本論文係研究利用封裝結構設計及封裝膠材搭配來達到改善發
光二極體（LED）封裝之取光效率。LED 受限於Fresnel Loss 以及內
部全反射等因素，造成真正能從LED 取出的光極少。本文探討封裝
結構對取光效率的影響，利用多層結構的搭配別於習知的單一結構，
因此封裝後可提高出光效率與提升亮度。

LED 封裝幾何結構外型與膠層的內部結構，係探討內部全反射
的影響，而膠材種類搭配的部分是從Fresnel Loss 的觀點來研究。由
實驗量測結果可知，選用內層折射率較高的封裝膠材(1.55)，搭配外
層折射率較低的封裝膠材(1.41)，且封裝膠體幾何形狀為凸面破壞全
反射的情況下，可達到70%的封裝取光效率。由於藍光晶片加上黃色
螢光粉會產生白光，未來將此結果應用在螢光粉轉換白光發光二極體
(Phosphor Conversion Light Emitting Diode ;PC-LED)，將可得到高效率之白光。

In this thesis, we focus on the light extraction efficiency of LED package. The light extraction efficiency of LED is limited by Fresnel Loss and total internal reflection, which result in the rare amount of luminious flux from LED. In order to improve the light extraction efficiency of high power LED package, we study the design of package structure and the matching refractive index of silicone resins. Instead of using one-layer structure, we use multi-layer structure which can raise the light extraction efficiency and the brightness. In order to destroy the total internal reflection, we change the geometric appearance and the interior structure and furthermore we use the different refractive index of silicone resins to decrease Fresnel Loss.

In this work, we use the multi-layer structure whose the refractive indexes of the inner silicone resin and the outer silicone resin are 1.55 and 1.41 respectively. When the geometric appearance is convex, the light extraction efficiency of LED package can reach to 70%. Furthermore, by
applying this result on phosphor conversion light emitting diode, we can get high efficiency of white light.

中文摘要 …………………………………………………………i
英文摘要 …………………………………………………………ii
誌謝………………………………………………………………iii
目錄 ………………………………………………………………iv
圖表索引 …………………………………………………………vi
第一章 導論……………………………………………………… 1
1.1 研究動機 ……………………………………………………1
1.2 論文架構 ……………………………………………………2
第二章 LED 概述 ……………………………………………… 3
2.1 LED 發光原理 ……………………………………………3
2.2 LED 之特點 ………………………………………………… 6
2.3 LED 之應用……………………………………………………9
2.4 發光效率的提升………………………………………………17
2.4.1 晶粒外型的改變－TIP 結構………………………………17
2.4.2 表面粗化(surface roughness)技術 ……………………20
2.4.3 晶片黏貼技術(wafer bonding) …………………………21
2.4.4 覆晶封裝技術(Flip chip) ………………………………22
第三章 實驗架構 …………………………………………………24
3.1 理論分析………………………………………………………24
3.2 實驗展開………………………………………………………32
3.3 實驗流程………………………………………………………37
3.4 量測架構………………………………………………………41
第四章 量測結果討 ………………………………………………45
4.1 全反射之影響…………………………………………………45
4.2 Fresnell Loss 之影響………………………………………47
4.3 Flip Chip 與Face Up 之比較………………………………54
4.4 實驗結果 …………………………………………………… 55
第五章 結論 ………………………………………………………56
5.1 結論……………………………………………………………56
參考文獻 ……………………………………………………………I

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