本論文分為兩大主題，第一個主題為研究銀的合金線(例如，銀-金-鈀和銀鈀)在高頻時的特性。在攝氏溫度20度時，銀、金和鈀的電阻率分別為1.587 Ω•cm、2.214 Ω•cm和10.54 Ω•cm。根據銀金鈀和銀鈀合金鎊線的冶金分佈，可以知道鎊線在高頻中會有急劇的變化。例如，如果鈀分佈在線的表面上時，此合金線的表面阻抗會隨著頻率上升而急劇上升。我們使用安捷倫的向量網路分析儀(VNA)，量測磅線的S參數從10 MHz到67 GHz，量測範圍已遠超過其第一個共振頻率。然後再將其S參數轉換成等效電路萃取出其在不同頻率時的R，L和C的值。本論文也針對鈀的合金線分佈做射頻特性的影響做研究，如此可以分析銀鈀合金在不同比例和不同摻雜方式下的可靠度及高頻特性，有助於最佳化以銀為主要成分的合金鎊線。研究中發現，鈀的比例為3.5%時電阻的上升速率最為緩慢，可以推測鈀的分部較靠近線材的內部。本論文第二個主題為毫米波60 GHz Yagi 天線設計，我們研究引向子長度與頻率的關係，發現引向子越長針對的頻率將越低，但引向子亦為一個耦合元件長度越長時，天線與引向子之間的耦合量會增加，使阻抗匹配變差。一般的設計為了達成良好的匹配會使用較短的耦合元件，但犧牲天線的增益。而本設計透過彎折偶極天線即便加長了引向子，也能有效的控制天線與引向子之間的耦合量，使八木天線整個頻段內增益提升。量測結果，本設計在60 GHz天線增益為8.85 dB，阻抗匹配的部分從53.5 GHz~67 GHz以上都在-10 dB以下，與模擬結果相符。

This thesis treats two main topics. The first topic is an investigation of high frequency characteristics of Ag alloys, for example, Ag-Au-Pd and Ag-Pd. At 20°C, the electrical resistivity of pure Ag, Au, and Pd is 1.587 Ω•cm, 2.214 Ω•cm, and 10.54 Ω•cm, respectively. Depending on the metallurgical distribution of Pd in the Ag-Au alloy or Ag alloy wire bonds, the high frequency behaviors of the wire bond could vary drastically. For example, if Pd is distributed mainly on the surface, the surface impedance of the Ag-alloy wire bond could be drastically increased as the frequency is increased. Agilent’s Vector Network Analyzer (VNA) was used to obtain the S-parameters up to 67 GHz, well beyond the first resonance frequency. R, L, and C were extracted by converting the measured S-parameters. We report the effects of Pd distribution on the RF characteristics (due to the skin effect) of the Pd coated/doped Ag alloy wire bonds. Analyzing the high frequency characteristics along with reliability assessment of Pd coated/doped Ag-alloys, an optimized Ag-based wirebonds can be picked. In our study, data set#8(Pd：3.5% wt) had the least increase. It may indicate that at this composition, Pd may be distributed in-ward. The second topic is design of a millimeter wave 60 GHz Yagi antenna. We studied the relationship between the director's length and frequency. We found that the length of the director affected the resonance frequency, and the director is a coupling element. Therefore, The coupling is increased when the length of the director is increase, resulting in a poor impedance matching. In order to achieve good impedance matching, the conventional design uses a shorter coupling element, but, a lower gain of the antenna. Through our bent dipole antenna design, we can effectively control the coupling between the dipole and the director. As a result, we were able to enhance the gain over the entire band. The measured gain of the Yagi antenna was 8.85 dB at 60 GHz. The measured bandwidths from return loss less than -10 dB were both within the 60 GHz band (53.5 GHz~ up to 67 GHz) ranges. It's agrees with simulation.

論文審定書 i
誌謝 ii
摘要 iv
Abstract v
目錄 vii
圖目錄 ixx
表目錄 xii
第一章 緒論 1
1.1 研究背景及動機 1
1.2 章節概要 2
1.3 合金線簡介 2
1.4 60GHz技術發展與簡介 3
第二章 銀合金之鎊線高頻特性探討 5
2.1 前言 5
2.2 晶片互連技術介紹 5
2.2.1 Flip Chip 6
2.2.2 TSV 8
2.2.3 Wire bonds 15
2.3 載板設計及量測方法 18
2.4 等效模型建立及參數萃取 22
2.5 結果與討論 25
第三章 毫米波60 GH天線設計 32
3.1 前言 32
3.2 八木天線介紹 32
3.3 PCB基板參數之萃取 37
3.3.1 萃取方法 39
3.3.2 基板參數之萃取 41
3.4 60 GHz八木天線 43
3.4.1 單頻巴倫器設計 43
3.4.2 八木天線設計 45
3.5 彎折偶極天線之八木天線 51
3.5.1 加長耦合元件之討論 51
3.5.2 彎折偶極天線之八木天線設計 53
第四章 結論及未來工作 60
參考文獻 62


圖目錄

圖2.1 封裝功能目示意圖 6
圖2.2 (a) QFN Package (b) Flip-Chip 7
圖2.3 覆晶封裝製造流程 7
圖2.4 多晶片模組 9
圖2.5 (a) 2D-IC (b) 2.5D-IC (c)3D-IC 10
圖2.6 TSV 製作流程 11
圖2.7 TSV製作流程之比較 12
圖2.8 3D-IC之訊號傳輸示意圖 13
圖2.9 TSV Channel Loss之測試(a)結構A (b)結構B 14
圖2.10 TSV Channel Loss之量測結果(a)結構A (b)結構B 14
圖2.11 Wire Bonds 側視圖 15
圖2.12 KNS IConn wire bonder 16
圖2.13 (a)楔型接合(b)球型接合 17
圖2.14 典型Wire bonds 側視圖 18
圖2.15 量測中的鎊線俯視圖 19
圖2.16 CPWG Pad俯視圖 19
圖2.17 Ag-Wire bonds 電阻值 21
圖2.18 Ag-Wire bonds 電感值 21
圖2.19 Ag-Wire bonds 電容值 21
圖2.20 Wire bonds T-model 22
圖2.21 Wire bonds -model 23
圖2.22 -model與〖 Y〗_1 〖，Y〗_2，Y_3 24
圖2.23 -model 對應的元件 24
圖2.24 Data6的S11到67GHz 26
圖2.25 Data6的電阻到67GHz 26
圖2.26 Data6的電感到67GHz 27
圖2.27 Data6的S11到5GHz 27
圖2.28 Data6的電容到5GHz 28
圖2.29 Data6的電阻到5GHz 29
圖2.30 Data6的電感到5GHz 29
圖2.31 不同Data的電阻率與3GHz的RF電阻比較圖 30
圖3.1 (a)偶極天線基本架構 (b)偶極天線電流分佈圖 33
圖3.2 偶極天線長度L (a)0.5λ(b) 1λ(c) 1.5λ 34
圖3.3 加上引向子之八木天線 (a)架構圖 (b)H-plane 35
圖3.4 加上反射子之八木天線 (a)架構圖 (b)H-plane 36
圖3.5 加上引向子及反射子之八木天線 (a)架構圖 (b)H-plane 36
圖3.6 反射子與偶極天線的距離和增益的關係圖 37
圖3.7 引向子數目與增益關係圖 37
圖3.8 (a)操作於TE10 mode之矩形波導管(b)操作於TEM mode之同軸線 38
圖3.9 典型平板傳輸線(a)帶狀線(b)微帶線(c)槽線 38
圖3.10 兩不同長度50ohm傳輸線 39
圖3.11 CPWG結構之剖面圖 41
圖3.12 (a) EM模擬結構圖 (b) 實際成品圖 41
圖3.13 兩傳輸線S21之相位差 42
圖3.14 基板之相對介電常數 42
圖3.15 單頻巴倫電流分佈及尺寸 44
圖3.16 單頻巴倫振幅不平衡 44
圖3.17 單頻巴倫相位不平衡 44
圖3.18 偶極天線加反射板 (a)正面 (b)反面 45
圖3.19 偶極天線加反射板的S11 46
圖3.20 加入引向子天線 46
圖3.21 天線反射板調整 46
圖3.22 Yagi天線詳細尺寸規格 46
圖3.23 模擬Yagi天線之S11 47
圖3.24 3D場型模擬圖 47
圖3.25 八木天線實做圖(a)正面 (b)反面 (c)與中華民國壹元硬幣比較圖 49
圖3.26 天線S11模擬與量測圖 49
圖3.27 八木天線場型與模擬比較圖 50
圖3.28 頻率對+Y方線增益曲線圖 50
圖3.29 引向子由1.3mm加長至1.5mm 51
圖3.30 1.3mm與1.5mm頻率對+Y方線增益曲線圖 52
圖3.31 不同長度的引向子對S11的影響 52
圖3.32 彎折偶極天線示意圖 53
圖3.33 偶極天線不同彎折角度對S11的影響 54
圖3.34 偶極天線不同彎折角度對H-plane場型的影響 54
圖3.35 彎折偶極天線之八木天線詳細尺寸規格 55
圖3.36 彎折偶極天線之八木天實做圖(a)正面(b)反面(c)與壹圓硬幣比較圖 55
圖3.37 Yagi與彎折偶極天線之Yagi頻率對+Y方線增益曲線圖 56
圖3.38 彎折偶極天線之八木天線的S11模擬量測比較圖 57
圖3.39 彎折偶極天線之八木天線場型模擬與量測比較圖 57
圖3.41 60 GHz天線場型量測圖 58




表目錄

表2.1 Intermediate Interconnect Level 3D-SIC Roadmap 12
表2.2 TSV Channel測試結構之相關物理參數 13
表2.3 量測鎊線的組成、線徑和電阻率 20
表2.4 萃取R、L和C，在3GHz 30
表2.5 萃取R、L和C，在20GHz 30
表2.6 不同比例銀鈀合金線電阻值多組量測比較表 31
表3.1 式(3.10)中A的各符號表示式 40
表3.2 Rogers 6202之基板參數 41
表3.3 相關文線比較 59

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