本論文主要在研究五種不同助焊劑的基本物理及機械特性、並分別搭配0.6mm Sn96.5/Ag3.0/Cu0.5(SAC305)的大錫球、和
0.3mm Sn98.5/Ag1.0/Cu0.5(SAC105)小錫球進行半導體封裝。
大錫球部分進行剪力測試、拉球試驗以及包裝掉落測試，小錫球部分則進行剪力測試、拉球試驗以及區域推球試驗和上板掉落測試，實驗後探討不同助焊劑生產的樣品中，對錫球強度和機械性質的影響，並使用高倍顯微鏡觀察其破壞模式。
實驗結果顯示，助焊劑與焊點的強弱並無直接關係，焊點的強弱是由金屬本身的特性所決定。然而，殘留性越少的助焊劑，錫球的剪力以及拉力數據都較大，而殘留性多的助焊劑，於老化處理後，錫球會有從IMC層掉落的現象。且助焊劑的殘留差異性亦會影響區域推球失效模式的不同。而於上板掉落測試中，所有測試的助焊劑大部分的失效模式都是屬於測試板端角落的焊點剝離，其餘少數屬於測試板端的錫球本體斷裂和IMC層斷裂。因此判斷助焊劑本身的殘留性對於半導體封裝是一個很大個關鍵因子，但是和最終端產品的信賴度並無直接關連性。
關鍵詞：無鉛、錫球、助焊劑、半導體封裝、測試。

Abstract
This thesis is mainly aimed to the study the basic physical properties of different flux, and the combination with semiconductor packaging of 0.6mm Sn96.5/Ag3.0/Cu0.5 (SAC305) big solder ball, and 0.3mm Sn98.5/Ag1.0/Cu0.5 (SAC105) small solder ball.
Big solder ball was proceeded with shear stress test, pull ball test, and tray drop test. However small solder ball was proceeded with shear stress test, pull ball test, zone shear solder balls test and board level drop test. After experiments, samples of different flux, the effect of solder strength and mechanical properties were received and discussed. And failure modes were observed by high-power microscope, SEM and OM.
The experimental result shows that the flux doesn’t have direct relationship with the point of welding strong and weak, the point of welding strong and weak is determined by the metal’s characteristics. However, the less of residual flux is, the higher the solder balls shearing force as well as pulling force are. As for the more of residual more of flux, after aged processing, some solder balls have the phenomenon of missing from the IMC layer. And the difference of the residual flux will affect the various failure modes of zone shear solder balls. From board level drop test, the majority of failure modes is pad peeling at the corner of test board side for all test flux, and the remaining failure modes exhibit solder fractured and IMC layer broken. Therefore, the judgement of the residual flux is a very important key factor for the semiconductor packaging. It doesn’t have the direct correlation with the reliability of final products.

Keywords: Lead Free, Solder Ball, Flux, Semiconductor Packaging, Tests.

目 錄
誌 謝……………………………………………………………………III
目 錄……………………………………………………………………IV
表 目 錄………………………………………………………………VI
圖 目 錄……………………………………………………………………VIII
摘 要…………………………………………………………………XIII
Abstract……………………………………………………………………XIV
第一章 緒論…………………………………………………………1
1-1 前言…………………………………………………………1
1-2 研究背景……………………………………………………2
1-3 研究動機……………………………………………………4
1-3-1 BGA無鉛封裝常見不良現象………………………………5
1-3-2 BGA原材簡介-錫球………………………………………8
1-3-3 BGA原材簡介-助焊劑……………………………………9
1-4 文獻回顧……………………………………………………14
1-5 論文架構……………………………………………………17
第二章 實驗方法……………………………………………………23
2-1 實驗規劃……………………………………………………23
2-2 試片介紹……………………………………………………24
2-3 機台介紹………………………………………………………24
2-4 實驗流程………………………………………………………26
2-5 試片結果分析…………………………………………………26
第三章 實驗結果及分析………………………………………………43
3-1 助焊劑基本物理特性比較………………………………………43
3-2 應用於封裝產品0.6 mm的SAC 305大錫球…………………46
3-3 應用於封裝產品0.3 mm的SAC 105小錫球…………………49
第四章 討論……………………………………………………………85
第五章 結論………………………………………………………………93
參考文獻………………………………………………………………96

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