在BGA構裝形式中，錫球的功能主要是結構連接與訊號傳遞；由於受到電子元件材料熱膨脹係數不匹配的影響，在熱循環過程中造成熱應力產生，進而導致元件的損壞；而在所有材料中，錫球最具延展性，因此往往最先發生熱疲勞現象，故錫球部分的熱疲勞壽命為本文研究的焦點。
本文主旨在於探討TF-BGA受週期性熱負載後，各項因子對錫球可靠度的影響。文中利用有限元素分析軟體ANSYS，分析錫球受負載後其等效應力與等效應變的分佈，並由軟體所提供亞蘭德模型模擬錫球在高溫恆溫之黏塑性，以符合實際錫球材料特質；此外，將分析所得之錫球等效應變範圍藉由Modify Coffin-Manson Equation計算出疲勞壽命。
本文分析重點主要是模擬錫球幾何、BT基板厚度、不同材質與墊片直徑等變化因子承受熱循環負載後，探討錫球可靠度之影響；進一步找出提高錫球可靠度方法，以提供未來設計與改善錫球參考依據。

This study aims to investigate the thermal fatigue life of the solder ball.Generally, the fatigue of the solder ball results from thermal cyclic loading in different thermal expansion coefficiency of the material in the IC package.
To analyze the equivalent stress and the equivalent strain distributions of the solder ball under loading, an analysis software ANSYS was adopted in this study. To stimulate viscoplastic (creep and plastic) property of the solder ball, the Anand model was adopted. From the modified Coffin-Manson equation and the viscoplastic strain range, the fatigue life of the solder ball was obtained finally.
The causes of the fatigue life of the solder ball in this study were attributed to many factors, such as the solider ball’s geometry, substrate thickness, different material properties, change of pad diameter, etc. Finally, the researcher found the increasing solder joint reliability methods and supplied the improving solder joint data for the design engineer.

中文摘要……………………………………………………………....I
英文摘要……………………………………………………………....II
目錄…………………………………………………………………....III
圖目錄……………………………………………………………......V
表目錄…………………………………………………………………..IX

第一章 緒論………………………………………………………...1
1-1 前言…………………………………………………………......1
1-2 研究動機與目的……………………………………………......3
1-3 文獻回顧……………………………………………………....5

第二章 理論分析與數學模式……………………………………...7
2-1 熱傳遞理論…………………………………………………....7
2-2 材料特性……………………………………………………....9
2-3 亞蘭德模型…………………………………………………...12
2-4 可靠度理論…………………………………………………...18

第三章 研究方法與步驟……………………………………………21
3-1 TF-BGA封裝體結構與有限元素模型………………………….21
3-2 TF-BGA有限元素邊界條件設定與基本假設……………....28
3-3 ANSYS有限元素分析軟體…………………………………...31

第四章 案例與結果討論……………………………………………39
4-1 案例一 原始模型分析……………………………………….39
4-2 案例二 穩態分析與比較…………………………………….50
4-3 案例三 錫球幾何形狀分析與比較…………………….....53
4-4 案例四 BT基板厚度分析與比較…………………………...60
4-5 案例五 不同材質分析與比較……………………………….63
4-6 案例六 不同銅墊直徑尺寸分析與比較…………………….67

第五章 結論…………………………………………………………70
5-1 結論…………………………………………………………..70
5-2 未來研究方向…………………………………………………71

參考文獻……………………………………………………………….73

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