本論文的目的是以埋藏式光波導結構為基礎，建構半導體雷射及單模光纖之間的光連結，這種技術非常適合應用在光傳輸模組(Transceiver) 及塞取多工器 (Add-and-Drop Multiplexer) 等多重輸入/輸出的模組中。

其主要元件有三個主要部分：(1)平坦化半導體雷射 (Planarized Semiconductor Laser)、(2)埋藏式光波導 (Buried Waveguide)、(3)單模光纖 (Single Mode Fiber)，並且積體化整合 (Hybrid Integration) 至矽工作台 (Si Bench) 上。平坦化半導體雷射以脊樑式結構為基礎，利用高分子材料回蝕製程進行平坦化，並且覆晶封裝 (Flip-Chip) 於矽工作台上，此外，以玻璃陶瓷材料 (Sol-gel) 為導光層的埋藏式光波導採用V槽 (V-groove) 及U槽 (U-groove) 技術與單模光纖進行被動對準 (Passive Alignment)，經量測得對準誤差損耗在1dB以內。

The target of this work is to optically interconnect a semiconductor laser and a single mode fiber (SMF) through a simple Si bench technology using buried waveguide devices. This technology is suitable for applications such as optical transceivers and add-and-drop multiplexers.

Three major components, namely, planarized laser diode, buried waveguide, and SMF are hybrid integrated on the Si bench. The ridge-type laser was planarized by BCB etch-back process, and was flip-chip mounted on the Si bench. On the other hand, the sol-gel buried waveguide was passively aligned to SMF using V-groove and U-groove techniques. Miss-alignment loss as low as 1 dB can be obtained.

第 一 章 介紹 1

第 二 章 結構設計 4

第 三 章 製程設計及元件製作 7
3-1 平坦化雷射製程 7
3-1.1 樑脊蝕刻 8
3-1.2 平坦化 11
3-1.3 接面金屬蒸鍍 14
3-1.4 覆晶封裝 19
3-1.5 討論 19
3-2 波導結構及V-groove整合製程 22
3-2.1 覆層材料成長 23
3-2.2 被動對準製程 25
3-2.3 V-groove蝕刻 29
3-2.4 光波導製作 32
3-2.5 U-groove製作 35
3-2.6 討論 38

第 四 章 特性量測 42
4-1 平坦化雷射量測結果 42
4-1.1 未覆晶封裝量測結果 42
4-1.2 經覆晶封裝量測結果 43
4-1.3 討論　　　　　　　 44
4-2 波導及V-groove模組量測結果 45
4-2.1 模組封裝 45
4-2.2 光學量測系統架設 46
4-2.3 模組量測結果 48
4-2.4 討論 49

第 五 章 結論 50

參考文獻 52

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