本論文的目的是對發光二極體(Light emitting diode)進行封裝，以產生出一具有低半功率角(Half intensity angle)的光源，以及一均勻度可媲美冷陰極射線管(Cold cathode fluorescent lamp)的線光源，並探討高功率發光二極體(Power led)在不同次黏著基台(Sub-mount)下的散熱特性。
我們利用濕蝕刻技術，在矽晶圓上面蝕刻出一穿孔的V型槽(V-groove)，並利用熱蒸鍍機(Thermal coater)在V型槽上鍍上一層金屬當反射層，之後在一已定義出電極的矽散熱基板上黏上發光二極體，再利用打線技術(Wire bonding)將發光二極體的正負極分別接到電路的兩端，然後將兩者以UV膠進行接和，即完成模組的製作。
本研究以光學模擬軟體 Lighttools 對此結構進行光學分析，透過光學模擬我們可以得到一半功率角為 36 度的光源，及均勻度為84.8 %的六顆發光二極體做成的三公分長的線光源。而實際成型的元件經光電檢測器(Photo-detector)量測後，光源的半功率角為 38 度，六顆發光二極體做成的三公分長的線光源的均勻度為 84.82 %。
我們並提出一供高功率發光二極體用的散熱submount，其結構為在Si V型槽內以電鍍法填滿銅，期望利用矽與銅的高熱傳導係數，有效率的將熱能傳導至底下的引線架(Case)與散熱板(Board)。我們將實驗分為三組進行，分別為使用Case及此散熱sub-mount(Si+Cu)、使用Case及矽散熱基板(Si)及僅使用Case，之後用熱像儀(Thermal-imager)進行量測，量測結果為在輸入功率為一瓦的情況下，其熱阻分別為34.7 W/mk、19.4 W/mk 及 13 W/mk。歸納得知，由於本散熱sub-mount具有最高的厚度(800μm)，反而阻滯了熱傳導的效率，所以比起其他組而言，擁有較高的熱阻。

The purpose of this thesis is to fabricate an LED module with low half intensity angle(HIA) ,and to use this module to form a line source with optical performance comparable to that of a CCFL .In addition ,heat dissipation of the LED module on different sub-mounts is also investigated .
The LED modules were formed by first etching a through si via on silicon substrate using wet etching technology for light confining .Then a thin layer of metal was deposited on to the via to reflect the lights emitted from the LED .The LED die was attached to the Si sub-mount with electrodes ,and the connections between the LED and the Si sub-mount were completed by wire bonding .Finally ,the LED modules were obtained by positioning the Si substrates onto the Si sub-mounts using UV epoxy .
The optical performance of the LED module was simulated by Lighttools .For the si substrate with a thickness of 400 μm ,a simulated HIA of 36 o was obtained .Using six-LED package ,a 3-cm line source with 84.8% output uniformity was simulated .On the other hand ,the measured HIA of a LED module ,and the uniformity of 3-cm line source are 38 o and 84.8% ,respectively.
The thermal resistance of the si sub-mounts were also investigated .The different structures of the sub-mount were proposed ,namely ,LED to Copper case ,LED to Si sub-mount to Copper case ,and LED to Si sub-mount with Copper filled via to Copper case .The estimated thermal resistance of the sub-mounts are 13 W/mk、19.4 W/mk and 34.7 W/mk .We believe that the large thermal resistance of the Si sub-mount with Copper filled via is primarily caused by 800 μm thick substrate .

第 一 章 導論
第 二 章 結構特性與模擬分析
2-1 點光源模擬
2-2 線光源模擬
2-3 背光模組模擬
第 三 章 元件之製作
3-1 矽V型槽製作流程
3-2 基板製作流程
3-3 點光源與線光源封裝
第 四 章 量測與分析
4-1 點光源之光學特性量測
4-2 線光源之光學特性量測
第 五 章 功率型發光二極體散熱技術
5-1 功率型發光二極體散熱基板之基本結構
5-2 散熱基板之製作流程
5-3 散熱元件量測結果與分析
第 六 章 結論

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