本論文目的是以半導體製程技術，配合精密的切割、研磨方式製作出厚度小於100 μm的薄膜濾波器（TFF, Thin-film filter），並探討它在分波長多工器（WDM, Wavelength Division Multiplexing）系統中的應用。為了達到積體化的目的，我們利用在矽基板上以溼蝕刻的方式製作V型槽溝，兩端放置單模光纖（SMF, Single mode fiber），切出U槽並放置TFF，經光學量測得出其插入損耗（Insertion loss）小於 - 0.5 dB。
除此之外，我們探討應力（Stress）對CWDM TFF的頻帶寬度變化造成的影響，將頻帶寬度為20 nm的帶通濾波器（Band-pass TFF）製作成厚度50 μm、尺寸1.5 mm × 1.5 mm經量測後其中心波長漂移量為4.64 nm，頻帶寬度縮小1.54 nm。

The subject of this dissertation is to use precision cutting and polishing techniques to fabricate thin-film filters(TFFs) with a thickness of less than 100 μm, and to discuss their applications in Wavelength Division Multiplexing(WDM) systems. To demonstrate the feasibility of the proposed technology, Si benches with wet-etching V grooves for precision fiber positioning and saw-cutting U grooves for placing the TFFs were fabricated. The insertion loss of the bench at 1.55 μm input lights is less than - 0.5 dB.
In addition, the stress induced pass band variations of band-pass TFF for Coarse WDM(CWDM) applications were studied. The pass band width of the band-pass TFF is 20 nm. After reducing the thickness of the 1.5 mm × 1.5 mm BP TFF to a thickness of 50 μm, the center wavelength shift and pass band reduction are 4.64 nm and 1.54 nm, respectively.

第 一 章 導論 1
第 二 章 超薄薄膜濾波器 4
2-1雙通道光收發器模組 5
2-2 BPM CAD軟體模擬 7
2-3超薄薄膜濾波器製作 9
2-4超薄TFF製程 10
2-4-1 TFF切割、研磨 11
2-4-2 TFF晶片清潔 13
2-5 TFF封裝製程 14
2-6 V-groove製程 18
2-7 CWDM TFF應力探討 22
第 三 章 光學特性量測 23
3-1 TFF光學頻譜特性 23
3-2 TFF插入損失 25
3-3 CWDM TFF應力分析 27
第 四 章 結論 36

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