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博碩士論文 etd-0621102-125433 詳細資訊
Title page for etd-0621102-125433
論文名稱
Title
利用錫銲技術構裝半導體雷射模組之研究
The Laser Diode Module Packaging by Soldering Technique
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
64
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2002-06-13
繳交日期
Date of Submission
2002-06-21
關鍵字
Keywords
半導體雷射、錫銲技術
Soldering Technique, Semiconductor Laser
統計
Statistics
本論文已被瀏覽 5693 次,被下載 52
The thesis/dissertation has been browsed 5693 times, has been downloaded 52 times.
中文摘要
中文摘要
本論文為利用錫銲技術構裝雙排線式(DIP)雷射模組之研究,首先控制最佳氫氟酸與機油比例及最佳電弧放電之時間與位置製作出高耦光效率的光纖透鏡。光纖透鏡最佳曲率半徑約為9mm,光纖透鏡中心與光纖中心軸的偏位移小於0.5mm,而耦光效率可達82%。
模組構裝主要元件為FP雷射、檢光器、銅質基座與致冷器。首先將雷射晶粒、檢光器與熱敏電阻固定於銅質基座上,接著用加熱平台加熱模組外殼下方,使致冷器銲接在模組外殼上,且將銅質基座銲妥固定於致冷器上方。利用鑷子夾住光纖透鏡及光學座進行耦光與構裝,以電極加熱器施熱於銅質基座使被熔化體積約1.5mm3 之銦線絲與光纖混合,再調整光纖透鏡使達到最大耦光效率,整個步驟約為30秒。本研究之構裝後所耦到的光功率可以達到2.93mW,耦光效率為58.6%。
分析所量測的錫銲構裝後光纖透鏡縱向位移量約為7~10mm,橫向位移量約為0.5~1
Abstract
ABSTRACT

A DIP (dual-in-line) laser diode module packaging by soldering technique was investigated. We made high coupling efficiency fiber lens under the best arc fusing conditions. The coupling efficiency of fiber lens was obtained 82%, while offset of fiber lens center was less than 0.5mm and curvature radius was about 9mm. We metallized the high coupling efficiency fiber lens, and packaged it in the DIP housing. The components inside the module were uncoated FP (Fabry-Perot) laser chip, p-i-n detector, substrate, and cooler. We made a package process as follows: 1) We utilized the heating apparatus to fix the FP laser, PIN detector, and thermistor on the substrate. 2) We utilized the heating apparatus to make the cooler fixed on the DIP housing and the substrate fixed on the cooler. 3) We utilized the electrothermal heating machine to melt 1.5mm3 indium wire and adjusted the fiber lens by tweezer to couple light into the fiber inside the DIP housing. We obtained the 2.93mW output power and 58.6% coupling efficiency after packaging.
The post-soldering-shift resulted from the indium solidification was the most important factor affecting the coupling efficiency. By improving substrate design properly, we could reduce the indium quantity to minimize the solidification effect. The post-soldering-shift should be controlled below 1mm in the transverse axis and below 10 mm in the longitudinal axis, respectively. Finally, We achieved an external cavity fiber grating laser module with 2mW output power, and got an open eye pattern after measuring the DIP transmitter module.

目次 Table of Contents
頁 次
中文摘要 Ⅰ
英文摘要 Ⅱ
致謝 Ⅲ
內容目錄 Ⅳ
圖表目錄 Ⅶ
第一章 緒論 1
1-1. 研究背景 1
1-2. 論文架構 3
第二章 高耦光效率光纖透鏡的製作 6
2-1. 光纖透鏡的製作 7
2-2. 耦光效率量測的方法 8
2-3. 光纖透鏡耦光效率量測結果與分析 9
2-3.1曲率半徑對耦光效率的影響 9
2-3.2偏位移對耦光效率的影響 10
2-4. 鍍金光纖的製作 11
2-4.1材料與儀器的準備 11
2-4.2蒸鍍儀器 12
2-4.3蒸鍍過程 12
2-4.4清洗過程 13
第三章 雙排線式模組的構裝 21
3-1. 雙排線式構裝 21
3-2. 雙排線式構裝的架構設計與流程 22
3-2.1基座的設計 22
3-2.2 DIP構裝流程 22
3-3. 元件與銲錫及助銲劑之功能和性質分析 24
3-4. DIP構裝裝置的介紹 27
3-5. 光纖固定的過程 27
第四章 雙排線式模組構裝結果與分析 37
4-1. 完成構裝之結果 37
4-2. 結果分析 37
4-3. 錫銲構裝技術的應用 38
4-3.1 980nm半導體雷射之構裝 38
4-3.2 980nm半導體雷射構裝結果 39
第五章 光纖光柵外部共振腔雷射模組構裝 47
5-1. 外部共振腔雷射原理簡介 47
5-2. 光纖光柵之理論 48
5-2.1 光纖光柵之製作 48
5-2.2 光纖光柵特性參數之量測 49
5-3. 外部共振腔雷射構裝技術 49
5-4. 外部共振腔雷射構裝後結果 50
5-4.1 FP雷射之光譜 51
5-4.2 構裝後光纖光柵外部共振腔雷射之功率-電流分析 51
5-4.3光纖光柵外部共振腔雷射之波長特性 52
5-5. 量測結果 52
5-6. 分析與討論 53
第六章 結論與未來工作 63
6-1. 結論 63
6-2. 未來工作 63
參考文獻 65


參考文獻 References
參考文獻
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