本論文主要分為五個章節。
第一章首先介紹封裝的發展方向以及本論文的動機。
第二章為高頻封裝之探討與傳輸介面種類的介紹，主要介紹一些應用於高頻
封裝的互連技術，包括覆晶(Flip-Chip)封裝、微型化同軸線以及TSV (Through
Silicon Via)等等，並且同時簡述了這些封裝技術的優缺點以及使用於高頻上可能
會遇到的問題及解決方式。
第三章為毫米波頻段之四方平面無引腳封裝特性的萃取及訊號完整性分析，
首先對於圓形鎊線及帶狀鎊線進行一些探討，包括寄生效應以及集膚效應等等。
接著則是比較了圓形鎊線及帶狀鎊線應用於四方平面無引腳封裝上的傳輸特性，
同時也比較了不同打線方式對於傳輸特性的影響。而由於我們必須對載板的走線
及其它一些不需要的效應做去嵌化，因此對於我們所使用的去嵌化技術之精準度
也有做一探討。
第四章為應用背板挖地結構傳輸線於四方平面無引腳封裝結構上並使其頻寬
延伸之方法，首先介紹背板挖地結構傳輸線的一些特性，接著是將它實際應用到
封裝上進行匹配，使封裝的使用頻寬進一步的延伸。最後則是將其實現出來並進
行量測，量測證明，QFN 封裝在傳輸係數方面以-1.5dB 來看的話，其頻率點大約
座落在61.6 GHz，而在反射係數方面，若以-10dB 來看的話，則頻率點大約座落
在65.6 GHz。並且，若我們以S21的-1.5 dB來定義QFN封裝的使用頻寬的話，則
該QFN封裝的使用頻寬至少有61 GHz。
第五章為結論與未來工作。

This thesis includes five chapters.
Chapter I, background and motivation in this thesis are introduced.
Chapter II addresses IC package characteristics and the interface between chip and
package at millimeter-wave frequencies. We review several advanced packages and
their interconnections processes, including Flip-chip, MicroCoax and TSV (Through
Silicon Via) etc. Also briefly described are advantages, disadvantages and technology
challenges of these packages at high frequencies.
Chapter III focuses on QFN (Quad Flatpack No-leads) package and its signal
integrity at millimeter-wave frequencies. First of at all, we investigated parasitic
inductance of wire-bond and its skin effect. Then, we compare the transmission
characteristics of Round-wire and Ribbon-wire in QFN package. We also compare
different bonding configurations and its impacts on transmission characteristic. Since
de-embedding are needed to analyze the discontinuities, they are introduced accordingly.
Chapter IV uses a defected ground structure (DGS) transmission line (T-Line) in
QFN’s structure to extend its operation bandwidth. To begin with, transmission line
with a DGS is studied. Then, we are using the transmission line - DGS to achieve best
transmission matching characteristics. Finally, we fabricated and validated our method
through measurement results. The measurement result shows of QFN package has S21
below -1.5 dB at 61.6 GHz and S11 better than -10 dB at 65.6 GHz. The QFN packages
can be operated up to 61 GHz.
Chapter V conclusions and future work are given.

誌謝 .................................................................................................................................. I
摘要 ................................................................................................................................. II
Abstract ........................................................................................................................... III
圖表目錄 ........................................................................................................................ VI
第一章緒論 .............................................................................................................. 1
1.1 研究背景與動機 .......................................................................................... 1
1.2 QFN封裝之介紹 ......................................................................................... 2
1.3 論文章節規劃 .............................................................................................. 4
第二章高頻封裝之探討與傳輸介面種類的介紹 .................................................. 5
2.1 前言 .............................................................................................................. 5
2.2 Liquid Crystal Polymer (LCP) Package ....................................................... 5
2.3 Flip-Chip ....................................................................................................... 8
2.4 MicroCoax之互連技術 ............................................................................. 10
2.5 Through Silicon Via (TSV) ........................................................................ 13
第三章毫米波頻段之QFN封裝特性萃取及訊號完整性分析 .......................... 20
3.1 前言 ............................................................................................................ 20
3.2 圓形鎊線及帶狀鎊線之寄生元件的萃取 ................................................ 20
3.2.1 圓形鎊線之模擬環境及模擬結果 ................................................ 21
3.2.2 帶狀鎊線之模擬環境及模擬結果 ................................................ 23
3.2.3 集膚效應 ........................................................................................ 25
3.3 PCB基板參數之萃取 ................................................................................ 28
3.3.1 萃取方式 ........................................................................................ 29
3.3.2 基板參數之萃取 ............................................................................ 31
3.3.3 模擬及量測結果 ............................................................................ 32
3.4 TLL (Through-Line-Line)去嵌化技術之探討 .......................................... 34
3.4.1 雙埠網路之分析 ............................................................................ 35
3.4.2 準確度探討 .................................................................................... 37
3.4.3 載板走線之萃取 ............................................................................ 41
3.5 QFN應用於毫米波頻段之特性探討 ....................................................... 43
3.5.1 迴流路徑之改善 ............................................................................ 44
3.5.2 圓形鎊線及帶狀鎊線之特性比較 ................................................ 50
3.5.3 實作及量測結果 ............................................................................ 53
第四章應用DGS於QFN封裝結構並使其頻寬延伸之方法 ............................. 57
4.1 前言 ............................................................................................................ 57
4.2 背板挖地結構傳輸線之特性 .................................................................... 58
4.3 應用背板挖地結構於QFN封裝上之探討 .............................................. 65
4.3.1 背板挖地結構之設計 .................................................................... 65
4.3.2 EM模擬之結果 ............................................................................. 71
4.4 實作及量測結果 ........................................................................................ 75
第五章結論與未來工作 ........................................................................................ 77
參考文獻 ........................................................................................................................ 79

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