電子產品功能越來越強大, 在本論文中提出一個創新的接線佈局方法來取代現有的又高又長的多層接線封裝； 現今的HSBGA(Heat Slug Ball Grid Array散熱片型球閘列封裝)的接線佈局設計, 為了滿足越來越多層化的晶片銲墊接口設計, 接線的複雜度也大為增加, 導致接線又高又長, 除了材料費用增加, 接線間的開短路良率損失也增加, 並且造成作業程序的困難度增高, 進而增加了製造成本.
本論文的“先進疊層晶片封裝的銲線佈局研究”, 改善了接線的設計以及應用在雙層晶片的散熱片型球閘列封裝中, 這個設計因為較短的接線線長而改善了元件的電性特性, 及因為在工作晶片與散熱片間增加了一塊散熱用晶片而擁有較好的散熱特性.
研究分為電性表現模擬(軟體: HF99 v9.0)、散熱表現模擬(軟體: commercial code ANSYS)及模擬實際生產時的產品佈線繪圖(AutoCAD)以及實驗的打線線弧參數的調整(機型及軟體： K&S 8028 Maxum), 並進行SEM分析來確認結果.
依據分析模擬結果,“先進疊層晶片封裝的銲線佈局研究”有三個優點： 降低 40% 熱阻 qJC, 電壓輸出入損失改善了30~40%, 以及因為減短了接線線長由4.5mm到3mm, 節省了1/3 金線材料消耗, 也就是減少了6%的封裝成本.

Modern development of electronic devices requires the integration of more and more powerful functions within the same amount of space. However, this is accompanied by increased difficulties within the manufacturing and packaging processes. A proposal for the arrangement of wire connecting is suggested. In this work, which is to replace the multi-tier design with conventional high & long wire bonding. The advance of bonding layout of the stack die HSBGA (Heat Slug Ball Grid Array) chip assembly can enhance wire bonding with electrical performance by shortening wire length. This promises a better thermal performance of thermal consumption between the function die and heat slugs.
This analysis includes simulations of electrical and thermal performance, as well as simulations of drawing layout for an actual production, the bonding looping parameters optimization, and SEM analysis to confirm the results.
Based on the above analyses, the results reveal three advantages of the proposal of “Advance bonding layout of chip assembly” which are:
(1)reduction of 40% thermal resistance,
(2)θJC voltage insertion loss improvement of 30~40%, and
(3)reduction of the gold wire length from 4.5mm to 3mm, saving 1/3 of gold wire consumption. Overall, assembly costs can be reduced by 6%.

中文摘要……………………………………………………………I /2 Abstract………………………………………………………………II /3
Contents……………………………………………………………III /5 Chapter 1. Introduction………………………………………………10
Chapter 2. New package layout proposal……………………………..21 Chapter 3. Experiment ………………………………………………..25 3-1 Material preparation…………………………………………….23 3-2 Thermal performance Simulation……………………………….29
3-3 Electrical performance Simulation………………………………35
Chapter 4. Results and Discussions…………………………………...37 4-1 Electrical and thermal performance………………………………37 4-2 Package assembly price cost down performance……….…………43 Chapter 5. Summary…………………………………………………45 Reference……………………………………………………………..46

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