隨著微電子封裝技術日新月異，電子產品為了發展更高的效能且更小、更輕和成本控制等考量，電子封裝之散熱管理成為很重要的課題。在使用電子產品時，由於電力消耗及環境因素，將伴隨著溫度變化，加上微電子封裝體內部材料產生熱膨脹係數不匹配之情形，導致熱應力發生在連接晶片與印刷電路板的錫球上。本研究以ANSYS有限元素軟體模擬球柵陣列 (Ball Grid Array, BGA) 封裝體於溫度循環負載作用下之黏塑性 (Viscoplastic) 行為，並分析錫球接點上之累積應變能密度。接著，將有限元素模型模擬的分析結果，透過實驗設計方法 (Design of Experiment, DoE) 討論錫球之材料參數與結構尺寸的控制因子設計，並利用ANOVA (Analysis of Variance) 變異數分析來討論各個控制因子間的交互影響，最後求得迴歸模型 (Regression Model) 以找出最佳化控制因子。
本研究主要目的在於提供封裝體內部的錫球可靠度改良之實驗設計方法，藉此快速地預測錫球之累積應變能密度及疲勞壽命，並透過錫球材料參數及結構尺寸的最佳化組合，來降低錫球之塑性應變及提高錫球疲勞壽命，對於封裝結構的設計與開發極有助益。

As the microelectronic package develops technologies for fabrication smaller, faster and economical, thermal management play an important role. Temperature variation caused by either environmental changes or power consumption, and the coefficient of thermal expansion (CTE) mismatch between different packages material lead to stress and strain in package assemblies especially in solder joint. This research builds up the viscoplastic finite element model to analyze thermal-mechanical behavior of solder joint under temperature cycling loading. The finite element software ANASYS is used to calculate the accumulative strain energy density of solder joint. Furthermore, a design of experiment (DoE) with factorial analysis is used to investigate the reliability impact of the design parameters, including solder material properties and geometry. Finally, we use the analysis of variance (ANOVA) to obtain the regression model and to find out optimization factors.
The purpose of this research is to provide a quickly experimental design assessment to improve reliability of the solder joint. The assessment model can be used to predict the accumulative strain energy density and fatigue life of the solder joint in terms of cycles to failure. The smaller plastic strain can be achieved through a better combination of material properties and geometry parameters, which is helpful of packaging design before to manufacturing.

目錄
論文審定書 i
誌謝 ii
摘要 iii
ABSTRACT iv
目錄 v
圖目錄 viii
表目錄 x
第一章 緒論 1
1.1 前言 1
1.2 研究背景 2
1.3 研究動機與目的 6
1.4 研究方法 8
1.5 章節提要 8
第二章 文獻回顧 10
2.1 前言 10
2.2 理論分析模型 12
2.3 有限元素分析法 18
2.4 疲勞壽命預測 22
2.4.1 遲滯迴線 (Hysteresis Loop) 24
2.4.2 低週期疲勞 (Low-cycle Fatigue) 25
2.4.3 循環應力應變曲線 (Cyclic Stress-strain Curve) 26
2.4.4 疲勞壽命預測模型 29
2.5 實驗設計方法 37
第三章 有限元素分析與參數設計 42
3.1 問題陳述 42
3.2 研究方法 43
3.3 分析模型之建立 44
3.3.1 相同尺寸晶片堆疊封裝體 45
3.3.2 BGA封裝體 45
3.4 黏塑性分析與彈性-塑性-潛變分析 47
3.4.1 黏塑性分析 48
3.4.2 彈性-塑性-潛變分析 52
3.4.3 溫度負載之設定 53
3.4.4 模擬結果之計算 55
3.5 分析流程與因子規劃 56
3.5.1 控制因子選定 56
3.5.2 實驗設計分析 58
3.5.3 變異數分析 59
第四章 有限元素模擬之結果與討論 60
4.1 相同尺寸晶片堆疊封裝體 60
4.1.1 有限元素模型介紹與設定 60
4.1.2 模擬結果 65
4.2 BGA封裝體 69
4.2.1 有限元素模型介紹與設定 69
4.2.2 BGA模型有限元素分析結果與驗證 74
4.3 彈性-塑性-潛變分析與黏塑性分析結果 80
4.4 總結 87
第五章 實驗設計之結果與討論 88
5.1 初步因子篩選 88
5.2 三水準全因子實驗 89
5.3 變異數分析 90
5.3.1 異常值 (離群值) 之檢查 91
5.3.2 迴歸模式常態性檢查 93
5.3.3 殘差之獨立性檢查 94
5.3.4 殘差之恆常性檢查 96
5.3.5 錫球應變能變異數分析結果 97
5.4 最佳化參數分析 106
5.5 總結 107
第六章 結論與未來展望 108
6.1 結論 108
6.2 貢獻 109
6.3 未來研究方向 110
參考文獻 111
附錄 119

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