論文使用權限 Thesis access permission:校內校外完全公開 unrestricted
開放時間 Available:
校內 Campus: 已公開 available
校外 Off-campus: 已公開 available
論文名稱 Title |
無鉛 Ultracsp電子元件之可靠度測試改善 Reliability Improvement for Lead Free UltraCSP |
||
系所名稱 Department |
|||
畢業學年期 Year, semester |
語文別 Language |
||
學位類別 Degree |
頁數 Number of pages |
70 |
|
研究生 Author |
|||
指導教授 Advisor |
|||
召集委員 Convenor |
|||
口試委員 Advisory Committee |
|||
口試日期 Date of Exam |
2004-01-13 |
繳交日期 Date of Submission |
2004-02-12 |
關鍵字 Keywords |
無鉛、晶圓、可靠度、封裝 lead free, sem, reliability, ultracsp |
||
統計 Statistics |
本論文已被瀏覽 5687 次,被下載 11318 次 The thesis/dissertation has been browsed 5687 times, has been downloaded 11318 times. |
中文摘要 |
電子封裝產品之可靠度測試一直以來皆為電子業界導入新產品的重要指標,其測試結果直接影響產品實際運用及市場需求。目前全球環保組織對無鉛製程已有明確規範,電子產品勢必將全面導入無鉛製程及材料,對於無鉛製程的研究改善更甚重要。本研究導入目前現階段使用於晶圓級產品- Ultra CSP 的無鉛錫球產品,進行可靠度分析、測試。 導入測試的無鉛錫球共有 Sn/Ag4.0/Cu0.5、Sn/Ag2.6/Cu0.6 與Sn/Cu0.75 三種材料。其中 Sn/Ag4.0/Cu0.5 使用兩種不同理論的迴焊加熱曲線作分析比較。實驗目的主要在於研究迴焊加熱曲線改善的導入可行性及對產品影響,另外其產品經過可靠度測試後的機械性質 趨勢,配合 IMC 的觀察,從而獲得改善無鉛產品可靠度的方法與無鉛材料的特性。由實驗結果得知: Sn/Ag4.0/Cu0.5 錫球於使用改善後的迴焊加熱曲線於裸晶片測試後錫球剪力測試值與原製程產品相比於 HTST、TCT 及 TST 項目中在 500 cycles循環測試後,錫球剪力測試值大於原製程產品,顯示抗疲勞性較佳。而完整封裝晶片測試 (Board Level Test) 結果則顯示增加 144 cycles 的週期。 使用 Sn/Ag2.6/Cu0.6、Sn/Ag4.0/Cu0.5 無鉛錫球的產品,兩者在Package Level Test 與 Board Level Test 均有相近的測試值。 |
Abstract |
1.Sn/Ag4.0/Cu0.5 solder with better performance by the improved reflow profile. 2.The Sn/Ag2.6/Cu0.6、Sn/Ag4.0/Cu0.5 with similar reliability test performance. |
目次 Table of Contents |
LIST OF FIGURE CAPTIONS III LIST OF TABLE CAPTIONS VI LIST OF ACRONYMSI VII CHINESE ASTRACT XI CHAPTER 1 INTRODUCTION1 1-1 Background 1 1-2 Wafer level package assembly technology 4 1-3 Structure analysis 8 1-4 Process parameter analysis 13 1-5 The research and development direction 14 CHAPTER 2 RELIABILITY TEST 16 2-1 Reliability test 16 2-2 The test items for reliability 20 2-2-1 Precondition test 20 2-2-2 Temperature cycle test 21 2-2-3 High temperature storage test 23 2-2-4 Pressure cooker test 23 2-2-5 Highly Accelerated Temp & Humidity Stress test 24 2-3 The failure mode evaluation methods of reliability test 25 CHAPTER 3 EXPERIMENT DESIGN 27 3-1 Test equipment 27 3-2 Board level test sampler 29 3-3 Test items 29 3-3-1 Bare die test 29 3-3-2 On-board test evaluation 32 3-3-3 Solder sphere shear test 33 3-3-4 Test samplers grinding and polishing 33 3-3-5 The analysis by the Scanning Electronic Microscope (SEM) 33 CHAPTER 4 TEST RESULTS 41 4-1 Package level test 41 4-1-1 The reflow profile optimization for Sn/Ag4.0/Cu0.5 41 4-1-2 The SAT test items 42 4-1-3 The sphere shear test after package reliability items 42 4-1-4 The IMC growing status evaluations 44 4-1-5 The metal distribution evaluations 45 4-2 Board level test 45 CHAPTER 5 CONCLUSIONS 66 5-1 Conclusions 66 5-2 Future research topics 67 BIBLIOGRAPHY 68 LIST OF FIGURE CAPTIONS Fig.1-1 Comparison among different packages 5 Fig.1-2 Applied for memory EEPROM 6 Fig. 1-3 Products applied with Wafer level package 6 Fig. 1-4 The total forecast of CSP package type distribution 2001- 2006 9 Fig.1-5 Wafer level CSP forecast turnover and total volume 9 Fig.1-6 BCB (BenzoCycloButene) monomer structure 10 Fig.1-7 Basic wafer structures 12 Fig.2-1 Bathtub curve of the life period 17 Fig.2-2 Crack caused by solder fatigue 19 Fig.2-3 TCT cycle time VS temperature profile 22 Fig.2-4 TCT influence in package 22 Fig.2-5 Production corrosion after PCT 24 Fig.3-1 Bare die test flow and items description 31 Fig.3-2 Process flow for Board level TCT test 32 Fig.3-3 The appearance of bare die 34 Fig.3-4 Dage 2400A shear test machine 35 Fig.3-5 The X-ray equipment 35 Fig.3-6 Sikama SBM360 reflow 36 Fig.3-7 Test board 36 Fig.3-8 Test sample on board 37 Fig.3-9 Grinding and polishing machine 37 Fig.3-10 SEM & EDX machine 38 Fig.3-11 The SAT machine 38 Fig.3-12 Optical microscope 39 Fig.3-13 The reflow profile curve 39 Fig.3-14 Cross-sectional view structure of solder sphere 40 Fig.3-15 Solder sphere shear simulation diagram 40 Fig.4-1 The X-ray inspection photo for Sn/Ag4.0/Cu0.5 in reflow profile (a) right site (b) left site (c) up site (d) down site ………………………… 48 Fig.4-2 The X-ray inspection photo for Sn/Ag4.0/Cu0.5 in reflow profile (a) right site (b) left site (c) up site (d) down site 49 Fig.4-3 (a) Solder composition Sn/Ag2.6/Cu0.6 SAT photo 50 Fig.4-3 (b) Solder composition Sn/Cu0.75 SAT photo 51 Fig.4-3 (c) Solder composition Sn/Ag4.0/Cu0.5 processed in the 1st reflow SAT photo 52 Fig.4-3 (d) Solder composition Sn/Ag4.0/Cu0.5 processed in the 2nd reflow SAT photo 53 Fig.4-4 (a) TST and HTST shear value tendency and CPK chat 55 Fig.4-4 (b) THT and PCT shear value tendency and CPK chat 56 Fig.4-4 (c) TCT shear value tendency and CPK chat 57 Fig.4-5 IMC status and shear failure mode for lead free solder 58 Fig.4-6(a) IMC status for lead free solder by SEM 59 Fig.4-6(b) IMC thickness comparison, for Sn/Ag4.0/Cu0.5 in reflow profile 1 and profile 2 during TCT 300 cycles 60 Fig.4-6(c) IMC thickness comparison, for Sn/Ag4.0/Cu0.5 in reflow profile 1 and profile 2 during TCT 1000 cycles 61 Fig.4-7(a) EDX analysis for Sn63/Pb37 and Sn/Ag2.6/Cu0.6 62 Fig.4-7(b) EDX analysis for Sn/Ag4.0/Cu0.5 and Sn/Cu0.75 63 Fig.4-7(c) EDX analysis for Sn/Cu0.75 64 Fig.4-8 Board level test result 65 LIST OF TABLE CAPTIONS Table 1-1 Common lead free alloy metals 3 Table 1-2 Comparison table with Flip Chip package 7 Table 2-1 Items of ASE reliability test 26 Table 4-1 The reliability tests result 47 Table 4-2 Solder sphere shear value 54 LIST OF ACRONYMS 1 ASE Advanced Semiconductor Engineering company 2 BCB BenzoCycloButene material 3 BGA Ball Grid Array Package 4 CSP Chip Scale Package 5 DAS Data Analysis System 6 DNP The Distance to Neutral Point for package 7 EIAJ Electronic Industries Alliance Japan 8 FCOB Flip Chip On Board 9 FCT Flip Chip Technologies company 10 FITS Failure In Times 11 HTST High Temperature Storage Test 12 IC Integrated Circuit 13 IMC Intermetallic Compound 14 JEDEC Joint Electron Device Engineering Council 15 MEMS Micro-Electro Mechanical System 16 MOEMS Micro-Optical Electro Mechanical System 17 MTBF Mean Time Between Failure 18 MTTF Mean Time To Failure 19 PCT Pressure Cooker Test 20 RDL Repeat Distribution Layer structure 21 RoHS Restriction of Hazardous Substances 22 SAT Scanning Acoustic Tomogram 23 SEM Scanning Electronic Microscope 24 SMT Surface Mount Technology 25 TCT Temperature Cycling Test 26 THB Temperature Humidity Bias Test 27 TSOP Thin Small Outline Package 28 TST Thermal Shock Test 29 UBM Under Bump Metallurgy 30 WBGA Wire Bounding Ball Grid Array package 31 WCSP Wire Bounding Chip Scale package 32 WEEE Waste Electrical and Electronic Equipment 33 WLP Wafer Level Package |
參考文獻 References |
1. B. Salam, N. N. Ekere, D. Rajkumar “Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of solder Volume on Intermetallic Layer Formation” Electronic Components and Technology Conference (2002) 2. V. Patwardhan, N. Kelkar, and L. Nguyen “Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability” Electronic Components and Technology Conference (2002) 3. S.J. Cho, J.Y Kim, Myung-Geun Park “Under Bump Metallurgies for a wafer Level CSP with Eutectic Pb-Sn Solder ball” Electronic Components and Technology Conference(2000) 4. T. Hirano, K. Fukuda, K Ito, T.Kiga, Y. Taniguchi “Reliability of Lead Free Solder Joint by Using Chip Size Package” Electronic Components and Technology Conference (2001) 5. European Union Waste in Electrical and Electronic Equipment(WEEE)Directive, 3rd Draft, May 2000. 6. Yifan Guo, Jong-Kai Lin ,Anada De Silva “Reliability Evaluations of Chip Interconnect in Lead-Free solder systems” Electronic Components and Technology Conference(2002) 7. H Gan, KN Tu “Effect of Electromigration on Intermetallic Compound Formation in Pb-free Solder- Cu Interfaces” Electronic Components and Technology Conference (2002) 8. Kulicke & Soffa com “Spheron WLP” May 2002. 9. Hong Yang, Alan Larson, Scott Barrett, Peter Elenius “Reliabilty Evaluation of UltraCSP packages” Components and Technology Conference (2001). 10. D.H. Kim, P. Elenius, and S. Barrett “Solder Joint Reliability and Characteristics of Deformation and Crack Growth of Sn-Ag-Cu Versus Eutectic Sn-Pb on a WLP in a Thermal Cycling Test” IEEE Electronic Components and Technology Conference (2002) 11. eformation and Crack Growth of Sn-Ag-Cu Versus Eutectic Sn-Pb on a WLP in a Thermal Cycling Test” IEEE Electronic Components and Technology Conference (2002) 12. D. H. Kim, P. Elenius“Deformation and Crack Growth Characteristics of SnAgCu vs 63Sn/Pb Solder Joints on a WLP in Thermal Cycle Testing” IMAPS Electronic Components and Technology Conference(2001) 13. K&S Flip Chip Division ” UltraCSP Lead Free Process release“ Patent release paper, June 2002 14. FCD “ FCT Reliability manual ” Electronic Components and Technology Conference (2001) Reliability part I, pp.10-14. 15. Dow Chemical “ Technical data of Benzocyclobutene-based Ploymer “ (2001) 16. 劉立晟“ Flip-Chip Ball Grid Array Lead Free Solder Joint under Reliability Test” 碩士論文,中山大學機械與機電研究所 2003, pp.55-59. 17. National semiconductor “Mounting of Surface Mount device” (Aug.2000) |
電子全文 Fulltext |
本電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。 論文使用權限 Thesis access permission:校內校外完全公開 unrestricted 開放時間 Available: 校內 Campus: 已公開 available 校外 Off-campus: 已公開 available |
紙本論文 Printed copies |
紙本論文的公開資訊在102學年度以後相對較為完整。如果需要查詢101學年度以前的紙本論文公開資訊,請聯繫圖資處紙本論文服務櫃台。如有不便之處敬請見諒。 開放時間 available 已公開 available |
QR Code |