錫球接點在迴焊後的幾何外形在今許多相關的發展與應用中漸漸的受到重視。藉由能量法與解析法的應用，不同錫球接點模型的建立被廣泛的應用在錫球接點的外型設計上，然而最重要的是找出一套較為合適的方法以導入實際應用。
本文中，目的在於設定一系列的實驗以得到不同幾何參數設定下的錫球型外型，並配合Surface Evolver數值模擬軟體計算得到的模型做比較，而不同的幾何參數設定，如錫球接點的體積，上方承受的荷重，錫球熔融時的表面張力，及重力等對於錫球接點的外型造成的影響也一併討論。
針對SAC405錫球共設計兩組實驗，一組為觀察不同體積的錫球接點經過一次迴焊的外型變化，另一組則模擬相同體積的錫球在承受封裝體重量下經過二次迴焊後外型變化。實驗結果顯示，採用Surface Evolver數值模擬軟體在經過修正後的條件設定下所建立的錫球接點模型與實際實驗所得到的錫球接點外型相當接近，差異值約在-3%~6.5%，可謂已經達到可接受的差異值範圍之內。
本研究也將利用Surface Evolver數值模擬軟體所建立的錫球接點模型導入ANSYS數值模擬軟體中，進行溫度循環疲勞壽命分析，藉以比較不同荷重下所預測得到的錫球接點模型對於封裝體可靠度的影響，結果說明了細長的錫球外型擁有較佳的溫度疲勞壽命。

The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joints has drawn special attention to the related development and engineering applications. Numerous solder joint models, based on energy minimization principle and analytical methods, have been proposed and developed. The methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method to real applications. Herein, a series of experiments with different geometric parameters of SAC405 solder joints were carried out and the results were compared with the prediction by Surface Evolver Program. The changes of geometric shape with respect to different parameters of solder joint were also discussed. The influence of the geometric parameters, such as volume of solder joint, package weight, solder surface tension, and gravity force to the shape of solder joint were investigated.
Two experiments with SAC405 solder balls were carried out. One is to observe the different reflowed geometry shape of solder balls with various volumes, and another is to observe the different reflowed geometry shape of solder balls with various loadings on them. The results show that the models made by Surface Evolver program are very similar to the real shapes observed by experiments, and the differences are between -3% ~ 6.5%. Thus, the results show that the predicted shapes are satisfactorily suitable.
Finally, the predicted models by Surface Evolver program were also put into the ANSYS program, and preceded the fatigue life prediction due to thermal cycling tests. The comparison of the effect on fatigue life with respect to different geometry shapes is illustrated. The results show the shape of solder ball due to high loadings is better than that in thermal cycling tests.

目錄 I
表目錄 IV
圖目錄 V
摘要 VIII
英文摘要 IX
第一章 緒論 1
1-1 前言 1
1-2 封裝簡介 3
1-2-1 BGA簡介 5
1-2-2 Ultra CSP與WLCSP簡介 6
1-3 研究方向 7
1-4 文獻回顧 8
1-5 組織與章節 10
第二章 實驗工作 13
2-1實驗規劃 13
2-2 試片介紹 14
2-3 機台介紹 15
2-4 實驗流程 16
2-5 數據結果分析 18
第三章 Surface Evolver 數值模擬 30
3-1 Surface Evolver 30
3-1-1 最小能量法則 31
3-2 Model建立 33
3-3 模擬條件設定 34
3-4 數值模擬結果分析 34
第四章 實驗結果與數值模擬比較 43
4-1 實驗結果與數值模擬結果 43
4-2 數值模擬與實驗的條件設定比較與分析 44
第五章 數值分析 53
5-1 線性與非線性理論分析 53
5-2 線性分析理論 54
5-3 非線性分析理論 55
5-3-1 隨動硬化塑性和等向硬化塑性 56
5-3-2 潛變 56
5-4 數值模擬基本假設 57
5-5 溫度循環疲勞測試 57
5-6 建立模型與尺寸設定 59
5-7 結果與分析 59
第六章 結論 70
參考文獻 72

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