摘要

在本文中主要是採用矽基微製程技術作為微渠道的主要製程技術，在本技術中主要包含光刻微影技術、乾式蝕刻技術以及陽極接和技術，在製程結束後，我們配合AFM及表面輪廓儀量測微渠道表面，得到約3.34﹪表面粗躁度之微渠道(0.5μm×100μm×5000μm)。

在本研究中我們並配合理論數值計算，以連續方程式及滑移邊界條件來模擬氮氣(nitrogen)在微渠道內的流動情形，得到氮氣在微渠道內的初部的流場分部，其中包含壓力、速度及質量流率等。

Abstract

In this study, we use microfabrication processes on silicon to produce a rectangular microchannel. The fabrication technology includes exposing, dry etching, and anodic bounding technologies. After fabrication finished, we use AFM and alpha-step to secure surface roughness. It is found a relatively low surface roughness about 3.34％ with dimension of 0.5μm×100μm×5000μm microchannel.

A theoretical study and calculations, we also made with continuity equation and proper slip condition to analyze fluid behavior in microchannel. At present, several fluid informations in microchannel that incloud pressure drop, fluid velocity, and fluid mass flow rate were obtained.

目 錄
頁 次
目錄 i
圖目錄 iv
表目錄 vi
符號說明 vii
中文摘要 ix

第一章 緒論 1
1-1 前言 1
1-2 背景與目的 2
1-2-1 研究背景 2
1-2-2 研究目的 2
1-3 文獻回顧 2
1-4 研究範圍 4

第二章 實驗設備 6
2-1 實驗製程設備 6
2-2 實驗量測設備 8

第三章 實驗步驟 11
3-1 微渠道的構想圖 11
3-2 矽基微渠道的製程步驟 11
3-2-1 塗佈光阻 12
3-2-2 曝光 12
3-2-3 顯影 12
3-2-4 矽晶片的蝕刻 13
3-2-5 去除表面光阻 13
3-2-6 Pyrex鑽孔與矽晶片的接合 13

第四章 理論分析 23
4-1 流體性質分析 23
4-1-1 Knudsen number 23
4-1-2 微渠道的數值分析 25
4-1-3 微渠道的數值解 29
4-2 測試系統迴路設計 30
4-2-1 測試系統迴路圖 30
4-2-2 MPIV的量測 30

第五章 結果與討論 42
5-1 製程結果的探討 42
5-1-1 曝光顯影技術結果之討論 42
5-1-2 RIE矽蝕刻技術結果之討論 44
5-1-3 Pyrex 的鑽孔技術 45
5-1-4 Pyrex與矽晶片的接和 46
5-1-5 微渠道完成結果與討論 46
5-2 測試系統迴路的建立 47

第六章 結論與建議 60
6-1 結論 60
6-2 建議 60

參考文獻 62

附錄A 68
附錄B 72

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