摘要

本文研究的主題在於發展單模光纖與抗共振反射波導兩者之間製作光連接器模組時所需要的技術。除此之外，我們也以理論研究兩者之間的耦合特性。
光連接器模組的製作包含三個重要的技術：抗共振反射波導的製作、V型凹槽的形成以及U型凹槽的深蝕刻。我們利用半導體製程技術針對1.3mm波長製作抗共振反射波導。得到波導的TE傳輸損耗為0.6dB/cm; TM則為2.55dB/cm。另外以EDP溶液對矽基板作非均向性的蝕刻而形成V型凹槽，蝕刻保護層材料為室溫下濺鍍的Ta2O5。當蝕刻溫度為1200C時，側蝕最小為1.6mm。為了提高單模光纖與波導的耦合效率，我們以U型凹槽深蝕刻技術縮短兩者之間的距離。乾蝕刻氣體為SF6及O2，凹槽的深度為58mm。
由計算的結果得到，當波導的厚度及寬度同為12mm時，與單模光纖的耦合效率高達90％。在兩者的X和Y方向對準偏差容忍度以3-dB的損耗來計算可達±3.6mm和±3.7mm。

Abstract

The work presented in this thesis is intend to develop the required technologies for fabrication optical interconnection between a single mode fiber (SMF) and a hybrid antiresonant reflection optical waveguide(ARROW). In addition, the coupling characteristic between the SMF and ARROW are theoretically investigated.
The fabrication of the optical interconnection includes three major techniques: fabrication of hybrid ARROW waveguide, V groove formation and U groove deep etching. The ARROW waveguide centered at 1.3mm was fabrication using semiconductor process technologies. Propagation losses of the device as low as 0.6dB/cm for TE polarized and 2.55dB/cm for TM were obtained. Anisotropic etching of Si-V grooves were formed using EDP solution, and room temperature sputtered Ta2O5 was used as the etch mask. At a etching temperature of 1200C, the under cut is 1.6mm. In order to increase the coupling efficiencies, we employed the U groove deep etching to reduce the distance from SMF to ARROW . The trenches with a depth 58mm were etched with SF6/O2 dry etching.
Based on our calculation, the coupling efficiency as high as 90% can be obtained when the hybrid ARROW has a core thickness and a waveguide width of 12mm. The 3-dB alignment tolerance in X and Y directions between the SMF and ARROW are ±3.6mm and±3.7mm respectively.

目錄
第一章 介紹 1
第二章 理論分析 5
第一節 抗共振反射波導的結構及理論 5
第二節 相關函數法(CFM)的應用 7
第三節 結果與討論 14
第三章 元件材料的成長與分析 15
第一節 元件及保護層材料的成長 15
第二節 矽的V型凹槽蝕刻 18
第三節 矽的U型凹槽深蝕刻 23
第四節 結果與討論 25
第四章 元件製程 26
第一節 元件製作流程 26
第二節 單模光纖固定於V型凹槽內 32
第三節 結果與討論 34
第五章 波導的量測結果與分析 35
第一節 波導的量測 35
第二節 量測結果 36
第三節 討論 37
第六章 結論 38
圖目錄

第一章 介紹
圖1-1.光場在傳統波導中傳播示意圖 2
圖1-2.光場在ARROW waveguide中傳播示意圖 2
圖1-3. ARROW waveguide與SMF對準示意圖 3
第二章 理論分析
圖2-1. ARROW waveguide 結構示意圖 5
圖2-2.厚度、寬度同為12mm的ARROW waveguide光場分佈圖 9
圖2-3. SMF的光場分佈圖 10
圖2-4. SMF與ARROW waveguide的連接效率示意圖 11
圖2-5.單模光纖和ARROW waveguide的耦合效率 12
圖2-6. X軸中心對準偏差容忍度 13
圖2-7. Y軸中心對準偏差容忍度 13
第三章 元件材料的成長與分析
圖3-1. Si -V型凹槽蝕刻圖 19
圖3-2.以SiO2為mask在溫度為1200C下蝕刻Si的側蝕圖 19
圖3-3.以Ta2O5為mask在溫度為1200C下蝕刻Si的側蝕圖 20
圖3-4.以Ta2O5為mask在溫度為1100C下蝕刻Si的側蝕圖 20
圖3-5.以Ta2O5為mask在溫度為1000C下蝕刻Si的側蝕圖 21



圖3-6.以Ta2O5為mask在溫度為900C下蝕刻Si的側蝕圖 21
圖3-7.不同保護層以及溫度所造成的側蝕寬度與標準誤差 22
圖3-8.以Ni-Cr 為mask的U型凹槽，深度為58mm 24
第四章 元件製程
圖4-1. Polyimide硬烤圖 27
圖4-2. Polyimide硬烤圖 28
圖4-3.元件製程流程圖 30
圖4-4. ARROW waveguide 的三層材料結構圖 31
圖4-5. ARROW waveguide 的脊樑圖 31
圖4-6.固定單模光纖器具 32
圖4-7.人工施力固定單模光纖圖 33
圖4-8.機械施力固定單模光纖圖 33
第五章 波導的量測結果與分析
圖5-1.波導量測系統架構圖 35
圖5-2. ARROW waveguide TE極化的傳輸損耗 36
圖5-3. ARROW waveguide TM極化的傳輸損耗 36






表目錄

第三章 元件材料的成長與分析
表3-1.抗共振反射波導及保護層材料的參數 15
表3-2.蝕刻Polyimide的配方 17
表3-3. Si的濕蝕刻配方 18
表3-4.不同保護層以及溫度所造成的側蝕寬度 22
表3-5. Si的乾蝕刻配方 23
表3-6. Cr、Ni-Cr的抗蝕刻能力 24

參考文獻

1. Michel A. Rosa, Nam Q. Ngo, Denis Sweatman, Sima Dimitrijew, and H. Barry Harrison, "Self-alignment of optical fibers with optical quality end-polish silicon rib waveguides using wet chemical micromachining techniques", IEEE J. Selected Topics in Quantum Electronics, Vol.5, No.5, pp. 1249-1254, 1999.
2. Peter A. Andrekson, and Arne Alping, "Optoelectronic properties of semiconductors lasers butt-coupled to optical fibers", IEEE J. Quantum Electronics, Vol.24, No.10, pp 2039-2044, 1988.
3. Toshihiko Baba and Yasuo kokubun, "High efficiency light coupling from antiresonant reflecting optical waveguide to integrated photodetector using an antrireflecting layer", Applied Optics, Vol.29, No.18, pp. 2781-2791, 1990.
4. Timothy S. Barry, Daniel L. Rode, senior Member, IEEE, Maecelo H. Cordaro, Student Member, IEEE, Robert R. Krchnavek, Member, IEEE, and Kenichi Nakagawa, "Efficient multimode optical fiber-to-waveguide coupling for passive alignment application in multichip modules", IEEE Transaction on Components, Packaging, and Manufacturing Technology-part B, Vol.18, No.4, pp.685-689, 1995.
5. Randall B. Wilson and Robert A. Boudreau, "Single-mode laser/fiber coupling yields using silicon v-groove passive alignment", AMP Journal of Technology, Vol.4, pp. 41-48, 1995.
6. Kazuhiko Kurata, Kenji Yamauchi, Atsuhiro Kawatani, Hideki Tanaka, Hiroshi Honmou, and Shigeta Ishikawa, "A surface mount single-mode laser module using passive alignment", IEEE Transaction on Components. Packaging. And Manufacturing Technology-Part B, Vol.19, No.3, pp. 524-530, 1996.
7. A. G. Rickman, G. T. Reed, and Fereydoon Namavar, "Silicon- on- Insulator optical rib waveguide loss and mode characteristics", J. Lightwave Technology, Vol.12, No.10, pp. 1771-1776,1994.
8. M .A. Duguay, Y. Kokubun, and T. l. Koch, "Antiresonant reflecting optical waveguide in SiO2-Si multiplayer structures", Appl. Phys. Lett., Vol.49, pp. 13-15, 1986.
9. D. F. Clark and B. Smith, "Antiresonant reflecting optical waveguides formed from solgel films", Optical Society of America, Vol.20, No.12, pp.1377-1379, 1995.
10. T. Baba and Y. Kokubun, "Low-loss antiresonant reflection optical waveguide on Si substrate in visible-wavelength region", Electron. Lett., Vol.22, pp.892-893, 1986.
11. Mostafa Rassaian and Mark W. Beranek, Senior Member,IEEE, "Quantitative Characterization of 96.5Sn3.5Ag and 80Au20Sn optical fiber solder bond joints on silicon micro-optical bench substrates", IEEE Transactions on Advanced Packaging, Vol.22, No.1, pp.86-93, 1999.
12. M. Guendouz, N. Pedrono, J. Charrier. P. Joubert and J. Le Rouzic, "Electrochemical micromachining of silicon platforms for optical fiber alignment", Electron. Lett., Vol.33, No.20, pp. 1695-1696, 1997.
13. Donald F. Weirauch, "Correlation of the anisotropic etching of single-crystal silicon spheres and wafers", J. Applied Physics, Vol.46, No.4, pp. 1478-1483, 1975.
14. A. K. Chu, Y. S. Huang, and S. H. Tang, "Room-temperature radio frequency sputtered Ta2O5: A new etch mask for bulk silicon dissolved processes", J. Vac. Sci. Technol., Vol.17, No.2, pp.455-459, 1999.
15. R. G. Heideman, G. J. Veldhuis, E. W. H. Jager, P. V. Lambeck, "Fabrication and packaging of integrated chemo-optical sensor", Sensors and Actuators B 35-36 pp.234-240, 1996.
16. I. W. Rangelow, "Reactive ion etching for microelectrical mechanical system fabrication", J. Vac. Sci. Tech. B, Vol.13, No.6, pp.2394-2399, 1995.
17. M. D. Feit and J. A. Fleck, Jr., "Computation of mode properties in optical fiber waveguides by a propagating beam method", Applied Optics, Vol.19, No.7, pp. 1154-1164, 1980.
18. Bruce L. Booth, "Low loss channel waveguide in polymers", J. Lightwave Tech., Vol.7, No.10, pp.1445-1453, 1989.
19. Junya Kobayashi, Tohru Matsuura, Shigckuni Sasaki, and Tohru Maruno, "Directional couplers using Fluorinated polyimide waveguide", J. Lightwave Tech., vol.16, No.4, pp.610-614, 1998.
20. Chun-yu Wu, "The fabrication and characterization of Y-branch couplers using Antiresonant reflection optical waveguide", Master of Science, Institute of Electro-optical engineering, National Sun Yat-sen University, 1999.
21. Miao-Ju Chuang, "Radio frequency sputtered Ta2O5 for application in photonics", Doctor of philosophy, Institute of Materials science and engineering, National Sun Yat-sen University, pp.