceramics sintered at 1300℃ and x = 0.12 has a minimum τf value of –0.6 ppm/℃.
In the second part of the dissertation, the microstrip antennas with high permittivity BiNbO4 ceramics (εr = 43) substrate are fabricated. The bandwidths obtained are narrow and insufficient for the WLAN application. The techniques of U-slots patch and stacked structure are used to enhance the bandwidth of the microstrip ceramic antennas by combining the two adjacent resonant modes. The results indicate that the impedance bandwidth can be enhanced from 2.3% to 5.3% by embedding double U-shaped slots in the rectangular patch, or to 4.5% by using stacked patches.

目次 Table of Contents
Contents
Chapter 1 General Introduction…1
1-1 Introduction…1
1-2 Objectives and Thesis Organization…5
Chapter 2 Theory…7
2-1 Liquid Phase Sintering…7
2-2 Dielectric Properties of Materials…9
2-3 Electromagnetic Theory…12
2-4 Microstrip Transmission Lines…16
Chapter 3 Experimental Procedure…20
3-1 Specimens Preparation…20
3-1-1 Preparation of BiNbO4 and (Bi1-xSmx)NbO4 compositions…20
3-1-2 Preparation of (1-x)Al2O3-xTiO2 composition…20
3-2 Characteristics Analysis…21
3-3 Measurement of Microwave Dielectric Properties…21
3-3-1 Calculation of dielectric constant (εr)…22
3-3-2 Measurement of Q values…23
3-3-3 Measurement of τf values…24
Chapter 4 Results and Discussion…26
4-1 BiNbO4 Ceramics…26
4-1-1 Microstructure analysis…26
4-1-2 Microwave dielectric properties analysis…30
4-2 (Bi1-xSmx)NbO4 Ceramics…32
4-2-1 Microstructure analysis…32
4-2-2 Microwave dielectric properties analysis…35
4-3 (1-x)Al2O3-xTiO2 Ceramics…37
4-3-1 Microstructure analysis…37
4-3-2 Microwave dielectric properties analysis…40
4-4 Summary…43
Chapter 5 Microstrip Antenna Applications…46
5-1 Introduction…46
5-2 U-slot Patch Antenna…47
5-2-1 Antenna design…47
5-2-2 Results and discussion…48
5-3 Stacked Patch Antenna…50
5-3-1 Antenna design…50
5-3-2 Results and discussion…50
Chapter 6 Conclusion…52
References…56

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