封裝脫層在電子封裝中為常見的現象，因此本研究主要探討在薄型細間距球柵陣列 (Low Profile Fine Pitch Ball Grid Array, LFBGA) 以及塑膠球柵陣列 (Plastic Ball Grid Array, PBGA) 封裝中的複合材料與金屬結合力以及鍵結機制。在LFBGA中，進行物理與化學特性的探討，在物理性質方面，透過掃描式電子顯微鏡觀察表面之粗糙度，並且利用不同粗糙度接合實驗，得知粗糙度與脫層現象之關係。在化性特性探討中，利用接觸角量測表面能，並且透過電漿以及酸洗來清洗材料表面，達到增加表面能以及接合性之效果。再透過EDS得知材料表面成份以及X射線光電子能譜儀來分析表面化合物，最後進行純銅/鎳接合之實驗，並改善脫層現象。在PBGA中，在散熱片之角座與環氧樹酯發生脫層現象，因此透過有限元素法模擬PBGA封裝過程，利用電腦軟體ANSYS進行模型的建立以及模擬。並且改善PBGA散熱片的原始設計，其中在角座部份，把原始形狀改變成倒角的形狀，再透過模擬結果得知新的倒角的設計可以降低應力值。除此之外，改變散熱片肩寬的長度，由模擬結果得知肩寬長度越大，應力值會越小。最後由這兩種因子進行全因子實驗模擬，可以得到散熱片應力最小值。最後由實驗結果得知肩寬大小對於應力值呈現負相關性；且當倒角半徑越大時，應力值也會隨著下降。

Package delamination is a common problem in electronic packaging, and this study focused on the plastic ball grid array (PBGA) and low profile fine pitch ball grid array (LFBGA) package of composite and metal bonding and bonding mechanism to decrease delamination. In the LFBGA process, the physical and chemical properties are discussed; such as the surface roughness was observed via scanning electron microscopy (SEM), and the relationship between roughness and delamination was obtained by different roughness bonding experiment. In the discussion of chemical properties, the surface energy is obtained by measuring the contact angle, and the material surface is cleaned by plasma and acid to enhance the surface energy for a good adhesive properties. In addition, the compositions and compounds of the surface is analyzed through the energy dispersive x-ray spectroscopy (EDS) and x-ray photoelectron spectroscopy (XPS). Finally, the pure copper/nickel bonding experiment was carried out and delamination problem has obviously been improved. In the PBGA process, the delamination between the corner of the heat sink and the epoxy resin is observed, then the PBGA package process was established by using the finite element analysis simulation software ANSYS. In order to improve the heat sink of the original PBGA, the new chamfer design in the corner seat is effective to decrease the stress value. In addition, the simulation results show that the stress value was decreased after increase the length of the shoulder. The results showed that the stress value is inversely proportional to the shoulder width and the chamfer radius.

致謝 i
摘要 ii
Abstract iii
圖目錄 vi
表目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 研究動機 2
1.3 研究目的 3
1.4 論文架構 4
第二章 文獻回顧與相關理論 5
2.1 封裝技術發展 5
2.1.1 DIP封裝 6
2.1.2 BGA封裝 7
2.2 金屬與金屬氧化物於封裝產業 9
2.2.1 氧化銅與脫層之關係 9
2.2.2 金屬銅之親疏水性 9
2.2.3 氧化銅之親疏水性 10
2.3 電漿之文獻回顧 11
2.3.1 電漿基本簡介 11
2.3.2 電漿技術與應用 12
2.4 X射線光電子能譜儀 16
2.4.1 XPS原理 16
2.4.2 XPS分峰 17
第三章 研究方法 19
3.1 實驗架構與流程 19
3.2 實驗試片 21
3.3 量測分析儀器 23
3.3.1 掃描式電子顯微鏡 23
3.3.2 表面粗糙度量測儀 24
3.3.3 電漿儀器 25
3.3.4 接觸角儀器 26
3.3.5 能量色散X射線光譜儀 28
3.3.6 X射線光電子能譜儀 29
3.4 酸洗實驗規劃 30
3.5 純金屬接合實驗規劃 30
3.6 PBGA有限元素分析 30
3.6.1 有限元素模型 31
3.6.2 材料參數與邊界條件 33
3.6.3 環境設定 34
3.7 影響因子與全因子實驗 36
第四章 結果與討論 39
4.1 LFBGA表面形貌結果 39
4.2 LFBGA粗糙度結果 41
4.3 LFBGA接觸角結果 42
4.3.1 電漿後接觸角量測 42
4.3.2 酸洗後接觸角量測 45
4.4 LFBGA EDS分析結果 48
4.5 XPS分析結果 50
4.5.1 LFBGA不同金屬於電漿前後之XPS結果 50
4.5.2 不同電漿於銅試片之XPS結果 56
4.6 LFBGA純金屬與粗糙度接合實驗結果 57
4.7 PBGA模擬之收斂性分析 59
4.8 PBGA模擬結果 60
第五章 結論 64
5.1 總結 64
5.2 未來展望 65
參考文獻 66

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