中文摘要
本論文主要分為兩個部份，第一個部份是探討溫度加速老化對於雷射二極體與次載具以及次載具與基板間常用的錫鉛及錫金兩種銲料之結合強度之影響，並從試片破裂面以及完整剖面微組織的金相分析中，找出結合強度隨老化天數增加而劣化的原因在於空孔、裂縫的增加變大以及介金屬化合物的成長變厚。49天老化過程中錫鉛破裂面也從早期的展性破裂面逐漸變成脆性破裂面，並且在完整剖面介面處觀察到Kirkendall空孔生成,而錫金破裂面則仍呈現展性特質且完整剖面介面處並無觀察到Kirkendall空孔生成。溫度加速老化實驗之溫度控制在150℃,天數從1、4、9、16、25、36到49天。經49天老化後,2μm鍍金厚的錫鉛及錫金試片推力值分別下降了9.48公斤及7.65公斤; 10μm鍍金厚的錫鉛及錫金試片推力值分別下降了9.42公斤及5.88公斤，有限元素法對結合強度的老化模擬計算也符合實驗的結果。
另一部份是關於錫銲固定光纖金屬套管的製程研究，由於光纖在金屬套管中的中心偏位量不同，而在銲錫固化後會有不同的殘留應力，當進行溫度熱循環測試時會因為熱應力的作用會使殘留應力重整，而使光纖產生位移，此位移量與起始中心偏位量有正比關係，故本製程之研究在設計一個機構來控制起始中心偏位小於20μm的目標，如此在500次熱循環後光纖位移應可控制在0.5μm以內。此機構主要包括加熱平台、溫度控制器、光纖固定器、影像拮取系統及電腦輔助偏位計算軟體。實驗結果顯示方法可行,目前雖已可以做出偏位量在10、12μm左右的光纖金屬套管組合,但製程仍須改善以增進製程良率。

Abstract
The influence of thermal aging on joint strength and fracture surface of PbSn and AuSn solders in laser module packages has been studied experimentally and numerically. Al2O3-Solder-Substrate assembled samples were aged at 150oC for one, four, nine, sixteen, twenty-five, thirty-six, and forty-nine days. It was found that the joint strength decreased as the aging time increased. This joint strength decrease is due to the increase of void and crack formations in solder joints. There is a correlation between the intermetallic compound (IMC) growth and the joint strength for PbSn and AuSn solders under aging test. The fracture surface of PbSn specimen is gradually changed from the ductile dominated morphology of as-soldered status to the brittle dominated morphology. The section view indicates Kirkendall voids appeared around the interface of bulk solder and IMC layers after 49 days of aging. However, AuSn specimen still shows a ductile dominated morphology and no Kirkendall voids observed even after 49 days of aging. Through 49 days of aging, the shear force drops of 2μm Au-coated PbSn and AuSn specimens are 9.48kg and 7.65kg, respectively; the shear force drops of 10μm Au-coated PbSn and AuSn specimens are 9.42kg and 5.88kg,respectively. A finite-element method (FEM) analysis was performed on the calculation of joint strength variation of PbSn and AuSn solders in thermal aging tests. Simulation results were in good agreement with the experimental measurements that the solder joint strength decreased as the aging time increased.
Another study is based on the well-known result of thermal induced fiber alignment shifts of fiber-solder-ferrule (FSF) joints in laser diode package. It indicates fiber alignment shift under temperature cycling tests can be reduced significantly if the fiber can be located closer to the center of the ferrule. An approach to make an FSF with the minimum eccentric offset is studied, an in-house design machine set is used for this purpose, which includes a hot plate, a fiber fix stage, an image capture camera, and a PC with offset analysis program. A preliminary target is set to achieve a maximum 20μm offset FSF. It was believed that a less than 0.5μm fiber shift could be measured after 500 temperature cycles. After the practical experiment trial, FSF with around 10 and 12μm offset is available. However, the continuous improvement is necessary for process stability.

內容目錄
頁次
中文摘要 Ⅰ
英文摘要 Ⅱ
內容目錄 Ⅲ
圖表目錄 Ⅴ
第一章 緒論 1
1. 1 研究背景 1
1.2 研究動機 3
1.3 文獻回顧 4
1.4 論文架構 7
第二章 錫鉛及錫金銲點之溫度加速老化實驗設計 9
2.1 實驗架構 9
2.2 材料整備 12
2.2-1 雷射二極體次載具 12
2.2-2 呈載基板 13
2.2-3 銲料 19
2.3 銲接製程 23
2.3-1 銲錫性 23
2.3-2 助銲劑 25
2.3-3 加熱平台 27
2.3-4 製程 29
2.4 老化條件 31
2.5 推力機構 32
2.6 微組織分析 34
2.6-1 金相工作法 36
2.6-2 光學顯微鏡 39

2.6-3 掃描式電子顯微鏡及能量散佈X光
頻譜分析儀 40
第三章 錫鉛及錫金銲點之溫度加速老化實驗結果
分析 42
3.1 推力結果及分析 42
3.2 破裂面微組織分析 46
3.2-1 破裂屬性 46
3.2-2 空孔量測 56
3.3 完整剖面微組織分析 57
3.3-1 介金屬化合物成長 57
3.3-2 空孔及裂縫生成 61
第四章 光纖金屬套管製程研究 82
4.1方法可行性 83
4.2 實驗機構設計 85
4.2-1 原型試作 87
4.2-2 機構改進 90
4.3 成品檢測 93
4.3-1 金相檢測 93
4.3-2 誤差推論 95
第五章 結論與未來工作事項 97
5.1 結論 97
5.2 未來工作 99
參考資料 100

參考資料

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