Responsive image
博碩士論文 etd-0703101-092132 詳細資訊
Title page for etd-0703101-092132
論文名稱
Title
應用液動壓拋光法於工件表面終極粗度之初步探討
A Preliminary Study on Ultimate Surface Roughness of Hydrodynamic Polishing Process
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
133
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2001-06-27
繳交日期
Date of Submission
2001-07-03
關鍵字
Keywords
終極粗度、液動壓拋光法、粗度移除、表面粗度
roughness reduction, surface roughness, Hydrodynamic Polishing Process, ultimate surface roughness
統計
Statistics
本論文已被瀏覽 5664 次,被下載 1608
The thesis/dissertation has been browsed 5664 times, has been downloaded 1608 times.
中文摘要
本論文旨在探討應用拋光加工對工件表面進行粗度移除所能得到的終極粗度及其特性。本研究將利用液動壓拋光法為研究對象來幫助我們了解拋光加工法的終極粗度及特性,並期望此結論能適用於其他的拋光法。文中除提出終極粗度相關的數學模式,並以實驗的方式加以探討理論的合適性。
文中首先提出達到終極粗度的充要條件,是當單位時間工件粗度在波峰波谷的加工率差異小於最小的加工單位(在本研究中假設為一顆原子的大小)。利用此一概念結合過去的研究提出在液動壓拋光法下終極粗度的理論模式。並以電腦模擬的方式幫助吾人更加瞭解終極粗度的特性,此外更進一步以實驗的方式驗證終極粗度的特性及粗度理論的合適性。
最後針對實驗和理論不一致的地方提出可能的解釋,以作為後續相關研究的方向,並對拋光加工的操作參數提出一些建議,期能對於以拋光加工獲得極光滑表面有所助益。
Abstract
The ultimate value of surface roughness and its characteristic for the polishing process was investigated in this thesis. To find out the nature of ultimate surface roughness by means of the hydrodynamic polishing process and can be used for all polishing method. A preliminary mathematical model that was proposed to explain the ultimate surface roughness proceedings and a series of experiments was planed to verify suitable of this model.
Starting with the rule for ultimate surface roughness happened. The assumption that abrasive particle at roughness peak and valley machining capability differ less than one atom, the ultimate surface roughness be attained. We can propose the mathematical model of ultimate surface roughness based on this rule and the previous study of hydrodynamic polishing process. Following by useing the computer simulation to help us exploring ultimate surface roughness characteristic and testing experiments fit for the forecasting.
Finally, we explain reasons that cause the experiment results not agree with the model anticipation and propose better lubrication condition to polish the optimum surface.
目次 Table of Contents
謝誌…………………………………………………………………………I
英文摘要……………………………………………………………………II
論文摘要……………………………………………………………………III
目錄…………………………………………………………………………IV
圖索引………………………………………………………………………VI
表索引………………………………………………………………………IX

第一章 緒論……………………………………………………………… 1
1.1 前言………………………………………………………………… 1
1.2 研究動機…………………………………………………………… 1
1.3 液動壓拋光法對粗度移除的相關研究…………………………… 3
1.4 研究內容簡介……………………………………………………… 5

第二章 液動壓拋光法加工理論回顧……………………………………7
2.1 液動壓拋光法的加工機制……………………………… 7
2.2 非接觸狀態下的加工率特性……………………………10
2.3 半接觸狀態下的加工率特性………………………………………12
2.4 潤滑條件和加工率特性的關係……………………………………16

第三章 終極粗度的理論模式…………………………………………18
3.1 終極粗度的理論基礎……………………………………18
3.2 非接觸潤滑狀態下的終極粗度…………………………20
3.3 半接觸潤滑狀態下的終極粗度…………………………22
3.3.1 半接觸潤滑下非接觸部分的終極粗度…………22
3.3.2 半接觸潤滑下接觸部分的終極粗度……………………………23
3.4 影響終極粗度的因素………………………………………………26

第四章 終極粗度的特性分析……………………………………… 28
4.1 非接觸潤滑狀態下終極粗度的變化………………… 28
4.2 半接觸潤滑狀態下終極粗度的變化………………… 30
4.2.1 半接觸潤滑下的非接觸部分………………… 30
4.2.2 半接觸潤滑下的接觸部分…………………… 31
4.2.3半接觸潤滑下整體終極粗度的變化………… 33
4.3 結論……………………………………………………34
第五章 實驗結果與規劃…………………………………………… 35
5.1 實驗規劃………………………………………………………35
5.2 實驗設備………………………………………………………39
5.2.1 實驗系統簡介………………………………39
5.2.2 實驗設備及量測儀器…………………………41
5.3 實驗結果與討論…………………………………………………42
5.4 理論模式的修正…………………………………………………47

第六章 結論…………………………………………………………48

參考文獻 …………………………………………………………… 50
參考文獻 References

【1】 R. Bruggemann, “Improved steady-state photocarrier grating in nanocrystalline thin films after surface-roughness reduction by mechanical polishing (1998),” Applied Physics Letters, Vol. 82, No. 4, pp. 309~320.
【2】 A. B. Y. Chan, C. T. Nguyen, P. K. Ko, S. T. H. Chan, and S. S. Wong, “Polished TFT’s:surface roughness reduction and its correlation to device performance improvement (1997),” IEEE Transactions on Electron Devices, Vol. 44, No. 3, pp. 455~463.
【3】 P. Yim, P. Wang, Z. Li, T. Danen, S. Choa, and H. J. Lee, “The role of disk surface waveness on baseline instability of MR head (1999),” IEEE Transactions on Magnetics, Vol. 35, No. 2, pp. 758~763.
【4】 S. F. Soares, D. R. Baselt, J. P. Black, K. C. Jungling, and W. K. Stowell, “Float-polishing process and analysis of float-polished quartz (1994),” Applied Optics, Vol. 33, No. 1, pp. 85~95.
【5】 T. Kasai, F. Matumoto, and A. Kobayashi, “Newly developed fully automatic polishing machines for obtainable super-smooth surfaces of compound semiconductor wafer (1988),” Annals of CIRP, Vol. 37, No. 1, pp. 537~540.
【6】 Y. Mori, K. Yamauchi, and K. Endo, “Elastic emission machining (1987),” Precis. Eng., Vol. 9, No. 3, pp. 123~128.
【7】 Y. Mori, K. Yamauchi, and K. Endo, “Mechanisms of atomic removal in elastic emission machining (1988),” Int. J. Jpn. Precision Eng., Vol. 110, No. 1, pp. 24~28.
【8】 Y. T. Su, S. Y. Wang, and J. S. Hsiau, ”On machining rate of hydrodynamic polishing process (1995),” Wear, Vol. 188, pp. 77~87.
【9】 S. L. Riedinger, et al., “Chemimechanical polishing of cadmium telluride with bromine-methanol solutions (1992),” Material Sci. and Eng., Vol. 15, pp. 9~12.
【10】 L. M. Cook, “Chemical process in glass polishing (1990),” Journal of Non-Crysalt. Solids, Vol. 120, pp. 152~164.
【11】 S. Sivaram, et al., “Planarizing interlevel dielectrics by chemical-mechanical polishing (1992),” Solid State Technology, pp. 87~91.
【12】 M. Hoshino, et al., “Chemical-mechanical polishing of metalorganic chemical-vapor-deposited gold for LSI interconnection (1993),” Jpn. Journal of Applied Physics, Vol. 32 (Part 2) (3B), pp. 392~394.
【13】 F. B. Kaufman, et al., “Chemical-mechanical polishing for fabricating patterned W metal features as chip interconnects (1991),” Journal of the Electrochemical Society, Vol. 138, pp. 3460~3464.
【14】 H. Landis, et al., “Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing (1992),” Thin Solid Film, Vol. 220, pp. 1~7.
【15】 S. R. Runnels and L. M. Eyman, “Tribology analysis of chemical-mechanical polishing (1994),” Journal of the Electrochemical Society, Vol. 141, No. 6, pp.1698~1701.
【16】 S. R. Runnels, “Feature-scale fluid-based erosion modeling for chemical-mechanical polishing (1994),” Journal of the Electrochemical Society, Vol. 141, No. 7, pp. 1900~1904.
【17】 A. A. Yasseen, N. J. Mourlas, and M. Mehregany, “Chemical-mechanical polishing for polysilicon surface micromachining (1997),” Journal of the Electrochemical Society, Vol. 144, No. 1, pp. 237~242.
【18】 J. Zabasajja, T. Merchant, B. Ng, S. Banerjee, D. Green, S. Lawing, and H. Kura, “Modeling and characterization of Tungsten chemical and mechanical polishing process (2001),” Journal of the Electrochemical Society, Vol. 148, No. 2, pp. G73~G77.
【19】 Y. T. Su, “Investigation of removal rate properties of a floating polishing process (2000),” Journal of the Electrochemical Society, Vol. 147, No. 6, pp.2290~2296.
【20】 Y. Higashi, et al., “New machining method for making precise very smooth mirror surface made from Cu and Al alloys for synchrotron optics (1989),” Rev. Sci. Instrum., Vol. 60, No. 7, pp. 2120~2123.
【21】 A. J. Leistner, E. G. Thwaite, F. Lesha, and J. M. Bennett, “Polishing study using Teflon and pitch laps to produce flat and supersmooth surface (1992),” Applied Optics, Vol. 21, No. 10, pp. 1472~1482.
【22】 K. Saito, T. Miyoshi, and Y. Sasaki, “Automation of polishing process for a cavity surface on die and molds by using an expert system (1993),” Annals of the CIRP, Vol. 42, No. 1, pp. 553~556.
【23】 Z. Zhong, V. C. Venkatesh, “Semi-ductile grinding and polishing of ophthalmic aspherics and spherics (1995),” Annals of the CIRP, Vol. 44, No. 1, pp. 339~342.
【24】 V. C. Venkatesh, Z. Zhong, and E. Wihardjo, “Studies on polishing of glass moulds after lapping with hard and soft pellets (1996),” Journal of Materials Processing Technology, Vol. 62, pp. 415~420.
【25】 N. S. Ong, V. C. Venkatesh, “Semi-ductile grinding and polishing of Pyrex glass (1998),” Journal of Materials Processing Technology, Vol. 83, pp. 261~266.
【26】 R.-J. M. van der Bijl, O. W. Fahnle, H. van Brug, and J. J. M. Braat, “In-process monitoring of grinding and polishing of optical surface (2000),” Applied Optics, Vol. 39, No. 19, pp. 3300~3303.
【27】 L. D. Chiffre, H. N. Hansen, and A. Bronstein, “Investigation on the surface topography in polishing using atomic force microscopy (1996),” Annals of the CIRP, Vol. 45, No. 1, pp. 523~528.
【28】 R. E. Parks, C. J. Evans, “Rapid post-polishing of diamond-turned optics (1994),” Journal of Precision Engineering, Vol. 101, No. 3, pp. 223~227.
【29】 A. A. Yasseen, C. A. Zorman, and M. Mehregany “Roughness reduction of 3C-SiC surface using SiC-based mechanical polishing slurries (1999),” Journal of the Electrochemical Society, Vol. 146, No. 1, pp. 327~330.
【30】 R. A. Jones, “Computer simulation of smoothing during computer-control optical polishing (1995),” Applied Optics, Vol. 34, No. 7, pp. 1162~1169.
【31】 Y. Hasegawa, S. Miyazima, “Polishing rate for (100) and (110) surface (1996),” Physica A, Vol. 233, pp. 663~671.
【32】 Y. T. Su, C. C. Horng, Y. D. Hwang, and W. K. Guo, “Effects of tool surface irregularities on machining rate of hydrodynamic polishing process (1996),” Wear, Vol. 199, pp.89~99.
【33】 S. Y. Wang, and Y. T. Su, “An investigation on machinability of different materials by hydrodynamic polishing process (1997),” Wear, Vol. 211, pp. 185~191.
【34】 Y. T. Su, T. C. Hung, and Y. Y. Chang, “On machining rate of hydrodynamic polishing process under semi-contact lubricating condition (1998),” Wear, Vol. 220, pp. 22~33.
【35】 Y. T. Su, and Y. C. Kao, “An experimental study on machining rate distribution of hydrodynamic polishing process (1999),” Wear, Vol. 224, pp. 95~105.
【36】 Y. T. Su, T. C. Hung, and C. C. Horng, “An experimental study on tool wear of hydrodynamic polishing process (2000),” Wear, Vol. 246, pp. 117~129.
【37】 B. J. Hamrock, Funfamentals of fluid dilm lubrication, International edition, Singapore, (1994).
【38】 Y. T. Su, S. H. Liu, and Y. W. Chen, “A preliminary study on smoothing efficiency of surface irregularities by hydrodynamic polishing process (2001),” Wear, in press.
【1】 劉松河, 應用液動壓拋光法於工件表面粗度移除效率之實驗分析與探討, 國立中山大學碩士論文, (2000).
【40】 D. Zhu, H. S. Cheng, “Effect of surface roughness on the point contact EHL (1988),” Journal of Tribology, Vol. 110, pp. 32~37.
【41】 C. C. Kweh, H. P. Evans, R. W. Snidle, “Micro-elastohydrodynamic lubrication of an elliptical contact with transverse and three dimensional sinusoidal roughness (1989),” Journal of Tribology, Vol. 111, pp. 577~584.
【42】 M. Kaneta, T. Sakai, H. Nishikawa, “Effect of surface roughness on point contact EHL (1993),” ASLE Trans., Vol. 36, No. 4, pp. 605~612.
【43】 X. Ai, H. S. Cheng, “The effects of surface texture on EHL point contact (1996),” Journal of Tribology, Vol. 118, pp. 59~66.
【44】 A. Papoulis, “Probability, random variables, and stochastic process (1991),” McGraw-Hill Book Co., Singapore.

電子全文 Fulltext
本電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。
論文使用權限 Thesis access permission:校內立即公開,校外一年後公開 off campus withheld
開放時間 Available:
校內 Campus: 已公開 available
校外 Off-campus: 已公開 available


紙本論文 Printed copies
紙本論文的公開資訊在102學年度以後相對較為完整。如果需要查詢101學年度以前的紙本論文公開資訊,請聯繫圖資處紙本論文服務櫃台。如有不便之處敬請見諒。
開放時間 available 已公開 available

QR Code