全像干涉術乃是利用光程差產生干涉條紋以記錄物體之位移量。當全像干涉術於待測物體處於溫度變化環境中進行位移量測時，由於物體光束通過高溫環境，將使得物體光束本身因折射率的變化，產生光程改變，造成物體之位移量與物體光束本身之光程變化量同時記錄於干涉條紋之中。因此，若欲利用干涉條紋分析物體之位移量，則必須將物體光束本身由於位移及折射率之光程變化量分離出。故本文擬利用參考物體之觀念，並藉由實驗安排簡化理論推導，而使位移場與溫度場能由干涉條紋中分離出，以便能利用全像干涉法量測溫度場與位移場共存時之面外位移量。並將其應用於半導體構裝PBGA之翹曲量測。

The main aim of this study is to extending the holographic interferometry technique to measure the out-of-plane displacement of an object subjected to both temperature and displacement field. It is noted that both the out-of-plane displacement and the ambient temperature change can cause image fringes. Therefore, an auxiliary object is used to identify the fringe numbers caused by the ambient temperature change during the experiment. The warpage measurement of a PBGA package is used as an example. It can be shown that the proposed method works

目 錄

謝誌 ………………………………………………………………………I
論文摘要 .………………………………………………………………..II
目錄 …...…………………………………………………………………V
圖目錄 ..…………………………………………………………………IX
表目錄 .…………………………………………………………………XII
符號說明 ...……………………………………………………………XIII


第一章 緒 論 …………………………………………………………1
1-1 前 言 ………………………………………………………….1
1-2 文獻回顧……………………………………………………….2
1-3 各章說明……………………………………………………….5

第二章 實驗與分析理論………………………………………………6
2-1 全像攝影術之概述…………………………………………….6
2-2 全像攝影術之數學模式……………………………………….7
2-2.1 光波之數學表示式…………………………………………..7
2-2.2 物體之記錄過程 …..………………………………………..8
2-2.3 重建過程……………………………………………………..9
2-3 全像干涉術之概述 …………………………………………10
2-3.1 全像干涉術之原理 ……………………………………….10
2-3.2 全像干涉術之方法簡介 ………………………………….10
2-4 全像干涉術之數學模式 ……………………………………12
2-5 變形量與相位角變化之關係式 ……………………………14
2-6 參考物體之選用 ……………………………………………18
2-6.1 參考物體為實心真圓球 ………………………………….18
2-6.2 參考物體為平板 ………………………………………….20
2-6.3 實心真圓球與平板之比較 ……………………………….22
2-7 參考物體條紋靈敏度之驗證 ………………………………22

第三章 實 驗 方 法…………………………………………………36
3-1 實驗設備及架設 …………………………………………….36
3-1.1 實驗儀器設備及用途說明………………………………..36
3-1.2 實驗設備的架設…………………………………………..39
3-2 實驗步驟 …………………………………………………….41
3-3 實驗時應注意事項 ………………………………………….42
3-4 影像處理系統設備之簡介 ………………………………….43

第四章 結果分析及探討 ……………………………………………51
4-1 參考物體之面外位移量測 …………………………………51
4-1.1 實驗目的與方法………………………………………….51
4-1.2 實驗結果………………………………………………….52
4-2 實心圓球之驗證 ……………………………………………52
4-2.1 驗證目的與方法………………………………………….52
4-2.2 驗證結果………………………………………………….53
4-3 平板之驗證 …………………………………………………54
4-3.1 驗證目的與方法………………………………………….54
4-3.2 平板有無塑性變形之實驗結果 ………………………...54
4-3.3 平板於225℃時變形之有限元素法模擬結果 ………….55
4-3.4 平板之面外位移量測結果 ……………………………...56
4-4 半導體構裝PBGA之翹曲量測 ……………………………58
4-4.1 實驗目的與方法………………………………………….58
4-4.2 實驗結果 ………………………………………………...59
4-5 實驗結果誤差原因之探討 …………………………………60

第五章 結論、建議與展望 …………………………………………77
5-1 結論 …………………………………………………………77
5-2 建議 …………………………………………………………78
5-3 展望 …………………………………………………………78
參考文獻…………………………………………………………………79

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