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論文名稱 Title |
咪唑衍生物摻雜於導電銀膠藉以降低其銀固含量之研究 Reduced content of silver in conductive adhesives incorporating N-alkylimidazole derivatives as additives |
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系所名稱 Department |
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畢業學年期 Year, semester |
語文別 Language |
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學位類別 Degree |
頁數 Number of pages |
85 |
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研究生 Author |
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指導教授 Advisor |
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召集委員 Convenor |
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口試委員 Advisory Committee |
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口試日期 Date of Exam |
2014-07-21 |
繳交日期 Date of Submission |
2014-08-08 |
關鍵字 Keywords |
微米銀、乙基纖維素、降低銀固含量、咪唑衍生物 micro-sized silver, ethyl cellulose, reduction of silver, N-alkylimidazole derivative |
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統計 Statistics |
本論文已被瀏覽 5717 次,被下載 492 次 The thesis/dissertation has been browsed 5717 times, has been downloaded 492 times. |
中文摘要 |
本研究中,我們合成出一系列的咪唑衍生物來降低導電銀膠之銀固含量至從90~80wt%降至70wt%以下,使用在乙基纖維素體系來製成的導電膠並維持其體電阻值。我們利用檸檬酸三丁酯(Tributyl Citrate, TBC)、三油酸山梨酯(Sorbitan Tribleate, span-85)與乙基纖維素(Ethyl Cellulose)混合物來做為基體,松油醇(Terpilenol)為溶劑,調配出22,25,27,30wt% 基體比例對應整體銀膠。導電體選用粒徑約分佈在10μm大小之片狀銀粉作為導電粒子,當銀固含量比例在50, 58, 64及70wt%對應整體銀膠時,咪唑衍生物的添加量在5, 9, 17, 28wt%對應整體銀膠,與高分子載體、銀粉混合並製作一烤乾後的導電薄膜,量測其體電阻率發現在最低銀固含量58wt%也能維持在10–5 Ω‧cm內。此外,相較於市售銀膠,在燒結溫度於170℃一小時內,添加的銀固含量在67wt%,加入添加劑1-甲基咪唑(1-methylimidazole ,代號C1Im) 與1-六烷基咪唑(1-hexylimidazole,代號C6Im)含量5wt%,分別能提升67.6%及52.5%的導電度,即減少15-17%的銀固含量,也能維持體電阻率在10–5 Ω‧cm內。同時利用掃描式電子顯微鏡來分析其導電度增加機制,當C6Im添加劑添加於銀膠時,可以增加銀粒子表面接觸面積,使更多鄰近微小銀粒子彼此接觸,藉以形成良好導電通路。 |
Abstract |
In this study, we synthesized a series of N-alkylimidazole derivatives that we used to decrease the silver (Ag) metal percentage in silver pastes while maintaining the volume resistivity of a silver conductive paste with cellulose-base containing 58-70% Ag metal. We formulated the organic vehicle by blending ethyl cellulose, sorbitan trioleate, tributyl citrate, and terpilenol (as solvent) in abundances of 22, 25, 27, and 30 wt. %, respectively, relative to the silver paste. The organic vehicle and the additive material, an N-alkylimidazole (CnIm), were mixed to form a homogeneous electrically conductive paste. Piece shaped silver having a median particle diameter of 10 μm were added at 50, 58, 64, or 70 wt. % relative to the silver paste; the optimal additive material, C6Im, was added at 5, 9, 17, or 28 wt. % relative to the paste. We developed a homogeneous thick film of the electrically conductive silver paste; the sintered homogeneous paste had a volume electrical resistivity of 10–5 Ω‧cm at a Ag content of just 58 wt. %. Besides, comparison to a commercial Ag paste, C1Im and C6Im can enhance the conductivity of 67.6%, 52.5%, respective. Piece shaped silver were added at 67wt.% relative to Ag paste; C1Im and C6Im both were added at 5wt.% relative to Ag paste under sintering temperature at 170℃ for 1 hour. Sintered pastes not only maintained volume electrical resistivity of 10–5 Ω-cm but reduced the content of silver approximately within 15-17%. When C6Im was the additive, scanning electron microscopy revealed that a small quantity of fine Ag particles had a large surface area, bringing more of the particles into contact so that they fused together to form an electrically conductive network. |
目次 Table of Contents |
中文審定書 I 致謝 II 中文摘要 III Abstract IV 目錄 V 圖目錄 VIII 表目錄 XI 第一章 緒論 1 1-1 導電銀膠介紹 1 1-2 市場分析 2 第二章 研究背景 5 2-1 導電銀膠之發展概況 5 2-1-1 市售導電銀膠之銀固含量分析 6 2-2 導電填充物 7 2-3 影響導電度的因素 8 2-4 高分子基體(Matrix)之選擇 11 2-4-1 樹脂體系 11 2-4-2 纖維素體系 12 2-4-3 兩者基體之優點相比較 13 2-5 乙基纖維素在溶劑內之流變性質 14 2-6 咪唑衍生物 15 2-7 導電銀膠的導電機構 17 第三章 實驗製程 19 3-1 實驗材料 19 3-1-1 基體 19 3-1-2 溶劑 19 3-1-3 增塑劑 19 3-1-4 分散劑 20 3-1-5 銀粉 20 3-1-6一系列咪唑衍生物 21 3-2 實驗儀器介紹 22 3-2-1 高磁場液態磁核共振儀器 (Nuclear Magnetic Resonance, NMR) 22 3-2-2 熱重分析儀 (Thermogravimetric analyzer, TGA) 22 3-2-3 熱示差掃描卡量計 (Differential scanning calorimetry, DSC) 23 3-2-4 傅立葉紅外線光譜(Fourier Transform Infrared Spectrometer, FTIR) 24 3-2-5 場發射型掃描式電子顯微鏡 (Field Emission Gun Scanning Electron Microscopy, FEG-SEM)/環境掃描式電子顯微鏡 (ESEM)/能量分散光譜儀 (Energy Dispersive Spectrometer, EDS) 25 3-2-6 表面輪廓儀 (Surface Profiler, Alpha-Step) 26 3-2-7 四點探針(Four Point Probe) 27 3-2-8 黏度計(Viscometer) 28 3-2-9 真空烘箱設備(Vacuum Oven) 29 3-2-10 行星式球磨機(Planetary Ball Mill) 30 第四章 結果與討論 31 4-1實驗流程 31 4-1-1 銀固含量比例優化實驗 33 4-1-2 添加劑加入導電銀膠之電阻 34 4-1-3 分散劑、增塑劑、銀粉擇用之優化 36 4-1-4 溫度區間之調控 43 4-2 添加劑之合成 45 4-3 添加劑與銀膠之優化 46 4-3-1 DSC之熱分析 47 4-3-2 TGA之熱分析 49 4-3-3 黏度分析 51 4-3-4 導電度比較 53 4-3-5 FTIR之光譜分析 54 4-3-6 SEM之樣貌分析與導電膠內的導電滲透理論 56 第五章 結論 60 |
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