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論文名稱 Title |
25 Gb/s 低成本光發射次模組構裝之研究 The Study of Cost-Effective 25 Gb/s Transmitter Optical Sub-Assembly (TOSA) Packages |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
133 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2012-04-07 |
繳交日期 Date of Submission |
2012-05-02 |
關鍵字 Keywords |
100 兆位元、25 兆位元、雷射二極體構裝、同軸式雷射模組、光發射次模組 100 Gb/s, 25 Gb/s, Laser diode package, TO-Can laser module, Transmitter optical sub-assembly (TOSA) |
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統計 Statistics |
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中文摘要 |
本論文為高性能及低成本25 Gb/s光發射次模組(TOSA)同軸式構裝之研究,研究方法採用低成本的罐型(TO-Can)材料與構裝製程,及符合成本效益的25 Gb/s直接調變式光發射次模組構裝。本論文研究包括研發高頻寬TO-Can構裝基座與驗證方法、提出三個版本的25 Gb/s TO-Can雷射模組封裝之解決方案、及雷射模組於頻域與時域的電氣特性分析。 傳統TO-Can雷射模組的傳輸頻寬被限制在10 GHz以下,為了克服此限制與找出其解決方法,首先以傳輸線理論分析研討傳統同軸式罐型基座(header)的幾何結構,再藉由三維的電磁模擬軟體模擬基座的電氣特性。針對TO-Can基座開發更準確的驗證方法,其模擬與測量獲得一致性結果及驗證了三維電磁模型的適用性,並確定傳統TO-Can基座頻寬限制在16.7 GHz。本研究第一版本TO-Can基座克服模組結構中阻抗不連續的問題,再採用此TO-Can基座,提出第一版本TO-Can雷射模組構裝方案。接著將模擬特性參數萃取出來,藉由電路模擬工具,整合雷射二極體的小訊號等效電路模型,進而模擬分析整體雷射模組的電氣特性。 由於第一版本TO-Can基座的彎曲針腳與雙層介質的同軸孔徑困難獲得,所以提出第二版本TO-Can基座並以實驗驗證。接著,採用第二版本TO-Can基座及搭配匹配電阻,提出一個25 Gb/s TO-Can雷射模組具有一個內部匹配電阻的構裝方式。此構裝解決方案在考慮打線構裝後的模擬結果,顯示出傳輸頻寬與眼圖皆可達到25 Gb/s的傳輸要求。本研究第三版本25 Gb/s TO-Can雷射模組的構裝方案,是採用第二版本TO-Can基座與一個L型微帶線的氮化鋁基板以打線方式連接基座的訊號針腳,再將3-dB頻寬為21.2 GHz的DFB雷射二極體,建立其小訊號等效電路模型,及使用於此雷射模組的模擬與實作組裝。 本論文所提出的雷射模組係藉由現行的TO-Can與光發射次模組的組裝設備與製程技術完成研製實作,並量測此光發射次模組3-dB頻寬為18.7 GHz。本模組經十公里光纖傳輸後可清楚量測25 Gb/s眼圖與誤碼率,因此本研究成果可應用於新興的25 Gb/s光纖通道、100 Gb/s乙太網路,及下一世代光接取網路的應用需求,進一步透過所提出模擬與驗證技術來協助未來開發各種高速光電元件封裝的設計模擬與性能之評估。 |
Abstract |
A cost-effective 25 Gb/s directly-modulated transmitter optical sub-assembly (TOSA) packaging solutions by transistor outline (TO)-Can materials and processes were proposed and demonstrated. The purpose of this dissertation is to develop a high bandwidth TO-Can header for high-speed laser module, to verify a method, to propose a three-version of 25 Gb/s TO-Can laser module packaging, and to analyze in the frequency-domain and time-domain, and to experimentally demonstrate a 25 Gb/s TOSA. Usually, the transmission bandwidth of a conventional TO-Can laser module is limited below 10 GHz. To overcome this limitation and figure out the solution, firstly, the geometric structure of a conventional TO-56 header was analyzed by using transmission line models and electrical characteristics of the TO-56 header through a three-dimensional electromagnetism full-wave simulation software. The simulated results were in good agreement with the measured results and verify the applicability. Furthermore, we found that the 3-dB bandwidth of a conventional TO-56 header was limited at 16.7GHz. In this study, the first version of TO-Can header V1 was proposed to overcome the problem of the discontinuous impedance. By applying the TO-Can header V1, a TO-Can laser module package was proposed. The electrical characteristics parameters of the TO-Can header V1 were extracted and combined with small-signal equivalent circuit models of laser diode to simulate the electrical characteristics of the entire TO-Can laser module by the circuit simulation tool. Since bent inside feed-leads and two-step coaxial feed-through holes of the TO-Can header V1 were difficult to achieve in our laboratory equipments, the second version of TO-Can header V2 was proposed and verified experimentally. A 25 Gb/s TO-Can laser module with a matching resistor by adopting the TO-Can header V2 was proposed. The simulated results of this solution by considering with bonding-wires showed that the transmission bandwidth and eye diagram could achieve requirements of 25 Gb/s transmissions. Finally, the third version of 25 Gb/s TO-Can laser module adopted the TO-Can header V2 and an AlN submount of L-shaped microstrip line was proposed, fabricated, and measured. A DFB LD chip with a 3-dB bandwidth of 21.2 GHz was modeled and used in the simulation and the fabrication. Due to the parasitic effect induced by bonding-wires and die-bonding structure, the variation of high frequency performance of the laser module was simulated comprehensively. By referring to the proposed structure, a TOSA was fabricated by a conventional TO-Can and TOSA fabrication equipments and processes. The measured 3-dB bandwidth of the TOSA was 18.7 GHz. A clear eye diagrams of 25 Gb/s and BER testing for BTB and SMF transmission were obtained. This cost-effective solution of the TOSA is compatible with existing automatic TO-Can process lines and can be fabricated massively. Therefore, the results of this study of proposed TOSA can be applied in the next generation networks of 100GBASE-LR4, OTU4, and 32GFC. The presented simulation and verified technique may provide sufficient estimation and step-by-step analysis to assist the high-speed and high-density optical communication applications and various product developments in the future. |
目次 Table of Contents |
Abstract Acknowledgement Contents I List of Figures III List of Tables VII Chapter 1 Introduction 1 1.1 Background 1 1.2 Motivation 4 1.2.1 Modified TO-Can Headers for High-Speed Laser Module Package 7 1.2.2 Keys for a High-Speed TOSA of TO-Can Type Package 9 1.3 Overview of Dissertation 10 Chapter 2 Proposal and Analyzed Characteristics of a Large Bandwidth TO-Can Header and First Version TO-Can Laser Module 19 2.1 Analysis and Characterization of a Conventional TO-56 Header 20 2.1.1 The Limitation of the 3-dB Bandwidth of a TO-56 Header 20 2.1.2 The Analysis of the Structure of a TO-Can Header 25 2.2 Proposal of the TO-Can Header V1 30 2.2.1 The Design Structure of the TO-Can Header V1 30 2.2.2 The Frequency Characteristics of the TO-Can Header V1 32 2.2.3 The Equivalent Circuit Model of the TO-Can Header V1 35 2.3 Demonstration of the Characteristics of the TO-Can Laser Modules 36 2.3.1 The Frequency Characteristics of the TO-Can Laser Modules 36 2.3.2 The Frequency Characteristics of the First Version Laser Module under Different Wire Bonding Conditions 40 2.3.3 The Characteristic Analysis of the TO-Can Laser Modules with DFB LD Equivalent Circuit Models 42 2.4 Discussion of Laser Module Driven by Different Source Impedances 47 2.5 Summary 55 Chapter 3 Second Version Proposal of a Low-Cost 25 Gb/s TO-Can Laser Module Packaging 58 3.1 The Second Version TO-Can Header 58 3.1.1 Proposal of the TO-Can Header V2 58 3.1.2 Experiment Result and Verification of the TO-Can Header V2 63 3.2 The Second Version Proposal of a Low-Cost 25 Gb/s TO-Can Laser Module Packaging Built-in a Matching Resistor 69 3.2.1 The Structure of the Second Version TO-Can Laser Module 69 3.2.2 The Demonstration of the Second Version TO-Can Laser Module 71 3.3 Summary 75 Chapter 4 Third Version Proposal of a Low-Cost 25 Gb/s TO-Can Laser Module 77 4.1 The Performance of DFB LD Chip 77 4.1.1 The High Frequency Probing Measurement of DFB LD Chip 77 4.1.2 The Establishment of a DFB LD Equivalent Circuit Model 79 4.2 The Third Version Proposal of a Low-Cost 25 Gb/s TO-Can Laser Module Packaging with an AlN Submounted Microstrip 80 4.2.1 The Structure of Third Version TO-Can Laser Module with an AlN Submounted Microstrip 80 4.2.2 The Different Bonding-Wire Conditions Discussion of the Third Version TO-Can Laser Module 82 4.2.3 Electrical Performance Simulations of the Third Version TO-Can Laser Module under Different Air-gap Conditions 85 4.2.4 Optimal High Frequency Performance and the Eye Diagram Simulations of the Third Version TO-Can Laser Module 87 4.3 Fabrication of the Low-Cost 25 Gb/s TOSA 89 4.4 Measurement Results of the Low-Cost 25 Gb/s TOSA 90 4.4.1 The DC Characteristics of the 25 Gb/s TOSA 90 4.4.2 The High Frequency Characteristics of the 25 Gb/s TOSA 92 4.4.3 The Eye Diagrams of the 25 Gb/s TOSA and Transmission Testing 93 4.4.4 The BER of the 25 Gb/s TOSA and Transmission Testing 95 4.4.5 The Transmission Calculation and Discussion of Power Penalty 96 4.5 Summary 98 Chapter 5 Conclusions 100 5.1 Conclusion 100 5.2 Future Prospect and Development 102 Appendix 106 Curriculum Vitae of Author 115 List of Publications 116 |
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