摘要

本文實際運用從世界級半導體封裝測試公司所獲得的老化測試(Burn-In)資料，從實際有限的資料當中分析造成球柵陣列封裝(BGA)錫球變形之主要原因，文中主要使用田口品質工程(Taguchi Methods)來分析取得的資料，並且廣泛使用統計商用軟體 MiniTab 14 處理資料及分析。並使用有限元素分析軟體 Ansys 8.1 做進一步錫球應力之分析。
在老化測試過程中可觀察到一些靜態加速測試所無法觀察到的半導體電性相關效應（如消耗功率），文中也會將這些特性加以分析，藉由這一系列的分析結果中，最後發現較小的錫球間距(Solder Ball Pitch)或錫球直徑(Solder Ball Diameter)在相同的老化測試條件下，會有較嚴重的變形，較長的老化測試時數(Burn-In Time)亦有較嚴重的錫球變形，在本文的取樣範圍內，產品消耗功率對錫球變形並無顯著影響。

ABSTRACT

This thesis gathered the actual Burn-In (BI) data from one of the leading cooperation in the semiconductor industry, and analyzed the major factors’ impact on BGA package solder ball deformation. The Taguchi Method was used for these analyses, and the commercial statistic software MiniTab14 was widely used on this thesis. The solder ball stress was analized by using the commercial FEM software Ansys 8.1.
Some electrical characters (such as device power) can be only observed from Burn-In process, but not static acceleration tests. These effects were fully discussed in this thesis. The analyses got the result that the smaller solder ball pitch/solder ball diameter causes the more serious solder ball deformation under the specific socket vendor precondition. Burn-In time are also a significant factor for solder deformation. Basically the longer BI time cause the more serious solder deformation. The device power effect is not significant within the power sampling range of this thesis.

CONTENTS

ACKNOWLEDGEMENTS .….……………………………………. i
CONTENTS ………………………………………………………… ii
LIST OF TABLES ………………………………………………….. v
LIST OF FIGURES ………………………………………………… vii
ABSTRACT (CHINESE) …………………………………………… x
ABSTRACT (ENGLISH) …………………………………………… xi
CHAPTER 1 INTRODUCTION ……………………………………. 1
1.1 Motivation …………………………………………………. 1
1.2 Literatures Review …………………………………………. 3
1.2.1 Solder Material and Solder Joint Studies …………… 3
1.2.2 Burn-In Related Studies …………………………….. 6
1.2.3 The Studies of Burn-In Trend ……………………….. 8
1.3 Contents of the Thesis ………………………….…………… 12
CHAPTER 2 BACKGROUND OF PRODUCT FAILURE BEHAVIOR AND BURN-IN ……………………………………….. 16
2.1 The Bathtub Curve …………………………………………. 16
2.2 Infant Mortality …………………………………………….. 19
2.3 Weibull Distribution ………………………………………... 21
2.4 Burn-In ……………………………………………………... 24
2.5 Burn-In Methodolgy ………………………………………... 26
CHAPTER 3 TAGUCHI METHODS ………………………………. 40
3.1 Brief Instruction of Taguchi Methods ……………………... 40
3.2 Orthogonal Array …………………………………………... 41
3.2.1 Orthogonality ………………………………………. 43
3.2.2 Advantages of Using Orthogonal Arrays ………….. 45
3.3 Signal-to-Noise Ratio ……………………………………… 46
3.3.1 SN Ratio for Smaller Is Better ……………………... 48
3.3.2 SN Ratio for Bigger Is Better ……………………… 48
3.3.3 SN Ratio for Nominal Is Best ……………………… 49
3.4 Special Application of Taguchi Methods …………………. 50
3.4.1 Dummy Level Technique on Orthogonal Arrays ….. 50
3.4.2 Omega Transformation ……………………………. 51
CHAPTER 4 DATA COLLECTION ………………………………. 60
4.1 Factors to be Analyzed ……………….…………………… 60
4.2 Plan of Data Collection …………………………………… 61
CHAPTER 5 ANALYSIS ………………………………………….. 65
5.1 Preliminary Data Analysis ……………….………………… 65
5.1.1 Analysis of Variance ………………………………. 68
5.1.2 Contact Force Effect ……………………………….. 70
5.1.3 Device Power Effect ……………………………….. 70
5.1.4 Burn-In Time Effect ……………………………….. 71
5.2 Re-Arrange the Level of Contact Force …………………… 71
5.3 Ball Diameter and Pitch Effect ……………………………. 73
5.3.1 Focus on Single Socket Vendor …………………... 73
5.3.2 Verification Experiment …………………………… 74
5.3.3 Analysis of Variance ………………………………. 76
5.4 Omega Transformation ……………………………………. 77
5.5 Solder Ball Stress Analysis .................................................. 79
CHAPTER 6 CONCLUSIONS ……………………………………. 119
6.1 Summaries ……………………………………………….. 119
6.2 Future Prospects ………………………………………….. 121
REFERENCES …………………………………………………….. 123

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