Responsive image
博碩士論文 etd-0713104-134316 詳細資訊
Title page for etd-0713104-134316
論文名稱
Title
化學氣相沉積技術運用於平面顯示器腔體之熱流模擬分析
A numerical study for flow and heat transfer in a rectangular chemical vapor deposition chamber
系所名稱
Department
畢業學年期
Year, semester
語文別
Language
學位類別
Degree
頁數
Number of pages
73
研究生
Author
指導教授
Advisor
召集委員
Convenor
口試委員
Advisory Committee
口試日期
Date of Exam
2004-07-06
繳交日期
Date of Submission
2004-07-13
關鍵字
Keywords
化學氣相沉積、腔體、基座
substrate, PHOENICS, CVD, chamber
統計
Statistics
本論文已被瀏覽 5632 次,被下載 2359
The thesis/dissertation has been browsed 5632 times, has been downloaded 2359 times.
中文摘要
本文以套裝軟體PHOENICS模擬化學氣相沉積之長方形腔體的熱流場分佈情形,並以探討熱流場均勻度為主軸。本文以基座固定熱通量與固定溫度兩種模式來探討入口區域、入口至基座距離、出口區域、Re值及Pr值等五個變數對腔體內熱流場均勻度的影響。
研究發現,基座邊緣皆會產生較高剪應力及明顯熱傳現象,此現象不利於均勻度,因此,我們建議欲沉積薄膜的玻璃基板應小於基座。在固定基座熱通量中,入口區域過大容易造成基座邊緣剪應力及熱傳現象提昇,入口區域過小容易造成僅入口下方基座有較高剪應力及熱傳現象,皆不利於均勻度。入口至基座距離的變化也有相似情形。
在固定基座溫度中,基座邊緣的熱傳現象更加明顯,對均勻度影響更大。由探討變數中發現入口區域為0.864*0.72、較低的入口至基座距離、較高腔體倍率、較高的Re數及較高的Pr值可有效提昇Nu值均勻度。
Abstract
A method using CFD code PHOENICS to simulate flow and heat transfer in a rectangular chemical vapor deposition(CVD) chamber. We focus on the uniformity of heat and flow field. Two different kinds of boundary conditions at substrate, uniform wall heat flux and uniform wall temperature, are used to discuss the effects of the region of inlet, the distance from inlet to substrate, the region of outlet, Re number, and Pr number on uniformity of heat and flow field in chamber.
The study finds that high shear stress and high Nu number will happen on the edge of substrate, and they can not improve the heat and flow field uniformity, We suggest that the substrate should be smaller than susceptor. In the case of uniform wall heat flux on substrate, higher shear stress and Nu number on the edge of substrate would result from the condition that the region of inlet is too big. Higher shear stress and Nu number on the region of stagnant point would result from the condition that the region of inlet is too small. Both of them are not good for uniformity. Such kinds of situations also happen in the variable of the distance from inlet to substrate.
In uniform wall temperature on substrate, the condition of much higher Nu number on the edge of substrate is more obvious, which effects uniformity more seriously. The uniformity of Nu number could be improved effectively on the condition of region of inlet is 0.864*0.72, Higher distance from inlet to substrate.
目次 Table of Contents
目錄……………………………………………………………………………..I
圖目錄……………...………………………………………………………III
表目錄…………………………………...…………………………………V
論文摘要(中文)……………………………………………………………VI
論文摘要(英文)……………………………………………………………VII
符號說明…………………………………………………………………VIII

第一章 緒論…………………………………………………………………...1
1-1 前言………………………………………………………………...1
1-2 研究目的與方法…………………………………………………..2
1-2-1 研究目的………………………………………………………2
1-2-2 研究方法………………………………………………………3
1-3 文獻回顧……………………………………………………………3
第二章 理論分析……………………………………………………………8
2-1 基本假設………………………………………………………………8
2-2 統御方程式……………………………………………………………8
2-3 無因次化………………………………………………………………10
第三章 數值方法……………………………………………………………15
3-1 簡述……………………………………………………………………15
3-2 差分方程………………………………………………………………16
3-3 SIMPLER運算法則………………………………………………19
第四章 模擬驗證分析……………………………………………………25
4-1 以統計參數分析………………………………………………………25
4-2 初步模擬結果驗證……………………………………………………25
4-3 全尺寸與四分之一對稱的相互比對…………………………………26
4-4 網格驗證………………………………………………………………26
4-5 物理模型………………………………………………………………27
4-6 變動參數………………………………………………………………28
第五章 模擬結果與討論…………………………………………………38
5-1 以固定基座熱通量進行討論…………………………………………38
5-1-1 腔體入口區域大小對熱流場的影響………………………38
5-1-2 入口至基座距離對熱流場的影響…………………………40
5-1-3 腔體出口區域大小對熱流場的影響………………………41
5-1-4 雷諾數對熱流場的影響…………………………………….42
5-1-5 普朗克數對熱流場的影響…………………………………..43
5-1-6 Nu值之曲線回歸……………………………………………..43
5-2 以固定基座溫度進行討論……………………………………………44
5-2-1 腔體入口區域大小對熱流場的影響………………………44
5-2-2 入口至基座距離對熱流場的影響…………………………44
5-2-3 腔體出口區域大小對熱流場的影響………………………45
5-2-4 雷諾數對熱流場的影響…………………………………….45
5-2-5 普朗克數對熱流場的影響…………………………………..46
5-2-6 Nu值之曲線回歸……………………………………………..46
第六章 結論與建議………………………………………………………68
6-1 結論……………………………………………………………………68
6-2 建議與未來展望………………………………………………………69
第七章 參考文獻……………………………………………………………70
參考文獻 References
[1] Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, Pearson Education, Essex(2001)
[2] D. B. Spalding, PHOENICS 3.4 Documentation, CHAM, London(2001):http://www.cham.co.uk/
[3] H. Moffat and K. Jense, “Complex Flow Pattern in MOCVD Reactors:I. Horizontal Reactors”, J. Cryst. Growth, vol. 77(1986), p. 108.
[4] D. I. Fotiadis, A. M. Kremer, D. R. McKenna, K. F. Jensen, “Complex Flow Phenomena in Vertical MOCVD Reactor: Effects on Deposition Uniformity and Interface Abruptness”, J. Cryst. Growth, vol. 85(1987), p. 154-164
[5] K. F. Jensen, “Transport Phenomena and Chemical Reaction Issues in OMVPE of Compound Semiconductors”, J. Cryst. Growth, vol. 98(1989), p. 148-166
[6] S. Patnaik, R. A. Brown, and C. A. Wang, “Hydrodynamic Dispersion in Rotating-Disk OMVPE Reactors: Numerical Simulation and Experimental Measurements”, J. Cryst. Growth, vol. 96(1989), p. 153-174
[7] D.I. Fotiadis, and S. Kieda. “Transport Phenomena in Vertical Reactors for Metalorganic Vapor Phase Epitaxy: I. Effects of Heat Transfer Characteristics, Reactor Geometry, and Operating Conditions”, J. Cryst. Growth, vol. 102(1990), p. 441-70.

[8] K.F. Jensen, E.O. Einset, and D.I. Fotiadis, “Flow Phenomena in Chemical Vapor Deposition of Thin Films”, Ann. Rev. Fluid Mech., vol. 23(1991), p. 197-232.
[9]M. D. Bentzon, C. Barholm-Hansen, J. Bindslev Hansen, “Interfacial Shear Strength of Diamond-like Carbon Coating Deposited on Metals” Diamond and Related Materials, vol. 4(1995) p. 787-790
[10] S. Amirhaghi, H. S. Reehal, R. J. K. Wood, D. W. Wheeler, “Diamond Coating on Tungsten Carbide and Their Erosive Wear Properties”, Surface and Coating Technology, vol. 135(2001) p. 126-138
[11] W. Y. Chung, D. H. Kim, Y. S. Cho, “Modelling of Cu Thin Film Growth by MOCVD Process in a Vertical Reactor”, J. Cryst. Growth, vol. 180(1997), p. 691-697
[12] Ziba Nami et al., “Reactor Design Considerations for MOCVD Growth of Thin Films”, IEEE Trans. On Semi. Manufacturing, vol. 10, No. 2, MAY 1997.
[13] W. K. Cho, D.H. Choi, and M.-U. Kim, “Optimization of Inlet Concentration Profile for Uniform Deposition in a Cylindrical Chemical Vapor Deposition Chamber”, Int. J. Heat Mass Transfer, vol. 42(1999), p. 1141-1146.
[14] W.K. Cho, D.H. Choi, and M.-U. Kim, “Optimization of the Inlet Velocity Profile for Uniform Epitaxial Growth in a Vertical Metalorganic Chemical Vapor Deposition Reactor”, Int. J. Heat Mass Transfer, vol. 42(1999), p. 4143-4152.
[15] T. Otto, H. Wolf, R. Streiter, A. Dehoff, K. Wandel, and T. Gessner, “Process and Equipment Simulation of Dry Silicon Etching in the Absence of Ion Bombardment”, Microelectronic Engineering, vol. 45(1999), p. 377-391
[16] huang-Chuang Tsai, Quanyuan Shang, Takehara T., Harshbarger W., and Law K., “Advanced PECVD Technology for Manufacturing AM LCDs”, Information Display, 1999. ASID '99. Proceedings of the 5th Asian Symposium on , 17-19 March 1999 p. 267-271
[17] H. Van Santen, C. R. Kleijn, and Harry E.A. Van Den Akker, “On Turbulent Flows in Cold-Wall CVD Reactors”, J. Cryst. Growth, vol. 212(2000), p. 299-310.
[18] S. V. Patankar, “Numerical Heat Transfer and Fluid Flow”, McGRAW-HILL, New York(1980).
[19] S. V. Patankar and D. B. Spalding, “A Calculation Procedure for Heat, Mass and Momentum Transfer in Three-Dimensional Parabolic Flows”, Int. J. Heat Mass Transfer, vol. 15(1972), p. 1787.
[20] S. V. Patankar, “A Calculation Procedure for Two Dimensional Elliptic Situations”, Numerical Heat Transfer, vol. 2(1979).
[21] Alan H. Kvanli, Robert J. Pavur, and C. Stephen Guynes, “Interoduction to Business Statistics”, South-Western College Publishing, 2000
[22] 莊達人, VLSI製造技術, 高立圖書有限公司, 2000
[23] 王啟明, 化學氣象沉積之熱流場分析, 國立中山大學機械與機電工程研究所碩士論文, 2001
[24] 鄭偉鳴, 垂直式CVD反應器內薄膜成長之參數探討, 國立中山大學機械與機電工程研究所碩士論文, 2002
[25] 李鴻傑, 有機金屬化學氣相沉積出口效應之數值模擬, 國立中山大學機械與機電工程研究所碩士論文, 2002
[26] Hong Xiao, 羅正忠, 張鼎張, 半導體製程技術導論, 學銘圖書有限公司, 2003
電子全文 Fulltext
本電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。
論文使用權限 Thesis access permission:校內校外完全公開 unrestricted
開放時間 Available:
校內 Campus: 已公開 available
校外 Off-campus: 已公開 available


紙本論文 Printed copies
紙本論文的公開資訊在102學年度以後相對較為完整。如果需要查詢101學年度以前的紙本論文公開資訊,請聯繫圖資處紙本論文服務櫃台。如有不便之處敬請見諒。
開放時間 available 已公開 available

QR Code