此論文之目標為提供一個低成本與高性能雷射模組封裝之解決方案，可用於高速光纖通訊、光纖到家(Fiber-To-The-Home)與被動光學網路之應用中。在本研究中實現了「10兆位元之同軸式雷射模組」，「10兆位元雙向光學次模組」及「具有四個10兆位元通道之疏式分波多工(CWDM)雷射模組」。
傳統TO-Can基底由於結構上沒有適當設計因此具有較差之RF傳輸特性。由於較長訊號接腳與打線長度產生凹陷之濾波效應成為主要克服之問題。研究中所提出之同軸式雷射模組採用商業化之TO-Can材料並具有一個內部匹配電阻來降低訊號反射的現象。比較小訊號之模擬與實驗結果得到不錯之一致性。本研究中實現了10兆位元同軸式雷式模組且可以達到OC-192規範之眼圖餘裕31%。
基於成本考量，研究中提出10兆位元雙向光次模組(BOSA)之結構採用商業化較低速155-Mb/s 或是1.25-Gb/s雙向光次模組之設計。提出之雙向光次模組在發射與接受端皆具有清晰的量測眼圖結果。在10公里單模光纖傳輸下具有0.5 dB之功率代價(power penalty)，與0.9dB之串音代價(crosstalk penalty)。根據實驗結果，我們已經成功驗証此高性能與低成本之10兆位元雙向光次模組且證實此雙向傳輸架構用於未來高速光纖到家或是被動式光網路之可行性。
此具有4個10兆位元通道之雷射模組採用現行低成本TO-Can雷射與CWDM技術，並提供一個可應用於40-Gb/s光纖通訊網路之解決方案。此光學模組每個通道具有10兆位元之操作速率，在位元誤碼率(BER)為10-9情況下可以傳輸距離達到30公里。平均之系統光功率損耗約為12dB。本研究中所提出之高性能之40兆位元CWDM模組具有低成本之可能性，並可應用於WDM-PON之光纖到家系統中。

The goal of this dissertation is to provide a solution by using a low-cost and high-performance laser module package for the applications of high-speed optical communication, fiber-to-the-home (FTTH), and passive optical network (PON). A 10-Gb/s coaxial-type laser module, a 10-Gb/s bi-directional optical sub-assembly (BOSA) module, and a 4 channels x 10-Gb/s coarse wavelength division multiplexing (CWDM) laser module have been implemented for this study.
The conventional TO-Can header suffers poor RF transmission characteristics without proper modification. The notch filter effect induced by the parasitic inductance of the long lead and wires is one of its major factors. The proposed coaxial laser module is fitted with a commercial TO-Can with an internal matching resistor of 18Ω to reduce the signal reflection. The comparison of small signal results between the theoretical and the experimental results shows good agreement. The proposed 10-Gb/s coaxial laser module implemented can achieve 31% mask margins with the OC-192 standard.
For cost consideration, the structure of the proposed 10-Gb/s BOSA modules is adapted to the idea of the commercial low bit rate of 155-Mb/s or 1.25-Gb/s BOSA modules. The proposed BOSA modules show a clear opening eye diagrams at both their transmitter and receiver side. The power penalty with a 10-km SMF transmission is 0.5dB and the crosstalk penalty is 0.9dB. According to the experimental results, we have demonstrated successfully the high-performance and the low-cost of 10-Gb/s BOSA modules and verified the feasibility of the bi-directional architecture for use in the future’s high-speed FTTH or PON network applications.
The 4 channel x 10-Gb/s laser modules adapted the existing low-cost TO-Can laser and the CWDM techniques provide one of the solutions for the 40-Gb/s optical communication application. The proposed optical module operating at 10-Gb/s per channel can exceed a rate of over 30 km transmission at the bit-error-rate (BER) of 10-9, with an average system power penalty of 12 dB. The proposed high-performance 40-Gb/s CWDM module shows the low-cost possibility that ensures the application of WDM-passive optical network (WDM-PON) fiber-to-the-home (FTTH) systems.

Abstract
Acknowledgement
Contents…………………………………………………………….. I
List of Figures……………………………………………………… III
List of Tables……………………………………………………….. VII

Chapter 1 Introduction 1
1.1 Background……………………………………………...….. 1
1.2 Motivation (Evolution of Laser Module Package)………………….. 1
1.2.1 DIP or Mini-DIL Package……………………………………. 2
1.2.2 Butterfly Package…………………………………………….. 3
1.2.3 TO-Can Package……………………………………………... 3
1.2.4 Other Modified Laser Module Package for 10 Gb/s Applications…………………………………………………
5
1.3 Different Solutions of the Coaxial-type Laser Modules for High-Speed…………………………………………………………...
6
1.4 Overview of Dissertation……………………………………………. 9
1.5 References…………………………………………………………… 12

Chapter 2 10-Gb/s Coaxial Laser Module Design and Simulation 15
2.1 Equivalent Circuit Model of the High-speed Un-cooled DFB-LD….. 15
2.2 Simulation Results of the High-speed Un-cooled DFB-LD………… 19
2.3 Circuit Modeling of the High-speed Laser Module…………………. 21
2.4 Simulation Results of the Coaxial Laser Module…………………… 29
2.5 Analysis and Optimization of Present 10-Gb/s
Laser Module Package………………………………………………
33
2.6 References...…………………………………………………………. 41

Chapter 3 10-Gb/s Coaxial Laser Module Package and Results 43
3.1 Laser module package processes……………………………………. 43
3.1.1 Material prepared…………………………………………….. 43
3.1.2 Die-Bonder System…………………………………………... 45
3.1.3 Wire-Bonder System………………………………………… 49
3.1.4 Laser Welding System……………………………………….. 53
3.2 Fabrication of the Coaxial Laser Module…………………………… 56
3.4 Measurement Results of the Coaxial Laser Module………………… 58
3.5 References…………………………………………………………… 63

Chapter 4 10-Gb/s BOSA Module Package 64
4.1 Introduction of 10-Gb/s BOSA Module……………………………... 64
4.2 Fabrication of 10-Gb/s TO-56 Packaged Distributed Feedback (DFB) Laser Diode…………………………………………………..
65
4.3 Fabrication of 10-Gb/s TO-CAN Packaged PIN-TIA Device………. 67
4.4 Fabrication Processes of BOSA Module…………………………….. 68
4.5 Measurement and Results ………………………...………………… 70
4.5.1 Transmitter of the BOSA module……………………………… 70
4.5.2 Receiver of the BOSA module………………………………… 75
4.6 Summary…………………………………………………………….. 78
4.7 References…………………………………………………………… 80

Chapter 5 40Gb/s Laser Module based on 10-Gb/s Per Channel 82
5.1 Introduction………………………………………………………….. 82
5.2 Fabrication of the DFB laser with collimator output………………... 83
5.3 Structure and Fabrication of the proposed 40-Gb/s CWDM optical module……………………………………………………………….
85
5.4 Measurement Results and Discussion……………………………….. 87
5.4.1 Performance of the DFB lasers………………………………... 87
5.4.2 CW property of the proposed 40-Gb/s CWDM optical module. 89
5.4.3 Eye Diagrams and BER performance of the 40-Gb/s CWDM module…………………………………………………………
91
5.5 Summary…………………………………………………………….. 96
5.6 References..…………………………………………………………. 97

Chapter 6 Conclusions 98
6.1 Conclusion.………………………………………………………….. 98
6.2 Discussion………………………………………….………………... 99
6.2.1 40-Gb/s CWDM-PON network……...………………………... 99
6.2.2 10-Gb/s MMF Transmission…………………………………... 101

Vita 102

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