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博碩士論文 etd-0701103-142704 詳細資訊
Title page for etd-0701103-142704
論文名稱
Title
覆晶錫球陣列封裝之無鉛錫球接點可靠度測試
Flip-Chip Ball Grid Array Lead Free Solder Joint under Reliability Test
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
95
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2003-06-10
繳交日期
Date of Submission
2003-07-01
關鍵字
Keywords
無鉛錫球、可靠度測試
Reliability Test, Lead-Free Solder
統計
Statistics
本論文已被瀏覽 5698 次,被下載 5233
The thesis/dissertation has been browsed 5698 times, has been downloaded 5233 times.
中文摘要
摘 要
在電子封裝中,錫球焊接點是最容易產生缺陷的地方。為了因應環保的要求,因此,開發不含鉛的錫球焊料是當前最重要的課題之一。在銲接過程中,錫球下層金屬(UBM)與無鉛錫球界面間的粘結性、元素擴散阻障效果、潤濕能力及所導致的介金屬化合物(IMC)結構,都是影響長期可靠度測試的重要因素。本文針對一純錫錫球內為鋁/鎳釩/銅(Al/NiV/Cu)UBM結構並搭配常用的無電鍍鎳金基板,進行可靠度測試。
測試的試片一為純錫錫球搭配Al/NiV/Cu UBM之裸晶片(Bare Die)二為裸晶片搭配常用的標準金基板之完整封裝晶片(Package),實驗目的主要在測試其經過多次迴銲及不同溫度之高溫儲藏後的機械性質,以及加電壓運作後之壽命,同時亦藉由電子顯微鏡之觀察以了解其IMC之成長狀況及造成破壞之機構。以了解此組合之損壞機制與IMC的關係。
由實驗之結果得知,260℃多次迴銲會造成裸晶片發生IMC與晶片脫層的現象,但對其機械性質不造成影響,高溫儲藏則會降低裸晶片的錫球剪力測試值。多次迴銲與高溫儲藏則會明顯的降低完整封裝晶片的機械性質,這表示隨著測試的進行,錫球與晶片間的黏著效果會有明顯的降低。至於高溫操作電流壽命測試,完整封裝晶片在150℃及320mA(5040A/ )的測試條件下的平均穩定使用壽命為892小時,平均極限使用壽命為1,053小時,主要失效模式發生於R1接點。
Abstract
ABSTRACT
In package, it’s easy to have defects in the solder joint, for the request of environment protection, lead-free solder research is one of the most important topics now. In soldering, the adhesion, diffusion barrier, and wettability of the interface between UBM and a lead-free solder, and the caused IMC structure that are important elements to influence long-term reliability tests. The thesis is aimed to investigate the combination of pure tin/Al-NiV-Cu UBM/STD Au substrate under reliability tests.
The samples are bare dies in which the combination is pure tin/ Al-NiV-Cu UBM and packages of is pure tin/Al-NiV-Cu UBM/STD Au substrate. The goals are to realize the mechanical properties under multiple reflows and long term HTST tests with different temperatures and the operational life. We also uses SEM to observe the growth of IMC and the failure modes that help us to realize the connection between failure modes and IMC.
The results of experiment can be concluded as follows. In a bare die, 260℃multiple reflows test causes delamination between IMC and die, but doesn’t affect the mechanical properties of it, and HTST test lowers the bump shear strength of it. In package, multiple reflows test and HTST test lower the mechanical properties significantly, the result also means that the adhesion between bump and die will drop significantly as tests go on. In HTOL test with the conditions of 150℃ and 320mA, the average stable service time of the package is 892 hours, and the average ultimate service time of the package is 1,053 hours, most probable failure site is in R1 joint.
目次 Table of Contents
目錄
目錄 …………….…………………………………………………….I
表目錄 ………………………………………………………………IV
圖目錄 ………………………………………………………………VI
中文摘要 ……...……………………………………………………..X
ABSTRACT ………………………………………………………...XI
第一章 緒論 ………………………………………………………...1
1-1 前言 ……………………………………………………….….1
1-2 IC封裝簡介 …………………….…...…………………….…2
1-2-1 覆晶晶粒封裝技術之介紹 ………….………………….5
1-3 無鉛錫球的發展 ……………………………………………10
1-4 可靠度測試 ………………………………………………....12
1-4-1 可靠度介紹 …………………………………………….12
1-4-2 可靠度測試項目 ……………………………………….14
1-4-3 可靠度測試的失效評估方法 ………………………….15
1-5 研究方向 ……………………………………………………16
1-6 文獻回顧 ……………………………………………………17
1-7 組織與章節 …………………………………………………18
第二章 實驗工作 …………………………………………………..33
2-1 儀器設備 …………………………………………………….33
2-2 封裝試片 …………………………………………………….34
2-2-1 測試項目 ……………………………………………….35
2-3 測試方法 …………………………………………………….37
2-3-1可靠度測試 ……………………………………………..37
2-3-2 剪力測試 ……………………………………………….38
2-3-3 拉力測試 ……………………………………………….39
2-4 試片分析 ……………………………………………………40
2-4-1光學顯微鏡(O.M.)觀察 ……………………………..40
2-4-2 試片研磨拋光 ………………………………………….40
2-4-3 掃描式電子顯微鏡(SEM)觀察 …………………….40
第三章 結果與討論 ………………………………………………..50
3-1 多次迴銲測試 ……………………………………………….50
3-1-1 裸晶片多次迴銲測試 ………………………………….50
3-1-2 完整封裝晶片多次迴銲測試 ………………………….51
3-2 高溫儲藏測試 ………………………………………………51
3-2-1 裸晶片高溫儲藏測試 ………………………………….51
3-2-2 完整封裝晶片高溫儲藏測試 ………………………….52
3-3 高溫操作電流壽命測試 ……………………………………53
3-4 剪力測試 ……………………………………………………53
3-4-1 裸晶片錫球剪力測試 ………………………………….53
3-4-2 完整封裝晶片剪力測試 ……………………………….54
3-5 拉力測試 ……………………………………………………54
3-6 失效模式 ……………………………………………………54
3-7 實驗結果與討論 ……………………………………………55
3-7-1 裸晶片 …………………………………………………55
3-7-2 完整封裝晶片 …………………………………………56
第四章 結論與未來展望 …………………………………………..91
參考文獻 ……………………………………………………………93
參考文獻 References
參考文獻
1.European Union Waste in Electrical and Electronic Equipment(WEEE)Directive, 3rd Draft, May 2000.
2.Japanese Ministry of Health and Welfare Waste Regulation on Un-Reusable Pb, June 1998.
3.南台科技大學,電子構裝教學,http://elearning.stut.edu.tw/teach/electron/
4.蘇宗麟, “Sn-3.5Ag/Ag厚膜銲錫球格陣列構裝界面反應研究” , 國立台灣大學材料科學與工程學研究所博士論文,(2002).
5.羅金龍, “58Bi-42Sn無鉛銲料與球矩陣封裝鐘Au/Ni/Cu墊層界面反應之研究” , 國立中央大學化學工程與材料工程研究所碩士論文,(2001).
6.Peter Van Zant, “ Microchip Fabrication,” The McGraw-Hill Companies, Inc., 2000.
7.侯振棋, “Si/Ta/TaCu/Cu/Ni-P/Sn-Pb銲錫隆點之製作與可靠度研究” , 國立成功大學材料科學及工程學系研究所碩士論文,(2001).
8.王祥文, “電遷移效應對錫微結構影響之探討” , 國立中央大學化學工程與材料工程研究所碩士論文,(2002).
9.鐘明錦, “以錫膏印製Ta/CuTa/Cu/Ni/Au/Solder銲錫隆點及其可靠度之研究” , 國立成功大學材料科學及工程學系研究所碩士論文,(2001).
10.劉益銘, “電子構裝銦基無鉛銲錫與金厚膜及銀基板之界面反應研究” , 國立台灣大學材料科學與工程學研究所博士論文,(2001).
11.Se-Young Jang and Kyung Wook Paik, “ Comparison of Electroplated Eutectic Sn/Bi and Sn/Pb Solder Bumps on Various UBM Systems,” Electronic Components and Technology Conference(2000)
12.Peng Su, Tai Korhonen, Matt Korhonen, and Che-Yu Li, “ Intermetallic Phase Formation and Growth Kinetics at the Interface Between Molten Solder and Ni-Containing Under Bump Metallization,” Electronic Components and Technology Conference(2000)
13.Soon-Jin Cho, Ji-Yon Kim, Myung-Geun Park, Ik-Sung Park, and Heung-Sup Chun, “ Under Bump Metallurgies for a Wafer Level CSP with Eutectic Pb-Sn Solder Ball,” Electronic Components and Technology Conference(2000)
14.T. M. Korhonen, P. Su, S. J. Hong, M. A. Korhonen, and C.-Y. Li, “ Under Bump Metallizations for Lead-Free Solders,” Electronic Components and Technology Conference(2000)
15.Guowei Xiao, Philip Chan, Cai Jian, Annette Teng, and Mathew Yuen, “ The Effect of Cu Stud Structure and Eutectic Solder Electroplating on Intermetallic Growth and Reliability of Flip-Chip Solder Bump,” Electronic Components and Technology Conference(2000)
16.Poi Siong Teo, Yu-Wen Huang, Chih Hang Tung, Michael Raj Marks, and Thiam Beng Lim, “ Investigation of Under Bump Metallization Systems for Flip-Chip Assemblies,” Electronic Components and Technology Conference(2000)
17.Vaidyanathan Kripesh, Poi-Siong Teo, Chai Tai Chong and Gautham Vishwanadam, “ Development of a Lead Free Chip Scale Package for Wireless Applications,” Electronic Components and Technology Conference(2001)
18.Tay Hui Leng, Galen Kirkpatrick, Andrew Tay, and Lu Li, “ Cr/Cu/Ni Underbump Metallization Study,” Electronic Components and Technology Conference(2001)
19.Jong-Kai Lin, Ananda De Silva, Darrel Frear, Yifan Guo, Jin Wook Jang, Li Li, Dianne Mitchell, Betty Yeung and Charles Zhang, “ Characterization of Lead-Free Solders and Under Bump Metallurgies for Flip-Chip Package,” Electronic Components and Technology Conference(2001)
20.Young-Doo Jeon and Kyung-Wook Paik, “ Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel UBM-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability,” Electronic Components and Technology Conference(2001)
21.Se-Young Jang, Juergen Wolf, Oswin Ehrmann, Heinz Gloor, Herbert Reichl, and Kyung-Wook Paik, “ Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder,“ Electronic Components and Technology Conference(2001)
22.Charles Zhang, Jong-Kai Lin, and Li Li, “ Thermal Fatigue Properties of Lead-free Solders on Cu and NiP Under Bump Metallurgies,” Electronic Components and Technology Conference(2001)
23.R. N. Master, R. C. Blish, D. Morken, and E. Adem, “ Kinetics of C4 Bump Degradation in Overly Aggressive HTOL,“ Electronic Components and Technology Conference(2000)
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