本論文共包含兩個主題：第一主題為FlexRay車載網路通訊系統實體層設計，第二主題為允許次三倍VDD輸入之高效率直流降壓轉換器。
第一個主題討論了現今的車載通訊系統並設計與實現其中的FlexRay規範之實體層IC設計，其中包含匯流排仲裁器與驅動器，並將其整合在一顆混合訊號的系統晶片中，核心面積小於0.8 mm2，功率消耗小於60 mW，對溫度容忍度大符合規定的車用電子標準-40 ℃~+125 ℃。
第二個主題為設計一個允許高電壓輸入的直流切換式降壓轉換器，其特色為增加了允許輸入電壓的範圍，利用了堆疊式功率電晶體架構、電壓轉換電路與相關偵測及控制電路。可在不須高壓製程的情況下以1P6M 0.18 μm CMOS製程實現，核心面積小於0.184 mm2，允許輸入電壓最高可到5 V，且內部參考電壓僅為1 V，增加輸出電壓的可變範圍，具有相當高的轉換效率以延長電源的使用時間，可整合於晶片中提供多準位的供應電壓源。

This thesis comprises two topics : the first one is the design and implementation of FlexRay automotive communication system physical layer. The second part is the design of a high efficiency DC/DC Buck converter with sub-3 × VDD.
The first topic discloses the physical layer design comprising the Bus Guardian and the Bus Driver used in an in-vehicle network compliant with FlexRay standards. It is realized in a mixed-signal chip using TSMC 1P6M 0.18 μm CMOS process. Its core area is less than 0.8 mm2, and power consumption is less than 60 mW.
The second topic is to design a DC to DC step-down converter, which can accommodate wide range VDD. By utilizing stacked power MOSFETs, a voltage level converter, a detector and a controller, the design is realized by a typical 1P6M 0.18 μm CMOS process without any high voltage technology. The core area is less than 0.184 mm2, while the VDD range is up to 5 V. Since the internal reference voltage is 1 V, it can increase the output regulation range. The proposed design attains very high conversion efficiency to prolong the life time of power supply. Therefore, it can be integrated in a system chip to provide multiple supply voltage sources.

致謝 i
摘要 ii
Abstract iii
目錄 iv
圖目錄 vii
表目錄 x
第一章 概論 1
1.1 研究動機 1
1.1.1 FlexRay車載通訊系統 1
1.1.2 允許次三倍VDD輸入之高效率直流轉換器 3
1.2 相關技術與文獻探討 5
1.2.1 車載通訊系統之協定 5
1.2.2 切換式電源管理IC 8
1.3 論文大綱 9
第二章 FlexRay車載通訊系統實體層晶片設計 10
2.1 簡介 10
2.1.1 FlexRay系統層次 10
2.1.2 ECU Node 11
2.2 FlexRay系統實體層原理與架構 12
2.2.1 匯流排驅動器(Bus Driver) 12
2.2.2 匯流排仲裁器(Bus Guardian) 15
2.3 實體層整合電路設計 22
2.3.1 整體架構 22
2.4 電路模擬與晶片量測 25
2.4.1 數位端模擬結果 25
2.4.2 類比電路端模擬結果 26
2.4.3 整合電路模擬結果 28
2.4.4 晶片實際量測結果 30
2.5 討論 35
第三章 允許次三倍VDD輸入之高效率直流轉換器 36
3.1 簡介 36
3.1.1 直流電源供應器分類 36
3.1.2 線性穩壓器 37
3.1.3 切換式電源轉換器 38
3.2 直流降壓轉換器之分析 40
3.2.1 電特性指標之定義 40
3.2.2 轉換效率分析 41
3.3 電路架構與晶片設計 42
3.3.1 整體架構說明 42
3.3.2 功率電晶體防過壓之設計 43
3.3.3 脈衝寬度調變電路(Pulse Width Modulator) 45
3.3.4 被動元件電感電容之選擇 48
3.3.5 內部參考電壓源 50
3.3.6 誤差放大器與穩定度分析 51
3.4 晶片模擬結果 55
3.5 討論 59
第四章 結論 60
參考文獻 61

[1] Flexray Consortium. (2006, Nov.) Flexray Communications System Electrical Physical Layer Specification, Version 2.1. Revision B.
[2] Flexray Consortium. (2005, Nov.) FlexRay Preliminary Node Local Bus Guardian Specification, Version 2.0.9.
[3] Road Vehicles-Interchange of Digital Information-Controller Area Network (CAN) for High-Speed Communications, International Standards Organization (ISO). ISO Standard-11898, Nov. 1993.
[4] NXP Semiconductors. (2007, Jul.) FlexRay transceiver, Rev. 02.
[5] G. Caruso, “FlexRay Transceiver in a 0.35um CMOS High-Voltage Technology,” Design, Automation and Test in Europe, 2006 DATE ’06 Proceedings, vol. 2, pp. 1-5, Mar. 2006.
[6] A. Techmer and P. Leteinturier, “Implementing FlexRay on silicon,” Proceedings of the International Conference on Networking, International Conference on Systems and International Conference on Mobile Communications and Learning Technologies, 2006 ICNICONSMCL ’06 Proceedings, pp. 34-40, Apr. 2006.
[7] P. M. Szecowka and M. A. Swiderski, “On hardware implementation of FlexRay bus guardian module,” International Conference on Mixed Design of Integrated Circuits and Systems, 2007 MIXDEX ’07 Proceedings, pp. 309-312, Jun. 2007.
[8] T.-Y. Yu, “A High-Efficiency Synchronous CMOS Switching Regulator with PWM/PFM-Mode Operation,” M.S. thesis, NCTU, Taiwan, 2003.
[9] C.-C. Chang, “A High-Efficiency CMOS DC-DC converter with a New Active Current Sensor for Portable Applications,” M.S. Thesis, YZU, Taiwan, 2005.
[10] M.-Y. Wang, “Application of real-time scheduling on 10Mbps Automotive Electronic Networks,” M.S. thesis, NSYSU, Taiwan, 2007.
[11] C.-C. Wang, G.-N. Sung, and P.-C. Chen, “A transceiver design for ECU nodes in FlexRay-based automotive communication systems,” International Conference Consumer Electronics, 2008 ICCE ’08 Proceedings, pp. 311-312, Jan. 2008.
[12] G.-N. Sung, C.-Y. Juan, and C.-C. Wang, “Bus guardian design for automobile networking ECU nodes compliant with FlexRay standards,” International Symposium on Consumer Electronics, 2008 ISCE ’08 Proceedings, pp. 1-4, Apr. 2008.
[13] G. A. Rincon-Mora and P. E. Allen, “A low-voltage, low quiescent current, low drop-out regulator,” IEEE J. of Solid-State Circuits, vol. 33, no. 1, pp. 36-44, Jan 1998.
[14] A. J. Stratakos, “High-efficiency low-voltage DC-DC conversion for portable applications,” M.S. thesis, U.C. Berkeley, U.S.A., 1998.
[15] B. Murari, F. Bertotti and G.A. Vignola, Smart Power ICs, 2nd ed., New York: Springer Press, 2002.
[16] LTC1772: Constant Frequency Current Mode Step-Down DC/DC Controller in SOT-23, Linear Technology Inc., Oct. 1999.
[17] R. J. Baker, CMOS Circuit Design, Layout, and Simulation, 2nd ed., New York: IEEE Press, 2005.
[18] M. Siu, P. K. T. Mok, K. N. Leung, Y. H. Lam, and W. H. Ki, “A voltage-mode PWM buck regulator with end-point prediction,” IEEE Trans. on Circuits and Systems -II, vol. 53, no. 4, pp. 294-298, Apr. 2006.
[19] J. Xiao. A. Peterchev, J. Zhang and S. Sanders, “An ultra-low-power digitally-controlled buck converter IC for cellular phone applications,” IEEE Applied Power Electronics Conference and Exposition. vol. 1, pp. 383-391, Feb. 2004.
[20] F.-F. Ma, “Advanced Control and Protection Techniques for DC-DC Switched Mode Power Supply IC Design,” Ph.D. Dissertation , NCTU , Taiwan, 2006.
[21] C.-C. Wang, G.-N. Sung, C.-L. Wang, P.-C. Chen, M.-F. Luo, and H.-C. Hu, “Physical layer design for ECU nodes in FlexRay-based automotive communication systems,” International Conference Consumer Electronics, 2009 ICCE ’09 Proceedings, pp. 97, Jan. 2009.
[22] G.-N. Sung, C.-L. Wang, and C.-C. Wang, “The bus guardian design of FlexRay automotive communication systems,” The 19th VLSI Design/CAD Symposium, 2008 VLSI-CAD ’08 Proceedings, pp. 67, Aug. 2008.