摘要
在光纖通訊系統中，高速傳輸的需求與日遽增，因而光纖陣列通訊系統將成為一個不可或缺，且具無可取代的地位，然而隨著傳播距離變長，光功率損耗將成為一個值得探討的問題，因為光纖陣列模組的構裝品質決定了其通訊性能的好壞，為了增加光纖陣列模組的傳輸量與耦合率，將應用製造高精度的光纖陣列來以達此目標。
本文係採用黏膠構裝技術來構裝光纖陣列模組，而利用黏膠構裝將面臨收縮率和強度之問題，本文提出以控制接合高度與強度加強之技術以改善整體黏膠製程，在控制接合高度方面使用主動式調整加上黏膠收縮率控制，及黏膠參數挑選，使構裝後位移誤差在工作溫度負載下位移誤差在1μm內，而強度加強則是在構裝中使用不同加熱方式，來使強度加強，而構裝後則使用從新加熱方式加強接合強度。
上述構裝製程的改善，皆考量光纖陣列模組構裝後的偏移量精度和構裝後強度能夠提升或維持在理論上所設計出來的結果，將理論與實際的差距縮小，並透過自動化的定位、感測等技術，將構裝的穩定性與重複性提高，有效縮短加工時間，提升整體良率產能。

Abstract
For the requirements of high-speed signal transmission has been increasing in the optical communication system ,so the fiber array in the communication system has a lot of advantages which can not be replaced. But the loss of coupling efficiency is a difficult problem as the distance of communication is getting longer and longer. The packaging quality of the fiber array module. In order to increase the transmission and the coupling efficiency, we produce the high precision to reach the goal.
This paper use adhesive bonding technology to packageing of the fiber array module. But the adhesive had shrinkage and strength two problem. This paper presents a novel height and strength control strategy is constructed to fabricate one-dimensional optical fiber array. For the height,a active-alignment technique is used and shrinkage control and pick adhesive parameter can improve accuracy to displacement distance is below 1μm in the work tempeture.For the strength of the adhesion，a way to use different kind temperature in the work can add adhesion's strength. After work use to replace temperature in order to add strength.
All the improvements of the above packading technologies are proposed to raise or keep the performance of the fiber array module.So,the error between theories and experiments can be minimized.Meanwhile,a high stability and repeatability of the packaging can be achieved due to the automation of the
positioning force sensing,andinspection.

目錄
謝誌............................................................................1
目錄............................................................................2
圖目錄........................................................................4
表目錄........................................................................8
摘要............................................................................9
英文摘要...................................................................10
第一章 序論 ...........................................................12
1.1 光纖陣列模組介紹.....................................12
1.2 陣列模組的構裝方式................................14
1.3 陣列模組的接合技術................................15
1.4 研究動機.......................................................18
1.5 研究目的.......................................................19
第二章 文獻回顧.....................................................20
2.1 陣列模組的構裝方法及接合高度精度....20
2.1.1 覆晶構裝技術..........................................21
2.1.2 黏膠構裝技術..........................................25
2.2 黏膠的構裝參數對構裝精度的影響........28
2.2.1 黏膠的選擇..............................................28
2.2.2 黏膠的幾何形狀.....................................29
2.2.3 黏膠的係數.............................................30
2.2.4 影響黏膠固化過程的因素...................31
第三章 研究方法....................................................32
3.1 構裝參數模擬分析.....................................32
3.1.1 熱膨脹係數的選擇................................33
3.1.2 楊氏係數的選擇. ..................................34
3.2 接合高度的控制方法................................36
3.2.1 夾持機構設計.........................................37
3.2.2 接合實驗規劃.........................................38
3.2.3 黏膠的塗佈與體積的控制...................39
3.2.4 固化中收縮率的控制............................40
3.2.5 構裝時黏膠所產生氣孔的消除方法..41
3.3 改善接合強度..............................................42
第四章 實驗與結果................................................44
4.1實驗設備配置...............................................44
4.2點膠體積量測...............................................47
4.3實驗結果........................................................50
4.4構裝後接合情況及強度測試.....................53
第五章 結論與未來發展......................................57
5.1結論.................................................................57
5.2未來發展方向...............................................59
參考文獻..................................................................60

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