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論文名稱 Title |
鈦基氮化物薄膜濺鍍於鋼上介面機械性質,
氧化性質及微組織分析
Interfacial Mechanical Properties, Oxidation Properties and Microstructure of Titanium-Based Nitride Films Deposited on Steels |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
184 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2001-01-16 |
繳交日期 Date of Submission |
2001-02-07 |
關鍵字 Keywords |
薄膜、氮化物 Nitride, Film |
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統計 Statistics |
本論文已被瀏覽 5735 次,被下載 283 次 The thesis/dissertation has been browsed 5735 times, has been downloaded 283 times. |
中文摘要 |
以TiN為主的鈦基氮化物硬膜在工業上的應用已有多時,也由於物理蒸氣沉積俱有操作方便,成本較低的優點,已廣泛地使用在鍍覆各種硬膜。本文即以直流電源電漿反應性濺鍍法將數種鈦基氮化物硬膜鍍覆於不?袗?及工具鋼上,在製程因素控制中,維持110瓦或220瓦的輸入電源,0.8 Pa的工作(真空)壓力,9.3的 Ar/N2 比,攝氏300度的基板溫度,零偏壓輸入以及40分鐘的濺鍍時間,而變化靶材組成,由純Ti靶,Ti-6Al靶,熱壓式Ti-6Al-4V靶以及商用鈦合金Ti-6Al-4V靶作為濺射不同組成的三元或四元性氮化物硬膜。 硬膜機械性質的好壞實繫於附著性的良窳,而常見評估附著性方法有壓印法,刮膜法及衝擊法,由於壓印法操作簡便,設備便宜,極適於硬膜於工具鋼上附著性的量度。本文也先就壓印時作彈性分析,發現在硬膜與期材介面上的剪應力,軸向應力及週向應力與基材的波桑比或降伏強度有密切關係,硬膜鍍在波桑比較大的基材如不?袗?時會在介面引起較大的介面應力及應力集中,所產生的壓印特徵是只在壓印痕?堶惘釵U種裂痕及裂口,而硬膜鍍在波桑比較小的高速鋼上的壓印裂紋則幾乎發現在壓印周圍,良好附著性的硬膜裂紋短少,不良附著性的硬膜也只在壓印週圍產生裂痕及裂口。此外,使用不同荷重的壓印所產生的裂痕程度亦可間接作為量測附著性的方法。 在TiN的硬膜中加了少許的Al(6 wt﹪)或V(4wt﹪)而產生Ti6AlN膜及Ti6Al4VN膜,發現Al使原來晶格常數減少而V會使之回升。兩者的中間層為 –Ti相(固溶入Al及V)而多為柱狀結構,而外層的氮化物,(200)及(100)方向仍然是主要的微結構。當TiAlN中今Fe含量高時,Fe3N-Fe2N(ε)相易優先方向生成。在TiAlVN/HSS中,中間層與基材存在有 的金相關係。 加了少許的Al或V後的TiAlN或TiAlVN在工具鋼上似乎有明顯的耐氧化性質,在本研究中尤其是熱壓靶材所產生的TiAlVN膜於高速鋼上最俱抗氧化傾向,也估算出在攝氏620度-800度富氧環境下氧化的活化能近似於Ti 0.5Al 0.5N於高速鋼的值,亦即抗氧化性質近似,主因是Al高擴散係數所俱有的對氧鈍化的效應以及V所造成的優質硬膜。此外TiAlN及TiAlVN膜在攝氏800度的氧化結構也迴異於TiN者,前兩者不易發現TiN的剝落現象,氧化生成物TiN以Fe2O3為主而前兩者則含多量的Fe2TiO5。 |
Abstract |
Titanium-based nitride films are deposited on steels by magnetron reactive sputtering for cutting, forming and decorative applications. The nitride films about 2 m thick with interlayer for better adhesion are grown at a working pressure of 0.8 Pa, discharge power of 220 watt, Ar/N2 gas ratio of 0.93, substrate temperature of 300 ℃ and deposition time of 40 minutes. Four different targets (Ti, Ti-6Al, hot-pressed Ti-6Al-4V, commercial Ti-6Al-4V, where Al and V are in wt.%) and two different steels ( stainless steel (SS) and high speed steel (HSS)) as substrate materials are tested. The indentation technique is used to evaluate the adhesion properties of the nitride films to the substrate and elasticity analysis of indentation to analyze the distribution of the stresses at the interface. The differences in indentation properties between nitride/ SS and nitride/ HSS are examined and correlated with the elastic/plastic analysis. It appears the cracks and spallings observed inside the indentation cavity in nitride/SS system are due to the higher poisson’s ratio of stainless steel but those around the indentation cavity observed in nitride/HSS system are due to the edge (binding) effect. Continuous load –penetration depth curve of indentation test shows that TiAlVN/HSS is more fracture–resistant than the pure TiN/HSS. The addition of aluminium into TiN film decreases the lattice constant while further addition of vanadium into TiAlN films causes the lattice constant to increase. This is discussed in terms of bonding characteristics and atomic size of the elements. SEM analysis shows that columnar structure of TiN films is coarser than that of TiAlN and TiAlVN. TEM studies of microstructure and AFM studies of surface roughness show that the TiAlVN film formed by hot–pressed Ti-6Al-4V on HSS has the densest fibrous structure and smoothest surface, and therefore the best mechanical properties such as hardness and indentation fracture resistance. (111) and (200) orientations of TiN, TiAlN, and TiAlVN are observed by XRD analysis. The ) phase is found due to small amount of Fe in the films. The oxynitride phase in the nitride films as indicated by the binding energy shifts of the elements may be due to the trace oxygen during deposition. The interlayers of TiAlN/HSS and TiAlVN/HSS have the preferred orientations of and . The texture (columnar) structure of (111) and (200) orientations are observed in TiAlN and TiAlVN films. An orientation relationship of is found between interlayer and tempered martensite in TiAlVN/HSS. Oxidation test was carried out in oxygen atmosphere at 620-800℃for 3 hours. The TiAlVN film by hot-pressed Ti-6Al-4V on HSS follows the parabolic growth law. It also has the slowest oxidation rate while the TiN/ HSS the fastest one. The activation energy of oxidation of this system is about 184.5 kJ/mole. The oxidation of TiN/ HSS reveals larger area of spallings, while TiAlN/HSS and TiAlVN/ HSS generally show uniform oxidation with small areas of non-uniform growth. There is a dramatic effect of aluminium in facilitating the uniform oxidation for TiAlN and TiAlVN on HSS. The oxidation products of TiAlN/HSS and TiAlVN/ HSS are oxynitride, amorphous Al2O3, Fe2TiO5 and small amount of TiO2 and Fe2O3. |
目次 Table of Contents |
1. Introduction 2. Literature survey 3. Experimental 4. Result 5. Discuss 6. Conclusions 7. Reference 8. Appendix |
參考文獻 References |
1. J. M. E. Harper, J. J. Cuomo and H.T.G. Hentzell, J. Appl. Phys., 58 (1) (1985) 550 2. H. A. Jehn, S. Hofmann and V. E. Ruckborn, J. Vac. Sci. Technol., A 4(6), (1986) 2701. 3. W. D. Munz, J. Vac. Sci. Technol., A 4(6) (1986) 2717 4. P. K. Mehrotra and D.T.vQuinto, J. Vac. Sci. Technol., A3 (6) (1985) 2401 5. J. A. Ohilvy, J. Phys. D: Appl. Phys., 26 (1993) 2123 6. J. Palmers, M. V. Stappen, J. D. Haen, M. D. Olieslaeger, L. M. Stals, G. Uhlig, M. Foller and E. Haberlin, Surface and Coating Technology, 74-75 (1995) 162 7. D.C. Agrawal and R. Raj, Acta Metall., 37,4(1989) 1265 8. F. S. Shieu, R. Raj and S.L. Sass, Acta Metall., 38,11(1990) 2215 9. A. G. Evan, M.C. Lu, S. Schmauder and M. Ruhle, Acta Metall., 34,8 (1986) 1643 10. B. J. Dalgleish, M.C. Lu and A.G. Evans, Acta Metall., 36,8(1988) 2029 11. B. R. Manory and G. Kimmel, Thin Solid Films, 150 (1987) 277 12. T. Ikeda and H. Satoh, Thin Solid Films, 195 (1991) 99 13. M. D. Thouless, A. G. Evans, M. F. Ashby and J.W. Hutchinson, Acta Metall., 35(6)(1987) 1333 14. B. N. Chapman, J.Vac. Sci. Technol., 11(1974) 106 15. C. Weaver, J. Vac.Sci.Technol., 12(1975) 16. K. Jacobsson and B. Kruse, Thin Solid Films, 15(1973) 71 17. B.R. Lawn and M.V. Swain, J. of Materials Science, 10(1975) 113 18. B. Lawn and R. Wilshaw, J. of Materials Science, 10(1975) 1049 19. R. Mouginot and D. Maugis, J. of Materials Science, 20(1985) 4354 20. B.R. Lawn ,A.G. Evans and D.B. Marshall, J. of the American Ceramic Society, 63(9-10)(1980) 574 21. B.R. Lawn, A.G. Evans and D.B. Marshall, J. of the American Ceramic Society, 63(9-10)(1980) 574 22. D.J. Green and B.R. Maloney, J. of the American Ceramic Society, 69(3)(1986) 223 23. M.S. Hu and A.G. Evans, Acta Metall., 37,3(1989) 917 24. M.S. Hu, M.D. Thouless and A.G. Evans, Acta.Metall., 36(5)(1988) 1301 25. B. Rother and D.A. Dietrich, Surface and Coatings Technology, 74-75 (1995) 625 26. D.F. Diao, K. Kato and K. Hokkirigawa, J. of Tribology., 116(1994) 860 27. K. Mehrotra and D.T. Quinto, J.Vac.Sci.Technol., A3(6)(1985) 2401 28. B. Rother and D.A. Dietrich, Thin Solid Films, 250(1994) 181 29. B. Rother, T. Lunow and G. Leonhardt, Surface and Coatings Technology, 71(1995) 229 30. B. Rother and D.A. Dietrich, Surface and Coatings Technology, 74-75 (1995) 614 31. T. Ikeda and H. Satoh, Thin Solid Films, 195 (1991) 99 32. D.B. Marshal and A.G. Evans, J.Appl.phys., 56(10)(1984) 2632 33. C. Rossington , A.G. Evans, D.B. Marshal and B.T. Khuri-Yakub J.Appl.Phys.,56(10)(1984) 2639 34. A.G. Evans and J.W. Hutchinson, Int.J. Solids Structures, 20(5)(1984) 455 35. W. Schintlemeister and O. Pacher, J. Vac. Sci. Technol., 12 (4) (1975) 743 36. P. J. Clarke, J. Vac. Sci. Technol., 14 (1) (1977) 141 37. K. Nakamura and K. Inagawa, Thin Solid Films, 40 (1977) 55 38. T. S. Tadda and Y. C. Hung, Thin Solid Films, 54 (1978) 61 39. R. Kieffer, D. Fister and E. Heidler, Metall., 26 (1972) 128 40. W. Schintlmeister and O. Pacher, J. Vac. Sci. Technol., 12 (4) (1975) 743 41. S. Vuorinen, E. Niemi and A.S. Korhonen, J. Vac. Sci. Technol., A 3(6) (1985) 2445 42. J.M. Molarius, A.S. Korhonen, H. Kankaanpaa and M.S. Sulonen, J. Vac.Sci. Technol.,A4(6)(1986) 2686 43. V.K. Sarin and J.N.Li. Dstroen, J. Electrochem. Soc., 126 (1979) 1281 44. S.Vuorinen and A. Horsewell, J.Mater.Sci.,17 (1982) 17 45. D.G. Bhat, T. Cho and P.F. Woerner, J.Vac. Sci.Technol., A4(6)(1985) 2713 46. G. Lemperiere and J.M. Poitevin, Thin Solid Films, 126(1985) 265 47. L. Chollet and A. J. Perry, Thin Sold Films, 123 (1985) 223 48. D.S. Rickerby, J. Vac.Sci.Technol., A4(6)(1986) 2809 49. A.J. Perry, Thin Solid Films, 146 (1987) 165 50. M. Milic, M. Milosavljevic, N. Bibic and T. Nenadovic, Thin Solid Films, 126(1985) 319 51. E. Erturk and H.J. Heuvel, Thin Solid Films, 153(1987) 135 52. C.C. Cheng, A. Erdemir and G.R. fenske, Surf. Coat.Technol., 39-40(1989) 365 53. U. Helmersson, B.O. Johansson, J.E. Sundgren, H.T.G. Hentzell and P. Billgren, J.Vac.Sci.Tevhnol.,A,3(2)(1985) 308 54. M.V. Stappen, B. Malliet, L.De. Scheooer, L.M. Stals, J.P. Celis and J.R. Roos, Surf. Eng., 4(1989) 305 55. C. Quacyhaegens, L.M. Stals, L.D. Scheooer, M.V. Stappen and L.D. Schepper, Thin Solid Films, 187(1991) 37 56. C. Quacyhaegens, L.M. Stals, L.D.. Scheooer, M.V. Stappen , L.D. Schepper and B. Malliet, Surf. Coat. Technol., 45(1991) 193 57. A. Matthews and A.R. Lefkow, Thin solid Films, 126(1985) 283 58. J. Pelleg, L.Z. Zevin and S. Lungo, Thin solid films, 197(1991) 117 59. D.S. Rikerby and A. Matthew, Advanced Surface Coating: A Handbook of Surface Engineering, (1992) 96,97 60. U.C. Oh and J. HoJe, J.Appl.Phys., 74(3)(1993) 1692 61. U.C. Oh, J. H. J and J. Y. Lee, J., Mater., Res.10(3)(1995) 634 62. L.Y. Kuo and P. Shen, Surface Science, 373(1997) L350 63. L.Y. Kuo and P. Shen, Materials Science and Engineering, A276 (2000) 99 64. V.Valvoda, R. Kuzel and R. Cerny, Thin Solid Films, 156(1988) 53 65. M.Y.Al. Jarondi, H.T.G. Hentzell and S. Gong, Thin Solid Films, 198(1991) 61 66. L. Hultman, G. Hakansson, U.Wahlstrom, J.E. Sundgren, I. Petrov, F. Adibi and J.E. Greene, Thin Solid Films, 143(1985)398 67. B. Pecz, N. Frangis, S. Logothetidis, I. Alexandrou, P.B. Barna and J. Stoemenos, Thin Solid Films, 268(1995) 57 68. O. Knotek, T. Leyendecken and F. Junblut, Thin Solid Films 153(1987 )83 69. O. Knotek, M. Bohmer and T. Leyendecker and F. Jungblut, Materials Science and Engineering, A105/106(1988) 481 70. O. Knotek, M. Atzor, F. Jungblut and H.G. Prengel, Surface and Coating Technology,39/40(1989) 445 71. O. Knotek, A. Barimani, B. Bosserhoff and F. Loffler, Thin Solid Films 193/194 (1990) 557 72. T. Inoue and K. Koike, Appl.Phys.Lett. 33.(1978) 826 73. S. Zirinsky, W. Hammer, F.D. Meurle and J. Baglin, Appl. Phys. Lett.35 (1978) 529 74. M.Wittmer, Appl. Phs. Lett. 36 (1980) 456 75. T. Mochizuki and M. Kashiwahi, J. Electrochem. Soc. 127 (1980) 1128 76. D.P. Brady, F.N. Fuss, and D. Gerstenberg, Thin Solid Films, 66(1980) 286 77. W.W. Smeltzer, R.R. Herring and J.S. Kirkaldy, Acta Metallurgia, 9(1961) 880 78. O. Knotek, M. Bohmer and T. Leyendecker, J.Vac.Sci.Technol. A4 (1986) 2695 79. I. Suni, D. Sigurd, K.T. Ho and M.A. Nicolet, J. Electrochem. Socc. 130 (1983) 1210 80. H.A. Jehn, S. Hoffman, V.A. Ruuckborn and W.D. Munz, J.Vac.Sci.Technol., A4 (1986) 2701 81. A.D. Katnani and K.I. Papathomas, J. Vac.Sci.Technol., A5(4) (1987) 1335 82. G. Hakansson, J.E. Sundgren, O. Mcintyre, J.E. Greene and W.D. Munz, Thin Solid Films 153 (1987) 55 83. O. Knotek, W. Burgmer and C. Stoessel, Surface and Coatings Technology, 54/55 (1992) 249 84. D. Mclntyre, J.E. Greene, G. Hakansson, J.E. Sundgren and W.D. Munz, J.Appl.Phys.67 (1990) 1542 85. F. Ansart, H. Ganda, R. Saporte and J.P. Traverse, Thin Solid Films, 260 (1995) 38 86. S.P. Timoshenko and J.N. Goodier, Theory of Elasticity, (1986) 398 87. JCPDS files,3-0924 88. C.T. Olivo, Machine Tool Technology and Manufacturing Process, (1987) 536 89. D.L. Smith, Thin Film Deposition, (1995) 24 90. J.T. Schaffer, A. Saxena, S.D. Antolovich, T.H. Sanders,Jr, and S.B. Warner, The Science and Design of Engineering Materials, Magraw-Hill Company, 2nd. Edition. (1999) 773 91. R.F. Bunshah et al., Deposition Technologies for Films and Coatings,(1982) 179 92. O. Knotek, T. Leyendecker and F. Jungblut, Thin Solid Films, 153 (1987) 83 93. A.S. Korhonen, J.M. Molarius, I. Penyyinen and E. Harju, Materials Science and Engineering, A 105/106 (1988) 497 94. L.E. Toth, Transition Metal Carbides and Nitrides, Acaedmic press, N.Y. (1971) 32 95. L.S. Wen, X. Jiang and C.Y. Si, J. Vac. Sci. Technol. A4(6)(1986) 2682 96.H. Holleck, J.Vac.Sci. Technol. A4(6)(1986) 2663 97. O. Knotek, M. Bohmer and T. Leyendecker, J.Vac. Sci. Technol.,A4(1986) 2695 98. D.A. Porter and K.E. Easterling, Phase Transformation in Metals and Alloys, (1981) 145 99. M. Wittmer, J. Noser and H. Melchir, J. Appl. Phys. 52(11) (1981) 6253 100. D.W. Louw, I. L. Strydom, K.van der Heever and M.J.van Staden, Surface and Coating Technology, 49 (1991) 348 101. Y.K. Wang, X.Y. Cheng, W.M. Wang, X.H. Gu, L.F. Xia, T.C. Lei and W.H. Liu, Surface and Coating Technology, 72 (1995) 71 102. F. Adibi, I. Petrov, J.E. Greene, U. Wahlstrom and J.E. Sundgren, J. Vac.Sci. Technol., A11(260)(1993) 238 103. P. Panjan, B. Navinsek, A. Cvelbar, A. Zalar and I. Milooser, Thin Solid Films, 281-282 (1996) 298 104. S. Inoue, H. Uchida, Y. Yoshinaga and K. Kterazawa, Thin Solid Films, 300 (1997) 171 105. O. Kubaschewek, E.L.L. Evans and C.B. Alcock, Metallurgical Thermochemistry, fouth edition, (1967) 304 106. J.F. Moulder, W.F. Stickle, P.E. Sobol and K.D. Bomben, Handbook of X-ray Photoelectron Spectrocopy, (1995) 54 107. T.L. Barr, Modern Esca, (1994) 108. M .D. Drory, M.D. Thouless and A.G. Evans, Acta.Metall.,36(8)(1988) 2019 109. M.F. Gruninger, B.R. Lawn, E.N. Farabaugh and J.B.Wachtman.Jr, J.Am.Ceram.Soc.,70(5)(1987) 344 110. K.N. Tu, J.w. Mayer and L.C. Feldman, Electronic Thin Film Science, (1992)63 111. T. Inoue and K. Koike, Appl.Phys.Lett.33.(1978)826 112. S. Zirinsky, W. Hammer, F.d' Meurle and J. Baglin, Appl.Phys.Lett. 35(1978)529 113. M.Wittmer, Appl.Phys.Lett.36(1980)456 114. T. Mochizuki and M. Kashiwagi, J.Electrochem.Soc.127(1980)1128 115. D.P. Brady, F.N. Fuss and D. Gerstenberg, Thin Solid Films,66,(1980) 286 116. W.W. Smeltzer, R.R. Hearing and J.S. Kirkaldy, Acta Metallurgica,9 (1961)880 |
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