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博碩士論文 etd-0708114-174600 詳細資訊
Title page for etd-0708114-174600
論文名稱
Title
咪唑衍生物摻雜於導電銀膠藉以降低其銀固含量之研究
Reduced content of silver in conductive adhesives incorporating N-alkylimidazole derivatives as additives
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
85
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2014-07-21
繳交日期
Date of Submission
2014-08-08
關鍵字
Keywords
微米銀、乙基纖維素、降低銀固含量、咪唑衍生物
micro-sized silver, ethyl cellulose, reduction of silver, N-alkylimidazole derivative
統計
Statistics
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The thesis/dissertation has been browsed 5717 times, has been downloaded 492 times.
中文摘要
本研究中,我們合成出一系列的咪唑衍生物來降低導電銀膠之銀固含量至從90~80wt%降至70wt%以下,使用在乙基纖維素體系來製成的導電膠並維持其體電阻值。我們利用檸檬酸三丁酯(Tributyl Citrate, TBC)、三油酸山梨酯(Sorbitan Tribleate, span-85)與乙基纖維素(Ethyl Cellulose)混合物來做為基體,松油醇(Terpilenol)為溶劑,調配出22,25,27,30wt% 基體比例對應整體銀膠。導電體選用粒徑約分佈在10μm大小之片狀銀粉作為導電粒子,當銀固含量比例在50, 58, 64及70wt%對應整體銀膠時,咪唑衍生物的添加量在5, 9, 17, 28wt%對應整體銀膠,與高分子載體、銀粉混合並製作一烤乾後的導電薄膜,量測其體電阻率發現在最低銀固含量58wt%也能維持在10–5 Ω‧cm內。此外,相較於市售銀膠,在燒結溫度於170℃一小時內,添加的銀固含量在67wt%,加入添加劑1-甲基咪唑(1-methylimidazole ,代號C1Im) 與1-六烷基咪唑(1-hexylimidazole,代號C6Im)含量5wt%,分別能提升67.6%及52.5%的導電度,即減少15-17%的銀固含量,也能維持體電阻率在10–5 Ω‧cm內。同時利用掃描式電子顯微鏡來分析其導電度增加機制,當C6Im添加劑添加於銀膠時,可以增加銀粒子表面接觸面積,使更多鄰近微小銀粒子彼此接觸,藉以形成良好導電通路。
Abstract
In this study, we synthesized a series of N-alkylimidazole derivatives that we used to decrease the silver (Ag) metal percentage in silver pastes while maintaining the volume resistivity of a silver conductive paste with cellulose-base containing 58-70% Ag metal. We formulated the organic vehicle by blending ethyl cellulose, sorbitan trioleate, tributyl citrate, and terpilenol (as solvent) in abundances of 22, 25, 27, and 30 wt. %, respectively, relative to the silver paste. The organic vehicle and the additive material, an N-alkylimidazole (CnIm), were mixed to form a homogeneous electrically conductive paste. Piece shaped silver having a median particle diameter of 10 μm were added at 50, 58, 64, or 70 wt. % relative to the silver paste; the optimal additive material, C6Im, was added at 5, 9, 17, or 28 wt. % relative to the paste. We developed a homogeneous thick film of the electrically conductive silver paste; the sintered homogeneous paste had a volume electrical resistivity of 10–5 Ω‧cm at a Ag content of just 58 wt. %. Besides, comparison to a commercial Ag paste, C1Im and C6Im can enhance the conductivity of 67.6%, 52.5%, respective. Piece shaped silver were added at 67wt.% relative to Ag paste; C1Im and C6Im both were added at 5wt.% relative to Ag paste under sintering temperature at 170℃ for 1 hour. Sintered pastes not only maintained volume electrical resistivity of 10–5 Ω-cm but reduced the content of silver approximately within 15-17%. When C6Im was the additive, scanning electron microscopy revealed that a small quantity of fine Ag particles had a large surface area, bringing more of the particles into contact so that they fused together to form an electrically conductive network.
目次 Table of Contents
中文審定書 I
致謝 II
中文摘要 III
Abstract IV
目錄 V
圖目錄 VIII
表目錄 XI
第一章 緒論 1
1-1 導電銀膠介紹 1
1-2 市場分析 2
第二章 研究背景 5
2-1 導電銀膠之發展概況 5
2-1-1 市售導電銀膠之銀固含量分析 6
2-2 導電填充物 7
2-3 影響導電度的因素 8
2-4 高分子基體(Matrix)之選擇 11
2-4-1 樹脂體系 11
2-4-2 纖維素體系 12
2-4-3 兩者基體之優點相比較 13
2-5 乙基纖維素在溶劑內之流變性質 14
2-6 咪唑衍生物 15
2-7 導電銀膠的導電機構 17
第三章 實驗製程 19
3-1 實驗材料 19
3-1-1 基體 19
3-1-2 溶劑 19
3-1-3 增塑劑 19
3-1-4 分散劑 20
3-1-5 銀粉 20
3-1-6一系列咪唑衍生物 21
3-2 實驗儀器介紹 22
3-2-1 高磁場液態磁核共振儀器 (Nuclear Magnetic Resonance, NMR) 22
3-2-2 熱重分析儀 (Thermogravimetric analyzer, TGA) 22
3-2-3 熱示差掃描卡量計 (Differential scanning calorimetry, DSC) 23
3-2-4 傅立葉紅外線光譜(Fourier Transform Infrared Spectrometer, FTIR) 24
3-2-5 場發射型掃描式電子顯微鏡 (Field Emission Gun Scanning Electron Microscopy, FEG-SEM)/環境掃描式電子顯微鏡 (ESEM)/能量分散光譜儀 (Energy Dispersive Spectrometer, EDS) 25
3-2-6 表面輪廓儀 (Surface Profiler, Alpha-Step) 26
3-2-7 四點探針(Four Point Probe) 27
3-2-8 黏度計(Viscometer) 28
3-2-9 真空烘箱設備(Vacuum Oven) 29
3-2-10 行星式球磨機(Planetary Ball Mill) 30
第四章 結果與討論 31
4-1實驗流程 31
4-1-1 銀固含量比例優化實驗 33
4-1-2 添加劑加入導電銀膠之電阻 34
4-1-3 分散劑、增塑劑、銀粉擇用之優化 36
4-1-4 溫度區間之調控 43
4-2 添加劑之合成 45
4-3 添加劑與銀膠之優化 46
4-3-1 DSC之熱分析 47
4-3-2 TGA之熱分析 49
4-3-3 黏度分析 51
4-3-4 導電度比較 53
4-3-5 FTIR之光譜分析 54
4-3-6 SEM之樣貌分析與導電膠內的導電滲透理論 56
第五章 結論 60
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