本論文研討應用於光纖通訊2.5Gb/s光收發模組的研製與特性量測。光收發模組構成係包含光發射機與接收機兩個部份，光發射機由雷射驅動IC與1310nm法布里-柏羅雷射(Fabry-Perot Laser，FP)的光發射次組裝模組(Transmitter Optical Sub-Assembly，TOSA)組成，而接收機由限幅放大器與1310nm檢光二極體的光接收次組裝模組(Receiver Optical Sub-Assembly，ROSA)所組成。
在模組的設計中，除元件會影響其特性外，最重要的是印刷電路板的佈線及訊號傳輸上須使用最適合的終端阻抗匹配方式才能有效減少因反射產生的影響，另外還要考慮電磁干擾和串音問題，這樣才能達到最佳的設計。
光收發模組在訊號27-1傳輸速率2.5Gb/s操作下，發射機部分，Peak-Peak Jitter量測結果為29ps。接收機部份，以自發自收架構，Peak-Peak Jitter量測結果為29ps。光收發模組經兩公里光纖傳輸，其Peak-Peak Jitter量測結果為30ps，且遮罩都符合ITU-T的mask的規範。在誤碼率的為10-12條件下，接收端靈敏度仍可達到-15.4dBm。

In this thesis, the fabrication and performance of the 2.5Gb/s optical transceiver modules applied in optical communication network are discussed. The optical transceiver modules consist of transmitter and receiver. The transmitters are composed by laser driver IC and 1310 FP (Fabry-Perot) laser, where the receivers are composed by limiting amplifier IC and 1310nm ROSA (Receiver Optical Sub-Assembly).

In the design of modules, not only components but also the PCB layout affects the performance heavily. In signal transmission, we must use proper termination scheme to eliminate the signal reflection. Besides we must also consider the EMI and crosstalk problems, so the design will be perfect.

An optical transceiver module is operated at signal pattern of 27-1 and data rate of 2.5Gb/s. In transceiver, the result of measurement, Peak-Peak Jitter is 29ps. In receiver, back to back, the Peak-Peak Jitter is 29ps. In addition, the measuring result connecting with 2km fiber of Peak-Peak Jitter is 30ps. The result of eye diagram measurement can meet the mask of ITU-T standard. In the condition of bit error rate of 10-12 , the sensitivity of receiver is -15.4dBm.

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中文摘要………………………………………………………………Ⅰ
英文摘要………………………………………………………………Ⅱ
誌謝……………………………………………………………………Ⅲ
目錄……………………………………………………………………Ⅴ
圖表目錄………………………………………………………………Ⅷ
第一章 序論……………………………………………………………1
1.1研究動機……………………………………………………………1
1.2光收發模組之簡介…………………………………………………5
1.3論文架構……………………………………………………………6
第二章 雷射與檢光器之原理…………………………………………7
2.1概要…………………………………………………………………7
2.2穩態下之變化雷射特性……………………………………………8
2.3雷射二極體的暫態變化特性………………………………………11
2.4半導體檢光器的檢光原理…………………………………………17
2.5 PIN檢光二極體……………………………………………………20
第三章 光收發模組之組成設計及分析………………………………23
3.1光發射機模組………………………………………………………23
3.1.1雷射與驅動電路之分析……………………………………24
3.1.2偏壓電流電路………………………………………………27
3.1.3自動功率控制電路…………………………………………29
3.1.4直流耦合……………………………………………………32
3.1.5交流耦合……………………………………………………36
3.2光接收機模組………………………………………………………37
3.2.1接收機驅動IC………………………………………………37
3.2.2檢光二極體特性……………………………………………41
3.2.3限幅放大器輸入與輸出電路設計…………………………42
第四章 印刷電路基板之設計技術及測量結果………………………45
4.1印刷電路基板之設計技術…………………………………………45
4.1.1各種雜訊之探討與解決方法………………………………46
4.1.2印刷電路基板之電磁雜訊干擾對策………………………51
4.1.3 EMC與印刷電路板…………………………………………53
4.2印刷電路板佈局之終端(Termination)設計……………………57
4.3模組實際電路佈局架構及傳輸線設計……………………………61
4.3.1電路實際應用技巧設計……………………………………61
4.3.2傳輸線設計…………………………………………………62
4.3.3電路實際佈線圖與實體圖…………………………………63
4.4雷射L-I、頻率響應及頻譜量測…………………………………66
4.4.1雷射L-I量測………………………………………………66
4.4.2雷射頻率響應量測…………………………………………67
4.4.3雷射頻譜量測………………………………………………74
4.5光發射機與光收機模組量測………………………………………78
4.5.1量測參數探討………………………………………………78
4.5.2光發射機模組量測…………………………………………81
4.5.3光接收機模組量測…………………………………………84
4.5.4光收發模組誤碼率量測……………………………………91
第五章 結論與未來工作………………………………………………93
5.1結論…………………………………………………………………93
5.2未來工作……………………………………………………………94

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