本論文係光纖通訊40Gb/s光收發模組的研製與量測，藉由四個傳輸速率為10Gb/s的光收發模組來擴充通訊系統頻寬至40Gb/s。光收發模組包含光發射模組與光接收模組兩部分，光發射模組由驅動IC及其外部被動元件構成，驅動雷射輸出光訊號；而光接收模組由限幅放大器與檢光器所組成。在電路版佈局，適當地運用終端阻抗匹配設計和微帶線特性阻抗計算，封裝則必須考慮被動元件與印刷電路板訊號連接之介面所產生可能的寄生效應。避免阻抗不連續、電源雜訊、串音現象等問題，使訊號產生失真劣化。
光收發模組量測結果，在訊號為231-1且傳輸速率為10Gb/s操作下，多通道光發射模組目前最佳通道之峰值抖動(jitter pp)為23ps、明滅比(extinction ratio, ER)為3.75dB以及峰值電壓(Vpp)為486mV，且符合SONET制定之OC-192規範，眼圖餘裕可達10%；多通道光接收模組最佳通道之峰值抖動為17ps與Q值為12.7，符合OC-192規範且眼圖遮罩(mask margin)餘裕可達35%。而在誤碼率為10-9條件下，接收端靈敏度為-15.5dBm。

The fabrication and measurement of a 40Gbps optical transceiver module used in optical-fiber communication is investigated. The module extends data rate by using four optical transceiver modules, with 10Gbps for each throughput. The optical transceiver module consists of transmitter and receiver. The transmitter is composed by laser driver IC and 1315nm DFB laser. The receiver is composed by limiting amplifier and 1310nm ROSA (Receiver Optical Sub-Assembly).
An optical transceiver module is operated at signal pattern of 231-1 and data rate of 10Gbps. For optimum transmitter measurement, the peak-peak Jitter, ER, and Vpp, are 23ps, 3.75dB ,and 486mV, respectively. The result of eye diagram measurement can meet the mask of OC-192 standard, with eye mask margin of 10%. For optimum receiver measurement, peak-to-peak jitter and Q-factor are 17ps and 12.7 . The result of eye diagram measurement can pass the mask test and reach 35%. In the condition of bit error rate of 10-9, the sensitivity of receiver is -15.5dBm.The developed transceiver module can be used in the WDM (Wavelength Division Multiplexing) applications.

中文摘要 I
英文摘要 II
誌謝 III
目錄 IV
圖表目錄 VII
第一章 序論
1.1 研究動機
1.2 光收發模組之簡介
1.3 論文架構
第二章 雷射封裝與檢光器之特性分析
2.1 概要
2.2 雷射特性分析
2.2.1 高速雷射調變原理
2.2.2 雷射小訊號分析
2.3 高速雷射模組的選擇
2.4 檢光二極體與轉阻放大器之特性分析
2.5 光檢測器模組的選擇
第三章 高速雷射封裝技術
3.1 雷射封裝之介紹
3.2 雷射封裝製程介紹
3.3 晶粒粘著機操作及封裝流程
3.4 打線機機操作及封裝流程
3.5 雷射封裝特性
第四章 40Gb/s多通道光收發模組之設計
4.1 光收發器之高頻與低頻截止頻率定義
4.2雷射驅動電路功能分析
4.3 雷射驅動電路與雷射之介面考量
4.3.1 直流耦合
4.3.2 交流耦合
4.4光接收模組設計考量
4.5高速電路之印刷電路板佈局設計與分析
4.5.1 印刷電路基板之設計技術
4.5.2 傳輸線設計
4.5.3 集總元件之特性分析
4.5.4電磁雜訊干擾對策與佈局考量
4.5.5 多通道光收發模組佈局與實體圖
第五章 模組量測結果與結論
5.1雷射特性量測
5.1.1雷射(L-I curve)量測
5.1.2 雷射光頻譜量測
5.2光發射模組與光接收模組量測
5.2.1光發射模組量測
5.2.2光接收模組量測
5.2.3光接收模組之串音量測
5.2.4光收發模組誤碼率量測
5.3 結論與未來工作
5.3.1結論
5.3.2未來工作

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