Title page for etd-0708103-113405


[Back to Results | New Search]

URN etd-0708103-113405
Author Pei-Lung Li
Author's Email Address m9031649@student.nsysu.edu.tw
Statistics This thesis had been viewed 4820 times. Download 5279 times.
Department Electrical Engineering
Year 2002
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Measurement and Analysis of the EMI of the Differential Pairs on High-Speed PCB
Date of Defense 2003-07-02
Page Count 85
Keyword
  • differential pair
  • Abstract Differential pairs may gradually replace single trace as the media transmitting high-speed signal on high-speed digital circuit. This dissertation investigates the impact on electromagnetic radiation from high-speed circuit board by the distance between differential traces and edge effect .At the same time, we use the result of measurement and simulation to make sure the measurement method correct .The result shows that,the shorter the distance is,the lower the EMI of differential pairs have .The edge effect will has the ability of destroying the suppression of EMI.
       Based on the consideration of measuring correctly, we use a solid kind of measurement method to search some non-ideal effects before studying EMI from differential pairs .These effect may exist on real measurement or ideal simulation. We hope to understand the environment of measurement as clearly as possible.
       In addition, we address one simple and fast method to investigate radiation mechanism that resulted from edge effect of differential pairs.By this method to calculate radiation, we will understand more and more the radiation mechanism. 
    Advisory Committee
  • Tzyy-Sheng Horng - chair
  • Sheng-Fu Chang - co-chair
  • Ken-Huang Lin - co-chair
  • Chih-Wen Kuo - co-chair
  • Tzong-Lin Wu - advisor
  • Files
  • etd-0708103-113405.pdf
  • indicate access worldwide
    Date of Submission 2003-07-08

    [Back to Results | New Search]


    Browse | Search All Available ETDs

    If you have more questions or technical problems, please contact eThesys