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博碩士論文 etd-0712104-161501 詳細資訊
Title page for etd-0712104-161501
論文名稱
Title
圓柱型雷射二極體模組銲後位移量測技術之研究
A Study of Post-Weld-Shift Measurement Technology in Cylindrical-Type Laser Diode Module Packages
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
58
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2004-07-08
繳交日期
Date of Submission
2004-07-12
關鍵字
Keywords
銲後位移量測、橢圓擬合法、對稱中心法、光傳輸模組構裝
SCM (Symmetric Center Method), PWS (Post-Weld-Shift) measurement, TO-Can, EFM (Ellipse Fitting Method)
統計
Statistics
本論文已被瀏覽 5689 次,被下載 1945
The thesis/dissertation has been browsed 5689 times, has been downloaded 1945 times.
中文摘要
本文主要研究圓柱型雷射二極體光傳輸模組的銲後位移量測技術,包括量測在對焦平面上的位移以及二極體雷射光源軸線與光纖中心軸線在角度上的偏差。此量測技術主要目的為量化銲後位移,使整個構裝的過程中能確實了解銲後位移的現象,並且做為雷射搥回技術(Laser Hammering)的參考,以進一步改善模組的光耦合效率。
量測技術的研究發展過程主要應用現有的量測設備Keyence LC-2430 雷射位移計量測工件之外廓以定位光纖。而量測技術的建構主要利用橢圓以及圖形對稱的概念,提出二種量測銲後位移的數學模式和量測方法,分別為橢圓擬合法( Ellipse Fitting Method, EFM )和對稱中心法( Symmetric Center Method, SCM )。藉由自行撰寫模擬程式的方式來探討量測方法本身的位移誤差以及討論量測表面特性與量測誤差之間的關係,例如真圓度對誤差的影響。由模擬結果可知本文所發展出的二種方法之位移誤差約為1nm,小於現有雷射位移計的解晰度20nm ; 而定位誤差與真圓度則呈現線性關係。最後在Newport-LW4000 構裝機台上進行實物量測所計算出來的銲後位移量為3.5µm,而經由掃瞄X方向與Y方向之光耦合功率圖,可估計銲接所造成的位移量在2.9µm~5.9µm 之間,印證了本文所發展出來的量測技術之實用性。
Abstract
The objective of this study is to investigate the technique of the PWS (Post-Weld-Shift) measurement in cylindrical-type laser diode module packaging processes. Including measure the shift in focus plane and the run-out between the axis of laser diode and optical fiber. The objective of this technique is to quantify the PWS in packaging processes. This technique can improve the efficient of the laser hammering technique.
The measurement technique developed in this study employs a laser displacement meter (Keyence LC-2430) to measure the profile and position the upper housing of laser diode module. Using the concepts of ellipse and symmetric figure, the Ellipse Fitting Method (EFM) and the Symmetric Center Method (SCM) are developed. A simulation program is coded for discussing the relationship between the measurement error and the roundness of the optical fiber housing. Finally, these measuring technique are applied on the laser diode module packaging system (Newport-LW4000) to measure the PWS. The experimental measuring data of PWS is 3.5μm, which is reasonable in compare to the estimate alignment offset (2.9μm to 5.9μm) by the coupling efficiency method. Therefore it is believed that the technique developed in this study is feasible and practical.
目次 Table of Contents
謝誌 i
目錄 ii
圖目錄 iv
表目錄 vi
摘要 vii
Abstract viii
第一章 緒論 1
1-1 研究背景 1
1-2 文獻回顧 3
1-3 研究目的與方法 4
1-4 組織與章節說明 6
第二章 量測理論之建構 7
2-1 量測架構 7
2-2 銲後位移之定義 9
2-3 橢圓擬合法 ( Ellipse Fitting Method, EFM ) 13
2-4 對稱中心法 ( Symmetric Center Method, SCM ) 16
第三章 量測理論之模擬與分析 19
3-1 設定工件之外輪廓 19
3-2 模擬與分析過程 27
3-3 橢圓擬合法之模擬與分析 28
3-4 對稱中心法之模擬與分析 37
3-5 橢圓擬合法與對稱中心法之比較 43
第四章 銲後位移量測實驗 44
4-1 實驗過程 44
4-2 實驗數據及結果 46
第五章 結論與建議 50
參考文獻 52
附錄A:雷射位移計詳細規格 53
附錄B:橢圓公式之推導 57
參考文獻 References
[1] K. C. Kao and G. A. Hockham, 1966, “Dielectric-fibre surface waveguides for optical frequencies,” Proceedings of the IEE., Vol. 113(7), pp.1151-1158.
[2] 黃韋凱,2003,2.5-10Gb/s高速蝶式半導體雷射模組銲後位移之研究,碩士論文,國立中山大學光電工程研究所,高雄。
[3] W. H. Cheng, W. H. Wang, Y. M. Huang, H. Y. Chen, and H. H. Lin, 1995, “Failure mechanism of hole formation in laser welding technique for optoelectronic packaging,” Electronic Components and Technology Conference, Proceedings., 45th, pp.914-916.
[4] W. H. Cheng, W. H. Wang, H. Y. Chen, and H. H. Lin, 1995, “Reduction of micromovement in optoelectronic packaging,” Lasers and Electro-Optics Society Annual Meeting Conference Proceedings 8th, Vol.1, pp.248-249.
[5] B. Valk, R. Battig, and O. Anthamatten, 1995, “Laser welding for fiber pig tailing with long-term stability and sub micron accuracy,” Opt. Eng., Vol.34, pp.2675-2682.
[6] M. K. Song, S. G. Kang, N. Hwang, H. T. Lee, S. S. Park, and K. E. Pyun, 1996, “Laser weldability analysis of high-speed optical transmission device packaging,” Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol.19, Issue: 4 , pp.758-763.
[7] S. C. Wang, H. L. Chang, C. Wang, C. M. Wang, and J. W. Liaw, M.T. Sheen, J. H. Kuang, C. P. Chien, G. L. Wang, and W. H. Cheng, 1999, “Post-weld-shift in semiconductor laser packaging,” IEEE Electronic Components and Technology Conference, pp.1159-1163.
[8] P. Mueller and B. Valk, 2000, “Automated fiber attachment for 980 nm pump modules,” Electronic Components and Technology Conference, Proceedings. 50th, pp.5-9.
[9] J. H. Kuang, M. T. Sheen, Z. C. Wang, G. L. Wang, and W. Cheng, 2001, “Post-weld-shift in dual-in-line package,” IEEE Trans. On Advanced Packaging, Vol.24, No.1, pp.81-85.
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