隨著輕薄短小產品的需求與高密度表面組裝封裝體的發展，如QFN(Quad Flat No-lead) 與 BGA (Ball Grid Array)，電子元件的焊點強度對於產品信賴度有愈來愈大的影響。 輕薄短小的產品，如手機、PDAs與MP3 播放機等，因持取不慎掉落頻率增加使錫球銲點因撞擊產生裂隙而失效機會大增，再加上配合綠色環保政策而導入脆性較高的無鉛錫球，使得電子元件因碰撞或是掉落而導致內部元件接點損壞而導致產品的故障發生。基於此一現象，本次研究將針對BGA載板製程中鎳鍍層內應力、電鍍鎳金鎳厚與前處理微蝕製程，搭配無鉛錫球設計一系列掉落衝擊實驗，由此結果探討兩者對於電子元件抗衝擊的影響。
由實驗後結果顯示，BGA載板鎳鍍層內應力中張應力188，348Mpa表現出較佳的焊點強度，但當張應力大於638Mpa，或當內應力為壓應力時，無鉛錫球與載板的焊點強度明顯變差。經由失效分析後發現破壞裂縫生成位置在無鉛錫球與BGA載板形成的介金屬化合物IMC(Intermetallic Compound) 上。
在第二階段針對電鍍鎳金前處理微蝕段實驗後結果顯示，微蝕藥液過硫酸鈉(SPS)在低濃度時獲得強的焊點強度，且經由失效分析後發現破壞裂縫生成位置在無鉛錫球與PCB電路板銅墊形成的介金屬化合物IMC(Intermetallic Compound) 上或因PCB電路板銅墊剝離造成的失效。

With the development of smaller and higher density surface mount packages like Quad Flat No-lead (QFN) and Ball Grid Array (BGA), solder joints’ strength of the electronic components has a greater impact on the reliability of an end product. Also, the decrease in size of consumer products such as cellular phones, PDAs and MP3 players, has increased the frequency of accidental drops resulting in solder joint cracks and eventually malfunction of the products. With legislation put in place by government and industrial bodies, electronics companies are driven to eliminate the uses of lead in their products. It thus leads to the concern of reliability of lead-free solders as interconnects. The present work aims at studying the effects of drop impact on the strength of solder joint of lead free solder (Sn4Ag0.5Cu) and BGA substrate metal finish electrolytic Ni and Au.
In this study, the effects of internal stresses in BGA Ni layer and Pre-treatment Micro-Etching processing on the strength of Sn/Ag/Cu solder joint are investigated. The drop test and peel off test are adopted in testing the strength according to the standard of JEDEC.
The drop test results have shown that the compressive internal stresses in the Ni layer have worse effects on the joint strength than tensile internal stresses can affect. The failure modes are analyzed and can be concluded that all failures occur at the interface of IMC and the surface of Ni layer on BGA substrate.
The drop test results have shown also that the strength of the solder joint with the lower concentration of SPS in pre-treatment micro-etching is stronger and all the failures occur at the interface of IMC and the surface of PCB Cu Pad. Comparing with the effect of internal stress in Ni layer, SPS concentration in pre-treatment micro-etching to affect the solder joint strength is more significant.

第一章 緒論--------------------------------------------------------------------1
1.1 研究動機與源起----------------------------------------------------1
1.2 文獻回顧與研究方向----------------------------------------------1
1.3 全文架構-------------------------------------------------------------3
第二章 無鉛銲錫的要求與BGA載板製程介紹-------------- ---------4
2.1 無鉛銲錫功能上的要求--------------------------------- ----------4
2.2 目前無鉛銲錫介紹------------------------------------- ------------5
2.3 BGA載板製程與封裝製程介紹----------------------- ----------8
第三章 剝離測試與JEDEC Standard 衝擊測試介紹------------------15
3.1 剝離測試介紹-------------------------------------------------------15
3.2 JEDEC Standard 衝擊測試介紹---------------------------------16
第四章 BGA載板電鍍鎳鍍層內應力對銲點強度的影響-------------25
4.1 實驗目的-------------------------------------------------------------25
4.2 實驗用試片介紹----------------------------------------------------25
4.3 實驗計劃與流程----------------------------------------------------27
4.4 實驗前置作業-------------------------------------------------------28
4.5 實驗結果-------------------------------------------------------------35
4.5.1 剝離測試結果--------------------------------------------------35
4.5.2 掉落衝擊測試結果--------------------------------------------35
4.5.3 紅染料失效模式分析結果-----------------------------------36
4.5.4 介金屬層厚度量測結果--------------------------------------36
第五章 BGA載板電鍍鎳金前處理微蝕製程對銲點強度的影響----75
5.1 實驗目的-------------------------------------------------------------75
5.2 實驗用試片介紹----------------------------------------------------75
5.3 實驗計劃與流程----------------------------------------------------76
5.4 實驗前置作業-------------------------------------------------------77
5.5實驗結果------------------------------- --------------------------------78
5.5.1 剝離測試結果--------------------------------------------------78
5.5.2 掉落衝擊測試結果--------------------------------------------79
5.5.3紅染料失效模式分析結果------------------------------------79
第六章 分析與討論-----------------------------------------------------------85
第七章 綜合結論與未來展望-----------------------------------------------93
7.1 綜合結論----------------------------------------------------------93
7.2 未來展望與建議事項-------------------------------------------93
參考文獻 -----------------------------------------------------------------------95

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