本文研究重點在探討雷射二極體模組，其光纖套管構裝組件，於考慮焊後殘留應力情形，與承受不同熱疲勞負載（Thermal Cycling）下，其熱應力與光纖位移趨勢的變化。文中利用有限元素分析軟體MARC，配合光纖套管二維平面應變假設下模型，藉由材料參數與溫度的關係，分析焊域在熱循環條件下熱應力導致之殘留應力場的分佈。同時計算套管中光纖位置之焊後位移。並經由不同循環週期探討溫度循環次數與光纖焊後位移變化的趨勢。文中為凸顯殘留應力之重要性，乃分別比較有無考慮殘留應力假設下所計得光纖位移之差別，並與實驗數據進行比較分析。結果顯示，光纖於套管中之焊後位移量主要取決於焊料的材料性質，其中熔點、楊氏模數、熱膨脹係數，與高溫降伏強度，均扮演著極重要的角色。

The effect of residual stress on the post-weld-shift (PWS) of a fiber-solder-ferrule (FSF) under a cyclic thermal load is investigated in this thesis. By using the finite element software MENTAT and MARC, the stress distribution in this model of coupled thermal-elastoplasticity is adopted to solve. The temperature dependent material properties are employed to calculate the residual stresses and the thermal stresses of the solder in the solidification process. The PWS of a fiber and the stress distribution of a solder under different temperature cycles are also investigated in this study. The PWS calculated with and without considering residual stresses are compared with the measured data in this study. Results indicated that the effects of residual stresses introduced in the solder solidification can not be ignored. The temperature dependent material properties, i.e., the melting temperature , Young’s Modulus, coefficient of thermal expansion (CTE) and yield strength at high temperature may affect the residual stress distribution and the PWS of the FSF significantly.

謝誌 i
摘要 ii
英文摘要 iii
目錄 iv
圖目錄 vii
表目錄 xii
符號說明 xiii

第一章 緒論 1
1-1 前言 1
1-2 雷射二極體模組的簡介 5
1-3 文獻回顧 11
1-4 組織與章節 12

第二章 理論導引 13
2-1 前言 13
2-2 MARC套裝軟體系統架構 13
2-2-1 MARC系統簡介 13
2-2-2 MARC資料庫之結構 16
2-2-3 MARC套裝程式之輸入平台 17
2-3 有限元素法分析步驟 19
2-4 問題描述與分析方法 20
2-4-1問題描述 20
2-4-2分析方法 23
2-5 數學式之推導 23
2-5-1力學分析模式 23
2-5-2熱分析模式 26

第三章 數值解析 27
3-1 前言 27
3-2 光纖套管組件的材料尺寸與性質 28
3-3 光纖套管構裝組件焊域熱應力與光纖位移的分析 37
3-3-1 63Sn37Pb錫鉛合金光纖套管焊域之熱應力分析 38
3-3-2 80Au20Sn錫金合金光纖套管有限元素分析數值結果 42
3-4 比較分析 65
3-4-1 63Sn37Pb、80Au20Sn焊料有限元素分析與實驗比較 65
3-4-2 63Sn37Pb錫鉛合金與80Au20Sn錫金合金有限元素分析結果 67
3-4-3 63Sn37Pb錫鉛合金與80Au20Sn錫金合金在有無考慮殘留應力分析結果之比較 69

第四章 結論 72

參考文獻 73

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