近年來電子封裝的小型化及輕量化使得產品關鍵製程技術需要不斷的向前推進，在IC封裝製程中，構裝體介面的脫層和晶片裂痕為最常見的破壞，而熱應力是造成構裝體脫層與裂痕的主要因素之一，由於材料之間熱膨脹係數（CTE）的不同，當構裝體在不同溫度作用下就會產生熱應力及翹曲。在本文中利用有限元素軟體Marc&Mentat來分析構裝體在黏晶固化及封膠過後所產生的翹曲與熱應力，並以兩種不同封膠材料進行分析，而後將有限元素計算結果與實驗數據比較，進而針對不同材料的厚度進行分析，並收集結果資訊，歸納出影響封裝體翹曲與熱應力之因素，以瞭解各材料厚度對於設計目標的影響和重要性。

The current packaging trend toward to smaller and thinner has pushed the manufacturing technology to the limits. During the assembly processes of IC packages, delamination at interfaces and mechanical breakage of components are common mode of failure. The induced thermal stress within the package is one of the major contributions to these failures. According to the disparity of the coefficient of thermal expansion (CTE) between different components, internal thermal stress and warpage will be induced when the package undergoes temperature excursion. In this paper, the Die attach epoxy curing and encapsulation curing process induced warpage and thermal stress were studied by finite element software Marc & Mentat. As comparison, two kinds of Molding materials of the package considered, and the result will compared with the experimental data. Finally, studied the effect of the material thickness and the impact significance of each design variable on the design objective will also be discussed.

目錄
中文摘要………………………………………………………… I
英文摘要………………………………………………………… Ⅱ
目錄……………………………………………………………… Ⅲ
圖目錄…………………………………………………………… Ⅴ
表目錄…………………………………………………………… Ⅷ
第一章緒論……………………………………………………… 1
1-1研究背景……………………………………………… 1
1-2研究動機與目的……………………………………… 8
1-3文獻回顧……………………………………………… 9
1-4本文組織……………………………………………… 11
第二章理論與封裝製程簡介…………………………………… 12
2-1熱應力基本觀念……………………………………… 12
2-2有限元素軟體簡介…………………………………… 16
2-3封裝製程介紹………………………………………… 20
第三章研究方法與步驟………………………………………… 32
3-1有限元素模型………………………………………… 32
3-2分析方法……………………………………………… 33
第四章 結果與討論…………………………………………… 42
4-1有限元素分析結果…………………………………… 42
4-2案例分析一…………………………………………… 56
4-3案例分析二…………………………………………… 60
4-4案例分析三…………………………………………… 63
第五章結論……………………………………………………… 66
5-1結論…………………………………………………… 66
5-2未來研究方向………………………………………… 67
參考文獻………………………………………………………… 68

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