在不斷極小化積體電路元件的趨勢下，覆晶封裝銲錫凸塊的電流密度明顯增大許多，而每個銲錫接頭承受的電流密度可能高達104 A/cm2左右，因此在共晶錫鉛銲料中由於本身的熔點低，在使用溫度時具有高擴散性，造成的電子遷移現象視為可靠度之最主要威脅。
本論文的研究目的主要在探討覆晶封裝共晶錫鉛銲錫凸塊在高電流密度作用下電子遷移效應對其可靠度的影響。本實驗是在電流密度為2×104 A/cm2、1.5×104 A/cm2，晶片表面溫度115℃、95℃的狀況下實驗，測量銲錫凸塊溫度，觀察銲錫凸塊的電阻值變化和平均失效時間，並利用電子顯微鏡及附加能量分析光譜儀觀察拍攝破壞機構。
由實驗的結果得知，在通電流實驗中失效時間較短的試片其銲錫凸塊的主要失效原因是因為電子遷移效應在UBM和銲錫凸塊接觸介面（陰極）產生孔洞而造成，而時間愈久其失效的原因除了電子遷移效應外還會伴隨著熱負載的影響。

As the trend of miniaturization of complex integrated circuit(IC) devices, the current density of flip-chip solder bumps have increased significantly and each solder joint is supporting a current density close to or even over 104 A/cm2 .Therefore, in SnPb eutectic solder, which has a high diffusivity at the operating temperature due to its low melting point, the electromigration becomes a major reliability threat.

Thus, the thesis is aimed to investigate the effects of electromigration behavior on flip-chip package eutectic Sn-Pb solder bumps reliability under high current density. The current densities are 2x104 A/cm2 and 1.5x104 A/cm2,the surface of die temperatures are 115℃and 95℃.The bump temperature, the histories of the bump resistance, and mean time to failure (MTTF) testings were conducted. The failure mechanism was observed through SEM and EDS.

From the results of the experiment, the dominant failure mode of the bump is due to electromigration behavior that causes voids at UBM/bump interface (cathode) when the sample’s failure time is shorter. As the failure time is longer, the failure is also resulted from heat effect in addition to electromigration behavior.

目錄……………………………………………………………………. .I
表目錄…………………………………………………………………..IV
圖目錄…………………………………………………………………...V
中文摘要………………………………………………………………...X
英文摘要…………………………………………………………......XI
第一章 緒論…………………………………………………….……….1
1-1 前言………………………………………………..……….……..1
1-2 文獻回顧…………………………………………….……….…….2
1-3 研究動機和目的……………………………………….……….….6
1-4 組織與章節……………………………………………….………..7
第二章 覆晶封裝和電子遷移現象概述………………………………..8
2-1 微電子封裝簡介……………………………………………..…….8
2-2 覆晶封裝技術介紹……………………………………………....10
2-3 電子遷移………………………………………………………....12
2-3-1 電子遷移的概述…………………………………………......12
2-3-2 電子遷移的原理…………………………………………......13
2-3-3 焦耳熱效應………………………………………………......15
2-3-4 平均失效時間……………………………………………......15
2-4 Weibull分佈……………………………………………………...16
2-4-1 Weibull分佈介紹…………………………………………...…16
2-4-2 Weibull參數求法…………………………………………...…18
2-4-3 故障形態的種類…………………………………………......19
2-4-4 Weibull雙參數的物理意義………………………………...…20
第三章 實驗工作…………………………………………………….…25
3-1 實驗規劃………………………………………………………....25
3-2 實驗用試片介紹………………………………………………....26
3-3儀器設備…………………………………………………………...27
3-4 實驗的前置工作………………………………………………....27
3-4-1 試片組裝…………………………………………………......28
3-5 試片通電流實驗………………………………………………....30
3-6 試片失效模式分析……………………………………………....31
第四章 實驗結果與討論…………………………………………….…41
4-1 銲錫凸塊溫度量測結果………………………………………....41
4-2銲錫凸塊和鋁導線電阻的量測和計算………………………...…42
4-3電阻失效歷程…………………………………………………...…44
4-3-1電阻失效歷程的觀察現象描述…………………………….....44
4-3-2電子流方向對於銲錫凸塊失效的影響…………………….....45
4-3-3 電流密度和溫度對於線路失效機率的影響……………......47
4-4 通電流實驗壽命的Weibull分析………………………………...48
4-4-1 電流密度和銲錫凸塊溫度對平均失效時間的影響……......49
4-5 失效分析………………………………………………………....50
4-6計算Black’s Equation參數……………………………………..53
第五章 結論與未來展望…………………………………………….…80
參考文獻………………………………………………………………..82

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