在本研究中，提出以微型MT ferrule固定斜角光纖陣列應用於矽光子晶片光柵耦合，利用矽光學平台定位以雷射切割製作×4斜角光纖陣列其間距為250µm。以傳統的×4微型MT ferrule連接到斜角光纖陣列，可以晶片儲存以及運送過程中可以去除光纖尾巴。使用MT斜角光纖量測偶合損耗為-10.1dB，比傳統垂直光纖量測高約1.1dB。量測其元件之量測均勻性，×4斜角光纖陣列的均勻性為0.74dB，未來在改善以雷射切割光纖斜面的平整度，可以進一步使均勻性更佳。

In this thesis, an angled fiber array with mini MT ferrule is proposed for grating coupling of a Si photonic integrated circuit. The×4 angled-fiber array was formed by laser cutting on silicon optical bench with a pitch of 250µm. A conventional ×4 mini MT ferrule was connected to the fiber array to remove fiber tails during storage and transportation .The coupling loss of the angled-fiber coupler with MT ferrule is-10.1dB, which is about 1.1dB higher than that of the conventional vertical fiber coupling technique. The uniformity of the device was also measured. The uniformity of ×4 angled fiber array is 0.74dB. The uniformity can be further reduced by improving smoothness of the facets of the fibers formed by laser cutting.

目錄

中文論文審定書 i
英文論文審定書 ii
致謝 iii
摘要 iv
Abstract v
目錄 vi
圖目錄 ix
表目錄 xii
第一章 緒論 1
1-1前言 1
1-2光纖與光波導 2
1-3矽光子耦合方法及困難 4
1-4矽光子封裝概況 6
1-5實驗動機 9
第二章 原理與儀器介紹 11
2-1光柵耦合器(Grating coupler) 11
2-2-1繞射光柵 11
2-2-2光柵耦合器原理 12
2-2濕蝕刻(wet etching) 14
2-2-1濕蝕刻介紹 14
2-2-2等向性蝕刻與非等性蝕刻 16
2-2-3常用非等向性矽蝕刻液介紹 16
2-2-4補償結構 18
2-3機台介紹 19
2-3-1高溫石英爐管 19
2-3-2接觸式曝光機 20
2-3-3切割機 21
2-3-4研磨機 22
2-3-5蒸鍍機 23
2-3-6紫外光臭氧清洗機(UV-Ozone) 24
2-4光罩設計概念介紹 25
第三章 製程材料與儀器步驟 27
3-1Silicon optical bench製作 27
3-1-1清洗基板(cleaning) 27
3-1-2濕氧法成長Thermal oxide 28
3-1-3黃光微影(Photolightography) 29
3-1-4 Thermal oxide濕蝕刻(Wet etching) 31
3-1-5 Silicon 濕蝕刻(Wet etching ) 31
3-1-6切割 32
3-1-7Silicon optical bench製作流程圖 33
3-2 MT光纖元件製作 34
3-2-1 MT fiber array 35
第四章結果與討論 39
4-1 Silicon optical bench 39
4-2MT fiber array 40
4-3耦光效率模擬 41
4-4 MT fiber array量測與比較 44
4-4-1MT fiber array量測 45
4-4-2MT fiber array均勻性量測 49
第五章 結論與未來展望 51
參考文獻 52

[1]http://www.eenewseurope.com/news/cmos-compatible-intra-chip-photonics-brings-new-class-sensors
[2]https://zh.wikipedia.org/wiki/光導纖維
[3]Q. Xu, V. R. Almeida, and M. Lipson, “Demonstration of high Raman gain in a submicrometer-size silicon-on-insulator waveguide”, Opt. Lett., 30, 35(2005).
[4]Q. Xu, S.Manipatruni, B. Schmidt, J. Shakya, and M. Lipson, “12.5 Gbit/s carrier-injection-based silicon micro-ring silicon Modulators”, Opt. Express, 15, 430(2007).
[5] Shin, J. S., Park, T. H., Chu, W. S., Lee, C. H., Shin, S. Y., & Oh, M. C. (2015). Tunable channel-drop filters consisting of polymeric Bragg reflectors and a mode sorting asymmetric X-junction. Optics express, 23(13), 17223-17228.
[6] F. Xia, M. Rooks, L. Sekaric, and Y. Vlasov, “Ultra-compact high order ring resonator filters using submicron silicon photonic wires for on-chip optical interconnects”, Opt. Express, 15, 11934(2007).
[7] L. Zhou and A. W. Poon, “Electrically reconfigurable silicon microring resonator-based filter with waveguide-coupled feedback”, Opt. Express, 15,9194(2007).
[8]https://www.moneydj.com/KMDJ/Report/ReportViewer.aspx?a=ae462f37-92b2-11d4-a1a4-00e018b00aed
[9] Christophe Kopp, Stephane Bernab ´ e, Badhise Ben Bakir, Jean-Marc Fedeli, Regis Orobtchouk, ´ Franz Schrank, Henri Porte, Lars Zimmermann, and Tolga Tekin “Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging” , IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 17, NO. 3, MAY/JUNE 2011
[10] Chao Li,* Huijuan Zhang, Mingbin Yu, and G. Q. Lo, “CMOS-compatible high efficiency double-etched apodized waveguide grating coupler” OPTICS EXPRESS 7874(2013)
[11] Automated High-Throughput Assembly for Photonic Packaging
[12]L. Zimmermann, H. Schröder, P. Dumon, W. Bogaerts,and T. Tekin, “ePIXpack - Advanced Smart Packaging Solutions for Silicon Photonics” Eindhoven, The Netherlands, June 11-13, 2008
[13]F. E. Doany, et. al., "Multichannel High-Bandwidth Coupling of Ultradense Silicon Photonic Waveguide Array to Standard-Pitch Fiber Array," Lightwave Technology, Journal of , vol.29, no.4, pp.475, Feb.15, 2011
[14] https://www.tyndall.ie/packaging
[15] Dirk Taillaert, Wim Bogaerts, Peter Bienstman, Thomas F. Krauss, Peter Van Daele, Ingrid Moerman, Steven Verstuyft, Kurt De Mesel, and Roel Baets, “An Out-of-Plane Grating Coupler for Efficient Butt-Coupling Between Compact Planar Waveguides and Single-Mode Fibers ” IEEE JOURNAL OF QUANTUM ELECTRONICS, VOL. 38, NO. 7, JULY 2002
[16] Erwin G. Loewen and E. Popov, Diffraction Gratings and Applications, Marcel Dekker Inc. ,1997.
[17] Dirk Taillaert, “Grating couplers as Interface between Optical Fibers and Nano photonic Waveguides,” Ph.D. Dissertation, University Gent,Nov.2004.
[18] 賴士弘. (2014). 低同調干涉量測分析 SOI 微環型共振腔透過光柵耦合器的耦光方式. 中山大學光電工程研究所學位論文, 1-78

[19] Shankar Kumar Selvaraja, Diedrik Vermeulen, Marc Schaekers* , Erik Sleeckx* , Wim Bogaerts, Gunther Roelkens, Pieter Dumon, Dries Van Thourhout, Roel Baets ,” Highly efficient grating coupler between optical fiber and silicon photonic circuit,” 2009 OSA/CLEO
[20]莊達人, VLSI 製造技術, 高立圖書有限公司.
[21] T. Baum, D. J. Schiffrin, “AFM study of surface finish improvement by ultrasound in the anisotropic etching of Si<100> in KOH for micromachining applications”, J. Micromech. Microeng. Number 4, pp. 338-342, (1997).
[22] C. Jing, L. Litian, L. Zhijian, T. Zhimin, J. Qianshao, F. Huajun, X.Yang, “Study of anisotropic etching of (100) Si with ultrasonic
agitation”, Sensors and Actuators A 96, pp. 152-156, (2002).
[23] Irena Zubel, Malgorzata Kramkowska, “The effect of isopropyl alcohol on etching rate and roughness of (100) Si surface etched in KOH and TMAH solutions”, Sensors and Actuators A 93, pp.138-137, (2001).
[24] H.R. Robbins and B. Schwartz, “Chemical etching of silicon-I. The
system HF, HNO3, H2O, and HC2C3O2,” J. Electrochem, Soc., Vol.
106, No. 6, pp. 505-508, (1959).
[25] H.R. Robbins and B. Schwartz, “Chemical etching of silicon-II. The system HF, HNO3, H2O, and HC2C3O2”, J. Electrochem, Soc., Vol. 107, No. 2, pp. 108-111, (1960).
[26] B. Schwartz and H. R. Robbins, “Chemical etching of silicon-III. A temperature study in the acid system, “ J. Electrochem. Soc., Vol. 108, No. 4, pp. 365-372, (1961).
[27] Gregory T. A. Kovacs, Nadim I. Maluf, Kurt E. Petersen, “Bulk Micromachining of Silicon”, Proceedings of the IEEE, Vol. 86, No. 8,August, pp.1536-1551, (1998).
[28] M. Elwenspoek, “The form of etch rate minima in wet chemical anisotropic etching of silicon”, Journal of Micromechanical and Micro engineering, Vol. 6, pp. 405-409, (1996)
[29]J.M. Crishal and A. L. Harrington, ”A Selective Etch for Elemental Silicon, ”Electrochemical Society Extended Abstracts, Vol.109, Aabst#89,Spring Meeting,Los Angles,1962,p.71C.]
[30] R.M. Finne and D.L. Klein, ”A Water Soluble Amine Complexing Agent System for Etching Silicon,”J.E.C.S.,Vol.114,1967,p.965
[31] J.B.Price, ”Anisotropic of Silicon with KOH-H2O-IPA,” in Semiconductor Silicon, ed. H. R. Burgess, Princeton, NJ, Electrochemical Socety Proceedings, 1973,p.339.
[32] https://slideplayer.com/slide/4822800/
[33] E. Obermaier, H. Sandmaier and K. Kuhl, IEEE Workshop on Micro-Robotics and Teleoperators, Hyannis, MA, (1987).
[34] OAI 500 Instruction Manual, 資騰科技股份有限公司
[35] http://www.pentad.com.tw/product-4-2.html.