隨著封裝製程的日新月異，以及晶片功能日益強大，在同樣封模的體積中，我們不斷的嘗試盡其所能的將可用之元件植入其中，也相對的，增加了封裝製程之困難度。 從再失敗模式分析中我們觀察到電子封裝膠體內之被動元件有著潛在性之風險，因此嘗試不使用銲錫將被動元件固定於封裝基板上，改由不導電膠材及金線製程取代之，在本次實驗中，我們大膽的將原應用在電路板級的被動元件植入IC封模內並用焊金線製程將其構成通路。 實驗中我們使用了不同的被動元件，利用量測金線拉力值驗證其可行性及製程之穩定度，以期能將此製程加以改良並減少使用者之困擾。

As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New generation of the hybrid IC assembly package has become the major role recently. In order to prevent the package defects occurring in end customer sites, in this paper we try to improve the IC assembly method by using a totally different process to fix the passive component on a BGA substrate. We found that the passive component can be proceeded the current gold wire bonding process.

In case of the Hybrid BGA with the current passive component attaching process, we can find the thermal effect during the surface mount process. Since the solder can be melt every time during each heating process. Therefore, we plan to improve it without solder attachment. The new improvement is to fix the passive component by a non-conductive thermal cure glue. The glue can be done in one time cure, thus the further process would not influence the quality of passive component.

However in the evaluation experiment, the component coated by Gold is the best choice, but we intend to just put it in a comparison model because of the cost consideration. Both works on passive component coated by Gold and Solder were proved. The customer support for the further study on the real products is suggested.

誌謝 …………………………………………………………… 1
目錄 …………………………………………………………… 2
摘要 …………………………………………………………… 4
ARSTRACT ……………………………………………………… 5
第一章 緒論 ………………………………………………… 6
1-1 前言 …………………………………………………… 6
1-2 問題回顧 ……………………………………………… 8
1-3 組織與章節…………………………………………… 10
第二章 混合型封裝技術…………………………………… 12
2-1 球柵列封裝簡述……………………………………… 12
2-2 混合型封裝技術介紹………………………………… 12
2-2-1 混合型封裝的定義……………………………… 13
2-2-2 混合型封的分類………………………………… 13
2-2-3 混合型封裝的優缺點…………………………… 14
2-2-4 目前所遇之問題點……………………………… 16
第三章 實驗工作…………………………………………… 27
3-1 實驗規劃…………………………………………… 27
3-2 機台介紹與實驗流程……………………………… 28
3-3 試片介紹…………………………………………… 29
3-3-1 被動元件簡介……………………………… 30
3-3-2 焊針簡介…………………………………… 33
3-3-3 材料簡介…………………………………… 33
3-3-4 實驗流程…………………………………… 34
第四章 實驗結果…………………………………………… 47
4-1 實驗安排……………………………………………… 48
4-2 實驗數據分析………………………………………… 48
4-2-1 驗證電漿清洗結果…………………………… 48
4-2-2 利用田口式實驗分析求最佳化焊線參數…… 49
4-2-3 最佳化之焊線參數驗證……………………… 52
4-3 實驗現象…………………………………………… 53
4-3-1 被動元件A……………………………………… 53
4-3-2 被動元件B……………………………………… 53
4-3-3 被動元件C……………………………………… 53
第五章 結果與討論…………………………………………… 68
5-1 實驗結果分析………………………………………… 68
5-2 討論…………………………………………………… 69
5-3 未來應用……………………………………………… 69
第六章 結論…………………………………………………… 74
參考文獻 …………………………………………………… 75

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