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博碩士論文 etd-0705104-150717 詳細資訊
Title page for etd-0705104-150717
論文名稱
Title
多層基板電感與電容元件模型資料庫之建立
Establishment of Model Library for Inductors and Capacitors in Multilayer Substrate Structure
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
87
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2004-06-28
繳交日期
Date of Submission
2004-07-05
關鍵字
Keywords
多層基板、電磁場模擬、元件模型化資料庫
Device Modeling Library, Electrical Magnetic Simulation, Multilayer Substrate Structure
統計
Statistics
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中文摘要
本論文在前半部提出一個建立被動元件資料庫的標準流程,即先針對元件在所應用範圍內的電氣特性需求並將其等效電路模型化,再經由電磁模擬設計輔以量測驗證,最後建立出模擬與量測符合一致性的元件資料庫。另外在所建立的完整自動化模型參數萃取程式中,除了可迅速將元件量測或模擬的散射參數以等效電路 模型呈現出來外,更包括了諧振頻率、品質因子與模型化誤差的計算。
最後更以此流程,全面建構一符合現今模組設計趨勢的LTCC製程之電感與電容元件資料庫,並更提出在多層基板模組實現中內埋式電感與電容元件的最佳電氣特性表現之重要設計方法。
Abstract
In this thesis, a standard flow path is proposed to establish the model library for inductors and capacitors in multilayer substrate structure. By the way of excellent agreement between simulation and measurement within self resonant frequency (SRF), we aimed at the demanded performance of passives in modules and adopted Pi-section equivalent circuits as basic model. Meanwhile, an automatic program on CAD-based platform is used for extraction of Pi-model circuit elements and calculation of SRF, quality (Q)factor and modeling errors.
In the end, we contributed the methodology to have the best performance of embedded passives design in multilayer substrate structure and established a completed model library for inductors and capacitors embedded in low temperature co-fired ceramic(LTCC)substrate for the design need in implementation of RF modules.
目次 Table of Contents
目錄
圖表目錄
第一章 緒論
第二章 多層基板結構中電感與電容元件之電磁模擬與晶圓級量測
2.1 簡介
2.2 準靜態電磁模擬軟體Spicelink的應用
2.2.1 電感、電容、與電阻矩陣的定義
參考文獻 References
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[8] D. Heo, A. Sutono, E. Chen, Y. Suh, and J. Laskar, “A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives,” IEEE Microwave and Wireless Components Lett., vol. 11, pp. 249-251, June 2001.
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[12] Ansoft HFSS Engineering Note, Ansoft Corporation, 2002.
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[18] K.-H. Drue, H. Thust, and J. Muller, “RF models of passive LTCCcomponents in the lower gigahertz-range,” Applied Microwave & Wireless, pp. 26-35, April 1998.
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[23] 楊立群,低溫共燒陶瓷嵌入式電感與電容元件之設計與模型化,國立中山大學電機工程研究所碩士論文,2002。
[24] 李勝豐,在含內埋式電感與電容元件之LTCC多層基板上實現2.4 GHz雙點電壓控制振盪器,國立中山大學電機工程研究所碩士論文,2003。
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[28] A. Sutono, A. Pham, J. Laskar, and W.R. Smith, “Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications,” in IEEE RFIC Symp. Dig., 1999, pp.175-178.
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