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博碩士論文 etd-0116116-141801 詳細資訊
Title page for etd-0116116-141801
論文名稱
Title
外加電場改善陶瓷基板之雷射鑽孔品質之研究
The Study of Improving the Quality of Laser Drilling for Ceramic Substrate by External Electric Field
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
46
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2015-12-07
繳交日期
Date of Submission
2016-02-16
關鍵字
Keywords
陶瓷基板、熔渣、電漿、電場、雷射鑽孔、雷射劃線
laser scribing, laser drilling, ceramic substrate, debris, plasma, electric field
統計
Statistics
本論文已被瀏覽 5692 次,被下載 35
The thesis/dissertation has been browsed 5692 times, has been downloaded 35 times.
中文摘要
本研究是利用外加電場輔助光纖雷射(1064nm)對氧化鋁陶瓷基板鑽孔,以及使用預熱基板方式輔助雷射劃線。我們利用理論及模擬進行分析後,調整不同電場參數以及設計不同電場架構,探討對鑽孔後的孔洞品質影響,例如孔洞真圓度、表面焦化區域大小、熔渣堆積高度等,經由實驗結果歸納出最佳電場參數,並設計出可應用於實際雷射鑽孔機台之電場模組。另外在雷射劃線方面,我們使用加熱平台提高基板溫度後,測試基板之最小可劃線雷射功率,由實驗結果得知雷射應用效率提高程度,最後設計出可應用於實際雷射劃線機台之預熱模組。
外加電場輔助雷射鑽孔的架構為在雷射鑽孔區周圍架設至少兩面電極並施加電壓,其原理為因雷射鑽孔時會產生大量電漿雲,而此電漿雲會吸收雷射能量以及造成雷射的散射,由於電漿是由許多的帶電粒子所組成,因此外加一電場後能有效吸引帶電粒子將其帶離雷射加工區,對於孔洞表面品質、加工效率都能有所改善,且可吸引被加熱熔融態的氧化鋁將其帶離孔洞,提高孔洞中熔渣移除效率。在雷射劃線方面,提高基板溫度後能提高其對光的吸收,可減少劃線斷線之情形發生。
實驗結果證實外加電場輔助雷射鑽孔確實可提高熔渣的移除效率以及減少表面焦化區域,且提高基板溫度也有助於提高雷射的應用效率。
Abstract
This study use the external electric field to assist fiber laser (1064nm) drilling for Al2O3 ceramic substrate, and use the preheating method to assist laser scribing. After using the theory and simulation analysis, we adjust the different parameters and design different electric field structure, then study the quality of the hole after drilling, such as roundness, the size of coke area, debris height, etc. According to the experimental result, we summarize the best electric field parameters, and design a module which can be applied to the real laser drilling machine. On laser scribing, we use the heating platform to raise the temperature of the substrate, then we test the minimum laser power that can scribe the substrate. We obtain the improved level of the laser application efficiency, then design a module which can be applied to the real laser scribing machine.
The structure of the external electric field assisted laser drilling is set up by two electrodes around the laser drilling area, and a voltage is applied. The principle is that while laser drilling, a large amount of plasma plume will be produced. The plasma plume will absorb and scatter the laser light. Since the plasma is composed of many charged particles, apply an electric field can effectively attract the charged particles and leave them from processing area. The quality of surface and processing efficiency will be improved. It also can attract the molten Al2O3 and leave it from the hole, improve the debris removal efficiency. On laser scribing, raising the temperature of the substrate can enhance the absorption of the light, then the occurrence of scribe break will be reduce.
The experimental results show that the external electric field assisted laser drilling can indeed improve debris removal efficiency and reduce the coke area of surface. Raising the temperature also help to improve the efficiency of laser application.
目次 Table of Contents
目錄
論文審定書(中文) i
論文審定書(英文) ii
論文公開授權書 iii
誌謝 iv
中文摘要 v
Abstract vi
目錄 viii
圖目錄 x
表目錄 xii
第一章 序論 1
1.1前言 1
1.2研究背景 2
1.2.1 雷射加工技術 2
1.2.2 陶瓷鑽孔 4
1.3研究動機 4
第二章 電場輔助雷射鑽孔之理論與模擬 6
2.1雷射誘發電漿理論 6
2.2電場架構之模擬與設計 7
第三章 實驗儀器與量測方法 14
3.1實驗儀器 14
3.2 量測設備與方法 16
3.2.1 光學顯微鏡 16
3.2.2 熱場發射型掃描式電子顯微鏡 17
3.2.3 紫外光-可見光光譜儀 18
3.2.4 環境掃描式電子顯微鏡 19
第四章 輔助雷射劃線及鑽孔之實驗方法與結果 20
4.1 實驗方法 20
4.1.1 提高溫度輔助雷射劃線 20
4.1.2 外加電場輔助雷射鑽孔 20
4.2 實驗結果 20
4.2.1提高基板溫度對雷射劃線結果影響 20
4.2.2電場強度對雷射鑽孔結果影響 21
4.2.3電場強度對雷射鑽孔結果影響 24
4.3 雷射鑽孔後電極之吸附情形 28
第五章 結 論 29
參考文獻 30
參考文獻 References
[1] G. Thawari, J. K. Sarin Sundar, G. Sundararajan, and S. V. Joshi, 2005,“Influence of process parameters during pulsed Nd:YAG laser cutting of nickel-base superalloys,” Journal of Materials Processing Technology,Vol.170, p.p.229-239.
[2] I. Black, S. A. J. Livingstone, and K.L.Chua, 1998, “A laser beam
machining (LBM) database for the cutting of ceramic tile,” Journal of Materials Processing Technology, Vol.84, p.p.47-55.
[3] C. Karatas, O. Keles, I. Uslan, and Y. Usta, 2006, “Laser cutting of steel sheets: Influence of workpiece thickness and beam waist position on kerf size and stria formation,” Journal of Materials Processing Technology, Vol.172, p.p.22-29.
[4] S. L. Chen, 1999, “ The effects of high-pressure assistant-gas flow on high-power CO2 Laser cutting,” Journal of Materials Processing Technology, Vol. 88, pp. 57-66.
[5] 黃立仁、羅慶璋,2001,「利用二氧化碳雷射切割S304 品質評估」, 銲接與切割,第11 卷,第1 期,第38-48 頁。
[6] R. F. De Graaf, and J. Meijer, 2000, “Laser cutting of metal laminates: analysis and experimental validation,” Journal of Materials Processing Technology, Vol. 103, pp. 23-28.
[7] C. H. Tsai, and H. W. Chen, 2003, “Laser cutting of thick ceramic substrates by controlled fracture technique,” Journal of Materials Processing Technology, Vol.136, p.p.166-173.
[8] N. Rajaram, J. Sheikh-Ahmad, and S. H. Cheraghi, 2003, “CO2 laser cut quality of 4130 steel”, International Journal of Machine Tools & Manufacture, Vol. 43, pp. 351-358.
[9] Kamran, I. and Susan D. A., “Pulse CO2 laser drilling of green alumina ceramic", IEEE Transactions on Advanced Packaging, v 22, n 4, Nov, 1999, p 620-623.
[10] Sciti, D. and Bellosi, A., “Laser-induced surface drilling of silicon carbide" Applied Surface Science, v 180, n 1-2, Aug 1, 2001, p 92-101.
[11] 李昌城、蔡傳暉,2006,脆性基板水下雷射鑽孔之研究,碩士論文
[12] P. Bechtold, S. Eiselen, and M. Schmidt, "Influence of electrostatic fields and laser-induced discharges on ultrashort laser pulse drilling of copper," Physics Procedia, vol. 5, pp. 525-531, 2010.
[13] H. Zheng and Z. Jiang, "Femtosecond laser micromachining of silicon with an external electric field," Journal of Micromechanics and Microengineering, vol. 20, p. 017001, 2010.
[14] S. Harilal, M. Tillack, B. O’Shay, C. Bindhu, and F. Najmabadi, "Confinement and dynamics of laser-produced plasma expanding across a transverse magnetic field," Physical Review E, vol. 69, p. 026413, 2004.
[15] H. C. M. H.C. Tse, T.M. Yue, "Effect of electric field on plasma control during CO2 laser welding," Optics and lasers in Engineering, vol. 32, pp. 55-63, 2000.
[16] K. Niemax and W. Sdorra, "Optical emission spectrometry and laser-induced fluorescence of laser produced sample plumes," Applied Optics, vol. 29, pp. 5000-5006, 1990.
[17] J. Uebbing, J. Brust, W. Sdorra, F. Leis, and K. Niemax, "Reheating of a laser-produced plasma by a second pulse laser," Applied spectroscopy, vol. 45, pp. 1419-1423, 1991.
[18] Y. F. Tzeng, and F. C. Chen, 2003, “A simple approach for robust design of high-speed electrical discharge machining technology,” International Journal of Machine Tools & Manufacture, Vol. 43, pp. 217-227.
[19] 洪榮哲,1991,「雷射切割與加工品質的評估」,機械月刊,第17 卷,第10 期,第113-118 頁。
[20] 蔡宗河,1991,陶瓷的機械加工,全華圖書股份有限公司,台北。
[21] F. Leis et al., "Basic Investigation for Laser Microanalysis: I. Optical Emission Spectrometry of Laser Produced Sample Plumes,"Mikrochim. Acta II, 185-199 (1989).
[22] W. Sdorra and K. Niemax, "Temporal and Spatial Distribution of Analytes and Analyte Ions in Microplasmas Produced by Laser Ablation of Solid Samples," Spectrochim. Acta Part B 45, 917-926 (1990).
[23] F. Leis, J. B. Ko, and K. Niemax, "Optical Emission Spectroscopy of Laser Produced Sample Plumes for Microanalysis," Fresenius Z. Anal. Chem. 334, 649 (1989).
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