中文摘要

本研究目的係以耐龍(Nylon)和液晶聚合物(Liquid crystal polymer, LCP)材料填加導電性碳纖維當作塑膠外殼，來達到塑膠外殼雷射模組具有電磁屏蔽的效果。
研究結果發現雷射收發模組傳輸速率155Mbps與1.25Gbps之屏蔽效應分別可達到13dB與20dB，符合FCC class B之規範，因此塑膠導電性纖維外殼材料之雷射收發模組確實可達到電磁屏蔽的目的。

Abstract
The Nylon and liquid crystal polymer(LCP) filled with conductive carbon fiber applied to 155Mbps and 1.25Gbps transceiver modules for electromagnetic(EM) shielding were studied.
The measured results showed that the shielding effectiveness(SE) of 155Mbps and 1.25Gbps transceiver module were 13dB and 20dB to conform to FCC class B standard, respectively. This indicates that the plastic housing filled with conductive carbon fiber is suitable for EM shielding in plastic laser transceiver module applications.

內容目錄
中文摘要 Ⅰ
英文摘要 Ⅱ
致謝 Ⅲ
內容目錄 Ⅳ
圖表目錄 Ⅶ
第一章 導論 1
1.1研究目的 1
1.2 論文架構 2
第二章 電磁屏蔽材料的製作 4
2.1 複合材料之製作 4
2.1.1 複合材料的製程 4
2.2 成品製作方法 7
2.2.1 壓縮成形 6
2.2.2 射出成形 8
2.2.3 參考試片 8
第三章 屏蔽效率量測 14
3.1 同軸傳輸線之規範 14
3.2 量測方法 14
3.3 量測結果 15
第四章 雷射收發模組的電路設計 20
4.1 雷射收發模組的規格與應用 20
4.2 雷射收發模組的傳輸訊號原理 21
4.3 晶片的內部及旁接電路解說 22
4.4 PCB版的製作 27
4.4.1 電源分層問題 27
4.4.2 微帶線阻抗匹配 28
4.4.3 端點連接元件 29
4.4.4 測試板的製作 32
4.5 眼圖的測試 35
第五章 量測EMI的實驗架構 50
5.1 無反射波實驗室使用前準備工作 51
5.1.1訊號產生器的設定 51
5.2.2頻譜分析儀的校正工作 53
5.2.3近場與遠場的理論分析 54
5.2以電偶極與磁環圈當輻射源 56
5.3量測雷射收發模組EMI 59
5.3.1雷射收發模EMI量測結果 60
5.3.2 射出成型時不同灌點對屏蔽效應的影響 61
5.4 材料厚度對屏蔽效應的影響 63

第六章 結果與討論 76
參考書目 78
附錄一 材料特性 80

參考書目
[1] Clayton R. Paul, “Introduction to Electromagnetic Compatibility,”. A Wiley-interscience publication, ch.1.pp42-p60, (1992)

[2] W. H. Cheng, J. Y. Cheng, T. L. Wu, C. M. Wang, S. C. Wang, and W. S. Jou, “Electromagnetic shielding of plastic packaging in low-cost laser modules,” Electronics Letters, Vol. 36, No. 2, pp118-119, (2000)

[3] W. S. Jou, T. L. Wu, S. K. Chiu, and W. H. Cheng, “Electromagnetic Shielding of Nylon-66 Composites Applied to Laser Modules,” IEEE/TMS Journal of Electronic Materials, Vol. 30, No. 10, pp1287-1293, (2001)

[4] T. L. Wu, S. G. Dai, P. L. Li, W. S. Jou, and W. H. Cheng, “Effect of Carbon-fiber Orientation on the Shielding for the Plastic Optical Laser Module Packages,” accepted for presentation in 2002 Electronic Components & Technology Conference (2002 ECTC), San Diego, California USA, May 28 – 31, (2002)

[5] P.B.Schulz, V.C. Plantz, and D.R. Brush, “Shielding theory and practice,” IEEE Trans. on Electromagnetic Compatibility, EMC-30, pp187-201, (1988)

[6] Perry F. Wilson, Mark T. MA., J.W. Adams, “Techniques for Measuring the Electromagnetic Shielding Effectiveness of Materials: Part I: Far-Field Source Simulation,” IEEE Tran. on EMC, Vol.30, No.3, pp239-250, (1988)

[7] J.R. James, A.J. Race and L.A. Scott, “Electromagnetic shielding degradation effects in composite material enclosures,” Electronics letters, Vol.35, No.3, pp209-211, (1999)

[8] Clayton R. Paul, “Introduction to Electromagnetic Compatibility,” A Wiley-interscience publication, ch.11.pp652-656, (1992)

[9] American Society for Testing and Matericals,” 1997 Annual book of ASTM standards. Section 14: General methods and instrumentation”, Philadelphia, Pa. : American Society for Testing and Materials, ASTM D4935-89; ASTM pp442-450, (1997)

[10] Jeffrey Cain, ”Interconnect Schemes for Low Inductance Ceramic Capacitors,” AVX Technical Information, (1999)

[11] Howard Johnson, ”Parasitic Inductance of a Bypass Capacitor,” EDN, p32,Jul 20, (2000)

[12] Jeffrey Cain, ”The Effects of ESR and ESL in Digital Decoupling Applications,” AVX Technical Information, (1997)

[13] David M. Pozar, “Microwave Enfineering,”. John Wiley& Sons, INC., ch.5.pp251-260, (1998)

[14] Larry Smith,et al., “Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology,” IEEE transactions on Advanced Packaging, Vol. 22,No. 3, (1999)

[15] 邱首凱, ”塑膠複合材料電磁屏蔽效應之研究” 國立中山大學碩士(2001)

[16] 鄭木海,”雷射二極體構裝技術之近況與趨勢” 光訊，第六十九期(1997)

[17] S. Iijima, “Helical microtube of graphitic carbon,” Nature, vol. 354, pp56-58, (1991)

[18] F. Ito, Y. Tomihari, Y. Okada, K. Konuma, and A. Okamoto, “Extremely low-voltage triode field emission display using carbon nanotube,” in Proc. 6th Int. display Workshop, Kobe, Japan, pp. 1177-1178, (2000)