雷射二極體是目前光纖通訊中最受注目的產品，微小化及高精密的定位是雷射二極體在製造上欲突破的主要關鍵，因此製作過程中零件尺寸的控制、外力振動及材料老化皆會對雷射二極體的效能造成不穩定。本文主要目的是利用有限元素軟體（ANSYS 5.7）模擬雷射二極體錫焊部位在受不同溫度循環下的等效應力、等效應變及不同的材料性質變化，對雷射二極體的性能及壽命的影響情況，本文研究結果中得知熱衝擊對錫焊的影響主要是在等效應力方面，可能會因超過降伏點而破壞，熱循環則是對黏塑應變範圍及使用壽命有較大的關係，此外在高溫情況之下容易有潛變及應力鬆弛情況發生，所以在相同溫度作用週期之下增加恆溫時間（ramp time ）比增加加溫時間（dwell time）的影響來的大，最後是探討錫焊的幾何外型與錫焊材質分別對雷射二極體結構有何影響並比較其優缺點，所得之結果將可作為日後相關研究之參考。

Currently, laser module package is a popular product in optical fiber communication. In the laser module package process smallness is the key point, so dimensions control to influence the oscillation, ageing of material of the laser module operation. This study aim to simulate the laser module weld part's von Mises stress and the laser module weld part's von Mises strain (by using a commercial FEM package, ANSYS) in different temperature cyclic, From the finding of the study, different material property and geometry contour affect the laser module’s ability and cyclic lifespan. For instance Thermal shock will influence the von Mises stress, and thermal cyclic influences viscoplastic strain range and use life. In addation, creep, ageing and stress relaxation happen easily in the high temperature. When the temperature fixes at cyclic period, changing dwell time affects more than changing ramp time. Furthermore, the effects of the study of solder’s geometry contour and the solder’s material property, the behavior of thermal, their advantage and their disadvantageously are also compared in this report. The future, the results obtained by the analytical model will refer to interrelated research.

摘要……………………………………………………………………Ⅰ
英文摘要……………………………………………………………….Ⅱ
目錄……………………………………………………………………Ⅲ
圖目錄…………………………………………………………………Ⅴ
表目錄…………………………………………………………………Ⅶ

參考文獻
【1.】John H.Lau, Yi-Hsin Pao ,”Solder Joint Reliability of BGA , CSP, Filp Chip, and Fine Pitch SMT Assemblies’’ copyright 1997 by The McGraw-Hill Companies.
【2】John H.Lau, 1993, “Thermal Stress and Strain in Microelectronics Packaging”, Van Nostrand Reinhold, New York ,USA.
【3.】M.R.FREWIN,D.A.SCOTT, 1999,”Finite Element Model of Pulsed Laser Welding,” Publication of this document; WRC Bulletin No. 426.
【4.】T. Elperin, G. Rudin 2001,”Thermal stresses in functionally graded materials caused by a laser thermal shock,” Department of Mechanical Engineering Pearlstone Center for Aeronautical Engineering Studies
【5.】T. Elperin, G. Rudin 1998” Thermal reliability testing of functionally gradient materialsusing thermal shock method” Department of Mechanical Engineering Pearlstone Center for Aeronautical Engineering Studies
【6.】Aza Takao, Oaza Kawasaki, Hiji-machi, Hayami-gun, Oita, “Chip Scale Package (CSP)Solder Joint Reliability and Modeling
【7.】Y.-F. Tzeng and F.-C. Chen, 2001,”Effects of Operating Parameters on the Static Properties of Pulsed Laser Welded Zinc-Coated Steel,”
【8.】Tianshun Liu, Alan Tomsett, Hao Zhang, 1999.”Thermal shock behavior of industrial carbon anodes,” Materials Division , Australian Nuclear Science and Technology Organisation , Private Mail Bag 1, Menai ,NSW 2234, AustraliaAustralia.
【9.】Dipl.-Phys. Frank Rick, Prof.Dr.-Ing. Gunther Reinhart, Dipl.-Phys. Bernhard Lenz, 1998,”FEM-Simulation of Laser Welding in Production Planning and Product Design,”
【10.】G. Renhart, B. Lenz, F. Rick, 1999,”Finite Element Simulation for the Planning of Laser Welding Applications,”
【11.】Charles E.Knight “The Finite Element Method in Mechanical Design”, copyright 1993 by PWS-KENT publishing Company ,Inc, ISBN 0-534-93187-1 .
【12.】Kenneth H.Huebner , EARL A. Thornton “The Finite Element Method for Engineers”, copyright 1995 by John wiley & Sons, Inc. ISBN 0471-54742-5
【13.】Dipl.-Phys. Frank Rick, Prof. Dr.-Ing. Gunther Reinhart, Dipl.-Phys. Bernhard Lenz” FEM-Simulation of Laser Welding in Production Planning
and Product Design” Enschede.Twente University Printers: 1998, pp. 267-274
【14】 S. Jang, “ Laser Diode packaging technology”, Application note , NO .7（2000）
【15】Kashyap, B.P., “Experimental Constitutive Relations for the high temperature Deformation of A Pb-Sn Eutectic Alloy”, Materials science and Engineering, Vol. 50,pp. 205-213.
【16】Pang, H , J 1997, “Non-Linear Finite Element Analysis of Thermal Fatigue and Creep Deformations in SMT Solder joint”, MARC Vol.17, PP157-164.
【17】Solomon, H, D .,1996, “Creep, Strain rate Sensitivity and Low cycle Fatigue of 60/40 Solder,” Brazing & Soldering ,NO.11,PP.68-75.
【18】Pardeep K.Bhatti, Klaus Gschwend, Abel Y. Kwang and Ahmer R. Syed, 1995, “Three-Dimensional Creep Analysis of Solder Joints in surface Mount Devices, “Transactions of the ASME. Vol.117,pp.20-25.
【18.】張明凱”變形動力學之錫材料的穩態潛變行為”2000年，國立成功大學工程科學碩論文。
【19.】沈茂田”雷射二極體模組殘留應力及潛變效應之研究”1999年國立中山大學機械工程學博士論文。
【20】鄭木海博士,”雷射二極體構裝技術之近況與趨勢”, 光訊 ,第69期,（1997）