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論文名稱 Title |
半導體IC封裝於濕熱作用下之可靠度研究 Reliability Study of IC Packages with Hygrothermal Effect |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
117 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2007-05-23 |
繳交日期 Date of Submission |
2007-05-29 |
關鍵字 Keywords |
IC封裝、挫曲、溫度、濕度、模糊、介面強度、多重品質性質指標 IC packages, buckling, temperature, moisture, fuzzy, interfacial adhesion, multiple performance characteristics index |
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統計 Statistics |
本論文已被瀏覽 5659 次,被下載 1969 次 The thesis/dissertation has been browsed 5659 times, has been downloaded 1969 times. |
中文摘要 |
IC封裝受吸濕與回焊 (IR-Reflow) 溫度影響的可靠度在IC封裝製造是一很重要的課題。在此論文中有兩個重要議題;即探討薄IC封裝的翹曲與IC封裝界面性能受濕熱環境影響。從薄IC封裝發生翹曲方面來看,當構裝體黏置 (mounted)到印刷電路板時,由於層與層之間材料的熱膨脹係數與濕度膨脹係數的不匹配會導致翹曲。從IC封裝的界面性能方面的觀點,存有瑕疵 (defects) 的IC封裝體在高溫高濕條件下會漸漸失去其介面強度。文中將不含錫球的薄IC封裝體簡化成受到溫濕力作用下的複合材料薄板,其中薄板分兩種;1. 沒有翹曲初值 (initial perfect),2.含有翹曲初值 (initial imperfect)。文中將推導翹曲的穩定度方程式,並且求得其解析解,再利用解析解作數值化的電腦模擬,最後求其臨界吸濕量與達臨界吸濕量前的翹曲值。文中理論推導所獲得的IC封裝溫濕挫曲的現象,再經過陰影疊紋 (shadow moiré) 實驗圖確認。根據實驗數據與理論模擬結果顯示,塑膠連結墊格陣列構裝 (PBGA) 的薄IC封裝試片是一種具有微小翹曲初值的複合材料之薄板。以IC封裝介面性能而言,模糊控制器可用來平衡多重品質性質指標特性之間的關係;即文中將鈕扣型剪應力實驗 (button shear test) 試片之吸濕量與介面強度,此兩種非可控參數指標將結合成唯一的一個總性能指標。雖然田口法可以經過參數設定減少系統性能對變異源頭的影響而找到最佳品質的參數組合,然而模糊邏輯的應用是結合作者對IC封裝製程的理解與知識。因此,控制器的性能是依歸屬函數而變化,模糊控制器結合田口法的參數設計可以用來決定歸屬函數;也就是用來得一個總性能指標與最具影響的參數組合。 |
Abstract |
It is an important issue for manufacturing and operation to formulate reliability about the effects of the moisture absorption and IR reflow parameters on IC packages. Two problems, the warpage of the thin IC package, and characterizing the adhesion features of IC package’s interface, are studied in this dissertation. In a thin IC package, the CTE and CHE mismatch between materials are primarily attributed to the warpage which occurs when the package is being mounted on a PCB. The existence of defects in the corresponding interfaces can gradually degrade the interfacial adhesion when IC package is exposed to the high temperature and humidity. In this dissertation, the stability equations for the warpage in a thin IC package without the solder balls being subjected to hygrothermal loading, by modeling it as an initially perfect/imperfect composite plate, is developed. The analytical closed-form solutions are found and used to compute not only the critical moisture content but also the warpage occurrence before the critical loads are reached. The hygrothermal buckling phenomenon is checked by shadow moiré whole-field maps with different moisture content. The results indirectly indicate that the thin PBGA package has little imperfection. For characterizing the adhesion features of IC package’s interface, the fuzzy controller is used to stabilize multiple performance characteristics, i.e., the moisture weight gain and adhesion strength, for the button shear test specimen. Parameters design, although based on the Taguchi method, can optimize the performance characteristic through the setting of process parameters and can reduce the sensitivity of the system performance to sources of variation. The control rules of the fuzzy controller were formed using the author’s experience and knowledge of IC packaging process. The control parameters to be tuned were the membership functions. Therefore, the controller’s performance depended on the membership functions. The fuzzy controller combined Taguchi parameter design, which makes the control performance insensitive to the operating condition change and noise, was used to determine the membership functions. |
目次 Table of Contents |
Contents Abstract ……………………………………………………………………… iv List of Tables ……………………………………………………………… vii List of Figures ……………………………………………………………… ix Nomenclature ……………………………………………………………… xi Chapter 1 Introduction …………………………………………………… 1 1.1 Background ……………………………………………………… 1 1.2 Review of literature ……………………………………………… 4 1.2.1 IC package technologies …………………………………… 4 1.2.2 Warpage of IC packages subjected to hygrothermal loading 5 1.2.3 Adhesion features of bonded interfaces of IC packages …… 7 1.3 Objectives of dissertation ……………………………………… 11 1.4 Scopes of dissertation …………………………………………… 11 Figures ………………………………………………………………… 13 Chapter 2 Warpage of IC Packages Subjected to Hygrothermal Loading …………………………………………………… 15 2.1 Introduction …………………………………………………… 15 2.2 Formulation …………………………………………………… 16 2.2.1 The warpage before buckling …………………………… 20 2.2.2 Buckling of an initially perfect package ………………… 21 2.2.3 Buckling of an initially imperfect package ……………… 24 2.3 Experimental analysis ………………………………………… 30 2.3.1 Materials and specimens ………………………………… 30 2.3.2 Moisture absorption measurement ……………………… 31 2.3.3 Experimental setup ……………………………………… 32 Tables ……………………………………………………………… 34 Figures ……………………………………………………………… 41 Chapter 3 Adhesion Features of Bonded Interfaces of IC Packages … 42 3.1 Introduction …………………………………………………… 42 3.2 Experiment analysis …………………………………………… 43 3.2.1 Materials and specimens ……………………………… 43 3.2.2 Preconditioning and simulating soldering temperature cycle 44 3.2.3 Button shear test ………………………………………… 44 3.2.4 Setting the levels of bonded interfaces parameters ……… 45 3.3 Methods of analysis …………………………………………… 45 3.3.1 Orthogonal array experiment …………………………… 45 3.3.2 Analysis of variance (ANOVA) ………………………… 46 3.3.3 Fuzzy logic ……………………………………………… 50 Tables ……………………………………………………………… 54 Figures ……………………………………………………………… 60 Chapter 4 Results and Discussions …………………………………… 67 4.1 Buckling and warpage behaviors of IC packages subjected to hygrothermal loading …………………………………………… 67 4.2 Multiple performance characteristics of bonded interfaces of IC packages ……………………………………………………… 71 Tables ……………………………………………………………… 75 Figures ……………………………………………………………… 84 Chapter 5 Summary and Future Prospects ………………………… 89 5.1 Summary ……………………………………………………… 89 5.2 Future prospects ……………………………………………… 91 References ………………………………………………………………… 92 Vita ……………………………………………………………………… 98 |
參考文獻 References |
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