為了未來光纖通訊的發展需求而開發高耦合率的光收發模組，研究重心將致力於提高陣列光收發模組的耦光效率上，而採用的構想不同與一般xyz方向調整，而是採用調整陣列收發模組的徑向方向來提高模組耦光效率。
在論文中使用銲錫構裝技術來構裝光收發模組，並利用銲錫構裝可重新熔化的特性以及銲錫體積的變化來重新調整模組角度，以控制模組在徑向方向能夠產生偏移，讓原先構裝好的模組耦光率能夠進一步提升。

For the future development of optical fiber communication needs to develop high optical coupling of the optical transceiver module. We focus on enhancing the optical efficiency of array optical transceiver module, and improve the way is used rotation axis instead of ordinary xyz translation.

In the paper the use of solder packaging technology packaging optical transceiver module. And take the characteristics of solder packaging to control the angle, so that module can produce offsets in the radial direction,and original structure packed module can be further increased the rate of coupling efficiency.

目錄.....................................................3
圖目錄...................................................5
表目錄....................................................7
中文摘要..................................................8
Abstract.................................................9
第一章 序論............................................10
1.1 前言..............................................10
1.2 陣列模組構裝方式..................................12
1.3 研究動機與目的....................................15
第二章 文獻回顧.......................................16
2.1陣列模組構裝.......................................16
2.2 銲錫高度相關研究..................................21
第三章 研究方法.......................................25
3.1 角度旋轉理論分析..................................25
3.2角度控制方式.......................................30
3.3 溫度曲線對銲錫構裝的影響..........................34
第四章 實驗............................................36
4.1實驗規劃..........................................36
4.2初步結果..........................................40
4.3預期結果..........................................45
第五章 結論與未來發展................................47
5.1結論.............................................47
5.2未來工作.........................................47
第六章 參考文獻.......................................48

[1]S. G. Kang, , M. K. Song,, S. S. Park, , S.H. Lee, N. Hwang, H. T. Lee, K. R. Oh, G. C. Joo, D. H. Lee,“Fabrication of Semiconductor Optical Switch Module Using Laser Welding Technique” IEEE Transaction on Advanced Packaging, Vol. 23, no. 4, 2000.
[2] Kato. T. Yuuki, F. Tanaka, K. Habu, T. Akiyama, Y. Shimura, T. Takai, A. Mizuishi, K. Teraoka, T. Motegi, Y. “A new assembly architecture for multichannel singlemode-fiber-pigtail LD/PD modules” Components, Hybrids, and Manufacturing Technology, IEEE Transactions on , Vo.16, Issue 1 , pp. 89-94 , 1993
[3] Bostica, B. Burzio, M. Delpiano, F. Pellegrino, P. Pesando, L. “Ten-channel optical transmitter module for sub-system interconnection operating at λ=1.3 μm up to 12.5 Gbit/s ” Advanced Packaging, IEEE Transactions on, Vo.22, Issue 3 , pp. 442-450 , 1999
[4] Hunziker, W. Vogt, W. Melchior, H. Buchmann, P. Vettiger, P..“Passive self-aligned low-cost packaging of semiconductor laserarrays on Si motherboard” Photonics Technology Letters, IEEE, Vol.7 , Issue 11 , pp.1324-1326 , 1995
[5] Nakagawa, G. Miura, K. Tanaka, K. Yano, M. “Multichannel fiber ferrule for a stable laser-diode array module ” Photonics Technology Letters, IEEE Vol. 7, Issue 4, 1995.
[6] Thurlow, A. Collins, J. McKee, P. Towers, J , “Semiconductor laser array to fibre array coupling via diffractive microlenses ” Microengineering and Optics, IEE Colloquium on , pp.7/1-7/7, 1994.
[7] K. Matsuda T. Yoshida T. Kobayashi T. Chino ;“A surface-emitting laser array with backside guiding holes for passive alignment to parallel optical fibers ”, Photonics Technology Letters, IEEE , 1996, Vol8, Issue 4 pp. 494-496 , 1996
[8] Chang-Ming Liu Kuo-Ning Chiang “Solder shape design and thermal stress/strain analysis of flip chip packaging using hybrid method”, Electronic Materials and Packaging, 2000. (EMAP 2000) pp. 44-50 , 2000
[9] Hall, P. Bell Telephone Lab., Inc., PA “Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated Circuits ” Components, Hybrids, and Manufacturing Technology, IEEE Transactions on, Vol. 4,Issue 4 , pp. 403-410, 1981.
[10] Lo, J.C.C. Lee, S.W.R. Wu, H.H.L. Lam, J.K.S..;“Determination of solder bump stand-off height in a flip- chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications”, Electronic Components and Technology Conference 2008.pp. 1887-1892 , 2008
[11] Thompson, T.B. Subbarayan, G. James, R. Renken, F.P. “A model for assessing the shape of solder joints in the presence of board warpage and volume variation in area-array packages”, Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. , Vol. 1, pp. 414 , 23-26 May 2000
[12]羅振家,“陣列光纖雷射銲接構裝與銲後位移量測”,國立中山大學機械與機電工程研究所碩士論文,2005
[13]謝承翰,“利用覆晶技術製作陣列雷射模組”,國立中山大學光電工程研究所碩士論文,2001
[14] Hunziker, W. Vogt, W. Melchior, H. Germann, R. Harder, C. “Low cost packaging of semiconductor laser arrays using passiveself-aligned flip-chip technique on Si motherboard”, Electronic Components and Technology Conference, 1996. Proceedings, 46th , pp.8-12, 1996
[15] Ouchi, T. Imada, A. Sato, T. Sakata, H. Res. “Direct coupling of VCSELs to plastic optical fibers using guide holes patterned in a thick photoresist” Photonics Technology Letters, IEEE, Vol.14,Issue 3 , pp.263-265, 2002.
[16] Wu, W.J. Guo, Y.D. Chiu, T.H. Yuang, R.H. Chu, M.T. Hsieh, C.H. Cheng, W.H. “Packaging of laser array modules in flip-chip bonding” Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE, Vol.2, pp. 673-674, 2000.
[17] Hall, S.A. Lane, R. Han-Chung Wang. Gareri, A. IBM Thomas J. “Assembly of laser-fiber arrays” Lightwave Technology, Journal of, Vol.12,Issue 10 , pp. 1820-1826,1994.
[18] Matthews, M.R. MacDonald, B.M. Preston, K.R. “Optical components-the new challenge in packaging” Components, Hybrids, and Manufacturing Technology, IEEE Transactions on, Vol.13,Issue 4 , pp.798-806,1990.
[19] Wale, M. Goodwin, M. “Flip-chip bonding optimizes opto-ICs”
Circuits and Devices Magazine, IEEE,Vol.8,Issue 6 , pp.25-31,1992.
[20] Qing Tan. Lee, Y.C. “Soldering technology for optoelectronic packaging” Electronic Components and Technology Conference, 1996. Proceedings, 46th, pp.26-36,1996
[21] Datta, M. Dagenais, M. “Solder-assembled high coupling efficiency single-mode laser modules using micro-heaters and precompensation technique” Components and Packaging Technologies, IEEE Transactions on, Vol.27,Issue 2, pp.305 -310,2004.
[22] Soo-Jin Park. Ki-Tae Jeong. Sang-Ho Park. Hee-Kyung Sung “A novel method for fabrication of a PLC platform for hybrid integration of an optical module by passive alignment” Photonics Technology Letters, IEEE, Vol.14,Issue 4, pp.486-488,2002.