本論文研究的目的為利用覆晶技術製作陣列雷射模組之製程。雷射模組以錫球、V槽、矽基板及多模光纖完成。陣列雷射模組製程參數為時間及壓力，在製程中量測錫球之偏移量及其耦光效率，來瞭解製程參數對雷射模組耦合效率之影響。由實驗結果得知，結合時間在20秒及結合荷重為10g時，雷射模組可以得到較高的良率。在實驗中，四個雷射之陣列模組最高耦合效率為56%。本論文同時以簡易的耦光模型探討耦光損失。

We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183℃) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of 56% to cleaved 62.5/125μm multimode fiber ribbons. The optimum fabrication parameters were bonding time of 20 seconds and bonding load of 10g. The average misalignments were measured to be 1μm and 5μm for X and Y directions , respectively.

中文摘要 I
英文摘要 II
誌謝 III
內容目錄 IV
圖表目錄 VI
第一章 緒論 1
1-1 研究背景 1
1-2 研究目的 2
1-3 論文架構 3
第二章 覆晶技術原理 4
2-1 自我對準原理 4
第三章 雷射模組的製作與量測 7
3-1 陣列雷射模組的製作 8
3-2 實驗參數的設定 11
3-3 置上光纖 15
3-4 測量雷射模組輸出功率 17
3-5 金相分析 18
3-6 量測偏移量 21
第四章 雷射陣列耦光模型 29
4-1 耦光損耗的探討 29
第五章 實驗結果與分析 35
5-1 金相分析的結果 35
5-1-1 金相分析照片 36
5-1-2 平均偏移量 41
5-2 量測結果 42
第六章 結論與未來工作 62
參考文獻 64

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