本論文係針對車用電子之IC設計進行相關研究，其中包含兩個主題：適用 FlexRay系統具過壓保護之接收器，以及電池管理系統之8:1高壓類比多工器。

第一個主題為一適用FlexRay系統具過壓保護之接收器，本設計係一應用於FlexRay規格之匯流排驅動器中之接收器，係符合FlexRay Ver. 3.0.1規格，其傳輸速率可達10 Mbps，輸入共模電壓範圍為 -10 V ~ +15 V，並可操作於 -40 °C ~ +150 °C之環境。此接收器包含一過壓保護電路，可防止至多 ±60 V之輸入過壓而造成晶片損壞。整體電路以TSMC 0.18 μm CMOS HV mixed-signal based generationⅡBCD 製程實現。

第二個主題係提出一電池管理系統之8:1高壓類比多工器，此高壓類比多工器可應用於電池電壓量測系統，用以量測電池模組之電壓。本設計係搭配使用電池模組為8個串聯的鋰離子電池，其鋰離子電池之工作電壓範圍為2 V ~ 3.65 V。根據此電池模組之規格，此高壓類比多工器之輸入電壓最高可達29.2 V，輸出電壓範圍則為1 V ~ 2 V。本設計之特點為使用高壓類比開關與高壓減法器，可解決高電壓輸入之問題。另外，此8:1高壓類比多工器可整合本實驗室所設計之二階三角積分類比數位轉換器及振盪器，實現一電池電壓量測系統，此系統之整體電路以TSMC 1P3M 0.25 μm 60V HV CMOS製程實現。

The research of this thesis is mainly focused on automotive electronics including two topics, a Receiver (Rx) with over-voltage protection for FlexRay systems and an 8:1 high-voltage analog multiplexer (HV MUX) for Battery Management Systems (BMS) of Electric Vehicles (EVs).
The first topic discloses a Receiver with over-voltage protection for FlexRay systems, which is a networking standard for automotives. The proposed design is complied with the FlexRay electrical physical layer specification V3.0.1. The Receiver provides a data rate of 10 Mbps with -10 V ~ +15 V input common mode voltage (uCM) operating in the range of -40 °C ~ +150 °C. An over-voltage protection circuit is included in this Receiver, which is capable of rejecting over-voltage surges up to ±60 V. This design was implemented using TSMC 0.18 μm CMOS HV mixed-signal based generationⅡBCD technology.
The second topic presents an 8:1 high-voltage analog multiplexer for Battery Management Systems. This design is a HV MUX for battery voltage measurement systems, which can detect the battery voltages from a battery module. In this thesis, the testing vehicle is a battery module composed of 8 Li-ion batteries in series. The operating voltage range for each Li-ion battery is 2 V ~ 3.65 V. Thus, the highest input voltage for this HV MUX is 29.2 V, and the output range is 1 V ~ 2 V. HV switches and HV subtractors are also proposed to resolve the high input voltage problem of HV MUX. Finally, a battery voltage measurement system was realized by integrateing this 8:1 HV MUX with a 2nd-order Delta-Sigma ADC and an oscillator. This battery voltage measurement system was carried out on silicon using TSMC 1P3M 0.25 μm 60V HV CMOS technology.

致謝 i
摘要 ii
Abstract iii
圖次 vi
表次 viii
第一章 概論 1
1.1 前言 1
1.2 相關文獻與研究討論 5
1.2.1 FlexRay市售產品 5
1.2.2 FlexRay接收器之現有技術分析 6
1.2.3 電池管理系統之高壓類比多工器 8
1.3 研究動機 11
1.4 論文大綱 11
第二章 適用FlexRay系統具過壓保護之接收器 12
2.1 簡介 12
2.2 具過壓保護之接收器 16
2.3 具過壓保護之接收器電路設計 18
2.3.1 降壓電路 18
2.3.2 二級運算放大器 19
2.3.3 遲滯比較器 20
2.3.4 過壓保護電路 22
2.4 具過壓保護之接收器電路模擬 23
2.4.1 過壓保護電路模擬結果 23
2.4.2 具過壓保護之接收器模擬結果 24
2.4.3 預計規格與效能比較 26
2.5 晶片佈局 27
2.6 晶片實作與量測結果 28
2.6.1 量測環境與晶片照相圖 28
2.6.2 晶片量測結果與討論 30
2.7 結果與討論 35
第三章 電池管理系統之8:1高壓類比多工器 36
3.1 簡介 36
3.2 8:1高壓類比多工器 37
3.3 8:1高壓類比多工器電路設計 40
3.3.1 高壓類比開關 40
3.3.2 高壓減法器 41
3.3.3 運算放大器 42
3.3.4 低壓多工器 43
3.3.5 具校正功能之電壓乘法器 43
3.4 電路模擬及預計規格 45
3.4.1 8:1高壓類比多工器模擬 45
3.4.2 校正功能模擬 47
3.4.3 預計規格與效能比較 49
3.5 晶片佈局 51
3.6 晶片實作與量測結果 53
3.6.1 量測環境與晶片照相圖 53
3.6.2 晶片量測結果與討論 55
3.7 結果與討論 57
第四章 結論與未來工作 58
參考文獻 61

[1] http://www.can-cia.org
[2] http://www.lin-subbus.org
[3] FlexRay Communications System Electrical Physical Layer Specification V3.0.1, (http://www.flexray.com), 2010.
[4] C. S. Moo, Y. C. Hsieh, I. S. Tsai, and J. C. Cheng, “Dynamic charge equalization for series-connected batteries,” IEE Proc. Power Appl., vol. 150, no. 5, pp. 501-505, Sep. 2003.
[5] C. S. Moo, Y. C. Hsieh, and I. S. Tsai, “Charge equalization for series-connected batteries,” IEEE Trans. Aerosp. Electron. Syst., vol. 39, no. 2, pp. 704-710, Apr. 2003.
[6] J. Garche and A. Jossen, “Battery management systems (BMS) for increasing battery life time,” in Proc. 3rd Inter. Conf. Telecommun. Energy Special, May 2000, pp. 81-88.
[7] D. Andrea, Battery Management Systems for Large Lithium-Lon Battery Packs, MA: Artech House, 2010, pp. 51-52.
[8] http://itri.org.tw
[9] ams AG DataSheet: AS8222, FlexRay Transceiver, Rev. 1.0, Dec. 2012.
[10] FlexRay Communications System Electrical Physical Layer Specification V2.1 Rev. B, (http://www.flexray.com), 2006.
[11] FUJITSU DataSheet: MB88121, FlexRay Communication Controller, Nov. 2006.
[12] NXP DataSheet: TJ1080A, FlexRay Transceiver, Rev. 6, Nov. 2012.
[13] C.-C. Wang, G.-N. Sung, P.-C. Chen, and C.-L. Wey, “A transceiver front end for electronic control units in FlexRay-based automotive communication systems,” IEEE Trans. Circuits Syst. I-Reg. Papers, vol. 57, no. 2, pp. 460-470, Feb. 2010.
[14] C.-C. Wang, C.-L. Chen, T.-H. Yeh, Y. Hu, and G.-N. Sung, “A high speed transceiver front-end design with fault detection for FlexRay-based automotive communication systems,” in Proc. IEEE Inter. Symp. on Circuit and Systems (ISCAS), May 2011, pp. 434-437.
[15] C.-C. Wang, G.-N. Sung, and P.-C. Chen, “A transceiver design for electronic control unit (ECU) node in FlexRay-based automotive communication systems,” in Proc. IEEE Inter. Conf. on Consumer Electronic (ICCE), Jan. 2008, pp. 1-2.
[16] F. Baronti, P. D’Abramo, M. Knaipp, R. Minixhofer, R. Roncella, R. Saletti, M. Schrems, R. Serventi, and V. Vescoli, “FlexRay transceiverin a 0.35 µm CMOS high-voltage technology,” in Proc. IEEE Design Automat. Test Europe, Mar. 2006, pp. 201-205.
[17] F. Baronti, E. Petri, S. Saponara, L. Fanucci, R. Roncella, R. Saletti, P. D’Abramo and R. Serventi, “Design and verification of hardware building blocks for high-speed and faulttolerant in-vehicle networks,” in IEEE Trans. Ind. Electron., vol. 58, no. 3, pp. 792-801, Mar. 2011.
[18] D. A. Adams, H. A. Barnes, M. D. Fitzpatrick, N. P. Goldstein, W. L. Hand, W. L. Jackson, R. Koga, M. B. Pennock, H. J. Remenapp and J. T. Smith, “A radiation hardened high voltage 16:1 analog multiplexer for space applications (NGCP3580),” in Proc. IEEE Radiation Effects Data Workshop, Jul. 2008, pp. 82-84.
[19] K. Hara, J. Sakano, M. Mori, S. Tamano, R. Sinomura and K. Yamazaki, “A new 80V 32×32ch low loss multiplexer LSI for a 3D ultrasound imaging system,” in Proc. Inter. Symposium on Power Semiconductor Devices and ICs, May 2005, pp. 359-362.
[20] R. K. Williams, L. T. Sevilla, E. Ruetz and J. D. Plummer, “A DI/JI-compatible　monolithic high-voltage multiplexer,” IEEE Trans. on Electron Devices, vol. ED-33, no. 12, pp. 1977-1984, Dec. 1986.
[21] J. Borg and J. Johansson, “An ultrasonic transducer interface IC with　integrated push-pull 40 Vpp, 400 mA current output, 8-bit DAC and　integrated HV multiplexer,” IEEE J. of Solid-State Circuits, vol. 46, no. 2, pp. 475-484, Feb. 2011.
[22] R. J. Baker, H. W. Li, and D. E. Boyee, CMOS Circuit Design, Layout, and Simulation, 3rd., New Jersey: John Wiley & Sons, 2010.
[23] 羅時偉, “2.45 GHz ZigBee 接收器前端與電池管理系統之具固定轉導放大器之三角積分類比數位轉換器,” 國立中山大學電機工程學系碩士班論文, 2012.
[24] R. Horgervorst, J. P. Tero, G. H. Eschauzier and J. H. Huijsing, “A compact power-efficient 3 V CMOS rail-to-rail input/output operational amplifier for VLSI cell libraries,” IEEE J. Solid-State Circuits, vol. 29, no. 12, pp. 1505-1513, Dec. 1994.
[25] 陳致霖, “適用於低ISM頻帶之自動取樣ASK解調變器與同步自動校正數位類比轉換器,” 國立中山大學電機工程學系碩士班論文, 2010
[26] C.-L. Chen, Y. Hu, W. Luo, and C.-C. Wang, “A high voltage analog multiplexer with digital calibration for battery management systems,” in Proc. IEEE Inter. Conf. on Intergrated Circuit Design & Technology (ICICDT), Jun. 2012, pp. 1-4.
[27] C.-L. Chen, D.-S. Wang, J.-J. Li, and C.-C. Wang, “A battery interconnect module with high voltage transceiver using 0.25 μm 60V BCD process for battery management systems,” in Proc. Inter. SoC Design Conf. (ISOCC), Nov. 2012, pp. 1-4.