在所有的通訊濾波器中因表面聲波濾波器(SAW Filter)具有體積小，可靠度高，可被大量製造等優點，所以被大量使用於行動電話的射頻及中頻濾波器。但隨著操作頻率的提高及封裝盒的縮小化，表面聲波濾波器對封裝及濾波器基板上的金屬線(SAW Pattern)所產生的電磁干擾效應也越來越敏感，導致封裝後所產生的特性與未考慮封裝效應的設計值有很大的出入。

在本篇論文中，我們利用全波模擬軟體HFSS (High Frequency Structure Simulator)結合電路軟體的方法，以全波方式去模擬SAW Filter封裝及SAW Pattern所產生的效應。我們將此法實際運用於幾個例子上並將模擬解果和量測比較，其結果顯示我們的方法能有效地預測封裝後的頻率響應。我們並將此法用來探討封裝盒內結構變化，如打線長度改變，所產生的效應。希望藉由初期的預測達到節省SAW Filter的設計時間與成本。

Among communication filters, SAW Filters have been largely used in RF and IF filters of mobile phone because of their small size, high reliability, and the capability to be mass produced. But with increasing of working frequency and miniaturization of SAW package, SAW filters are more sensitive to interference introduced by the package and SAW Pattern. Discrepancy in performance between design and measurement can be large if the packaging effects are not considered.

In this thesis, we use the full wave analysis approach that combining full wave simulator HFSS (High Frequency Structure Simulator) with circuit software to simulate the package effects and the electromagnetic effects of SAW pattern. Our approach has been applied to several cases and measurements are also carried out to verify our results. Good agreements are obtained. We also use this method to discuss the electromagnetic effects inside package, such as the change of the bond wire length. With an accurate prediction, we can save factory design time and production cost.

誌謝 i
中文摘要 iii
英文摘要 iv
目錄 v
圖表目錄 vi
第一章 諸論 1
1.1表面聲波濾波器 1
1.2研究目的 2
第二章 表面聲波濾波器簡介 3
2.1表面聲波元件原理 3
2.2表面聲波濾波器的種類 3
2.3表面聲波濾波器的封裝種類 9
第三章 晶片到基板的導通特性分析 13
3.1晶片到基板的連接:打線 15
3.2晶片到基板的連接:覆晶 22
第四章 表面聲波濾波器封裝效應的探討 27
4.1分析方法混合法說明 29
4.2混合法的驗證 36
4.3混合法的應用: SMD Bond Wire Package 41
4.4混合法的應用: SMD Flip Chip Package 46
4.5混合法的應用: SAW filter on PCB效應探討 59
4.6總結 65
第五章 結論 66
參考文獻 67

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