HBS 900 型為一混合物理氣相沉積與電子迴旋共振化學氣相沉積兩種方式的系統，用來在微鑽針上鍍上類鑽膜，此微鑽針具有較低的摩擦係數，有助於在電路板上鑽孔。此外，為了改善附著性的問題，首先我們會在鑽針表面鍍上Ti/TiN/TiCN 的多層膜來提高類鑽膜的附著性。硬質層如氮化鈦( TiN )與碳氮化鈦( TiCN )採用陰極電弧沉積法，以及濺鍍法等物理氣相沉積來完成，隨後我們在同一個腔體以電子迴旋共振輔助化學氣相沉積法，將類鑽膜鍍在上面。類鑽薄膜特性分析藉由拉曼光譜儀，以及刮痕測試與pin-on-disk 測試來完成。經過鍍膜後的微鑽針其特性如下：絕佳的附著性( 臨界荷重65N )、摩擦係數小於0.15。在鑽孔後，我們可以透過表面粗糙度與釘擊測試來知道鑽孔品質。經鍍膜後的的微鑽針其壽命可以增加2.5 倍

A hybrid physical vapor deposition- electron cyclotron resonance-chemical vapor deposition (PVD-ECRCVD) coating system HBS900 is used to deposit the diamond-like carbon (DLC) film on the microdrills. It could keep friction low
results in improving the productivity of the drill holes on the printed circuit board (PCB). In order to improve the adhesion strength of the DLC films,functionally gradient Ti/TiN/TiCN supporting multilayer were pre-deposited
initially on the microdrills. The hard coatings of titanium nitride (TiN) and titanium carbonitride (TiCN) as multilayer are deposited by PVD with high rate coating sources based on the principle of electrical arc vaporization and magnetron sputtering process. The on it following dry lubricant coating is composed of amorphous, diamond like carbon (DLC) deposited by ECRCVD plasma in the same recipient. The structural characteristics of DLC films were investigated by Raman spectroscopy and standard scratch and pin-on-disk test.The properties of DLC films coating on the microdrills are obtained and summarized as follows: excellent adhesion 65N, and coefficients of friction less than 0.15. After micro-hole drilling, we obtained the high quality drilled hole from the inspection of roughness and nailheading. As a result of adapting a
microdrill coated with DLC film, the drilling lifetime was significantly improved
to reach about 2.5 times than that of the uncoated one.

授權書
中文審定書
英文審定書
誌謝..................................................... I
中文摘要................................................ II
英文摘要............................................... III
目錄....................................................IV
表目錄..................................................VII
圖目錄.................................................VIII
第一章序論............................................... 1
1-1 前言................................................. 1
1-2 研究動機............................................. 2
1- 3 論文架構.............................................2
第二章理論基礎............................................3
2-1 類鑽碳膜..............................................3
2 - 1 - 1 類鑽碳膜之結構. . . . . . ..................... 5
2 - 1 - 2 類鑽碳膜之成長機制............................. 7
2-1-3 類鑽碳鍍層之限制及其改善方法........................10
2-2 微波電子迴旋共振化學氣相沈積法........................11
2-2-1 電漿理論................................ ...........12
2 - 2 - 2 微波電子迴旋共振之原理. . . . . . . . . . .. . .13
2-3 拉曼光譜儀...........................................14
第三章微鑽針.............................................16
3-1 鑽針簡介.............................................16
3-2 鑽針磨耗.............................................17
3-3 鑽孔品質之界定.......................................18
3-4 印刷電路板...........................................19
第四章實驗方法與步驟.....................................22
4-1 系統介紹.............................................22
4-1-1 真空系統...........................................23
4-1-2 真空度量測.........................................23
4-1-3 基材holder.........................................23
4-1-4 加熱與溫度控制.....................................23
4-1-5 氣體...............................................23
4-1-6 陰極電弧蒸鍍系統...................................24
4-1-7 ECR 系統...........................................24
4-1-8 Sputter 系統.......................................24
4-2 測試設備.............................................24
4-2-1 拉曼測試...........................................24
4-2-2 鑽孔測試...........................................25
4-2-3 附著性試驗.........................................25
4-3 實驗流程.............................................26
第五章實驗結果與討論.... ................................27
5-1 拉曼光譜分析.........................................27
5-2 鍍膜附著性的改善.....................................31
5-3 鑽孔測試.............................................32
第六章結論...............................................34
參考文獻.................................................77
Table 2-1 ECR電漿與RF電漿之比較..........................35
Table 4-1 各真空pumb 規格表..............................35
Table 4-2 各種通入氣體種類與流量.........................36
Table 4-3 Parameter recommendation for microdrill for FR4 printed circuit board....................................36
Table 4-4 Process regime for the production the DLC layer in the hybrid system HBS 900.Procedure steps and process data.....................................................37
Table 5-1 The G-peak position and ID/IG of Raman spectra at a differentbias..........................................38
Table 5-2 Summary of inspection for the adhesion and friction properties of the DLC and Ti/TiN/TiCN/DLC multilayers..............................................38
Table 5-3 Results of the dry drilling test of FR4 as a function of the coating type of microdrill...............39
Fig 2-1 鑽石結晶型態.....................................40
Fig 2-2 石墨結晶型態.....................................40
Fig 2-3 晶質含氫類鑽碳膜的三元相圖.......................41
Fig2-4 晶質含氫類鑽碳膜之結構示意圖......................42
Fig 2-5 電漿中反應成介穩態物質的活化能示意圖.............43
Fig 2-6 結晶碳的自由能對體積示意圖.......................44
Fig 2-7 碳離子進入非晶質類鑽碳膜的表面穿透機制示意圖(a)直接穿透(b)Knock-on 穿透.....................................45
Fig 2-8 非晶質成長示意圖(a)入射離子能量小( 0-0.1eV ) (b)適當的入射離子能量( 1-100eV ) (c)入射離子能量過大( >100eV )..46
Fig 2-9 電子(Te)與氣體(Tg)溫度與壓力的關係...............47
Fig 2-10 微波電子迴旋共振化學氣相沉積系統................48
Fig 2-11 電子在磁場中運動的示意圖(a) 電場= 0， (b).......49
Fig 2-12 (a)右旋偏振。(b)左旋偏振........................50
Fig 2-13 拉曼散射與雷利散射..............................50
Fig 3-1 微鑽針幾何外型...................................51
Fig 3-2 鑽針磨耗型態(1)刀腹磨耗(2)刀角磨耗(3)鑿刃磨耗(4)凹
陷磨耗(5)外緣磨耗........................................52
Fig. 3-3 Nail heading and surface roughness of hole quality..................................................53
Fig 3-4 Flow chart of image processing method............54
Fig 3-5 Definintion of edge position angle and fibre angle ............................................... ...55
Fig 3-6 the edge position angle and the surface roughness................................................56
Fig 3-7 The number of drilled holes and the surface roughness................................................57
Fig 3-8 The number of drilled holes VS the drilled hole radius and the damaged radius............................58
Fig 4-1 HBS 900 外觀.....................................59
Fig 4-2 HBS 900 hybrid 結構圖............................60
Fig 4-3 PCB 立式三軸工具機..............................61
Fig 4-4 FR4 雙面板的構造組合圖..........................62
Fig 4-5 鑽削配置及鑽削力量測流程圖......................62
Fig 4-6 鑽削路徑及鑽削位置配置圖........................63
Fig 4-7 刮痕試驗機......................................64
Fig 4-8 pin-on-disk測試.................................65
Fig 4-9 Dry lubricant TiN/TiCN/DLC multilayer structure..66
Fig 5-1 Illustrates the fitting of two decomposed Gaussian
distributions, their summations, and the measured Raman
spectra of deposited DLC films...........................67
Fig 5-2 (a) g E2 mode (b) u E1 mode......................68
Fig 5-3 g A1 mode........................................68
Fig 5-4 所有碳質結構的薄膜區依照G peak 波函數大小與I(D)/I(G)比例區分成的三種狀態.....................................69
Fig 5-5 G D I I / 的比與類鑽膜中石墨群的大小.............70
Fig 5-6 Raman spectra of DLC films at different DC bias values...................................................71
Fig 5-7 基板偏壓對G band及G D I I / 之影響...............72Fig 5-8 Result of frictional force versus load during the scrach test........................73
Fig 5-9 Tribological behavior of diamond-like carbon during
Sliding...................................................74
Fig 5-10 Tools life of non-coated, TiN, DLC in drilling of FR4 printed circuit board contact...................................................75
Fig 5-11 schematic illustration of a possible mechanism on the role of the low-fraction coating during a machining
application...............................................76

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